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    Housings for implantable medical devices and methods for forming housings
    4.
    发明授权
    Housings for implantable medical devices and methods for forming housings 有权
    用于植入式医疗装置的壳体和用于形成壳体的方法

    公开(公告)号：US08718774B2

    公开(公告)日：2014-05-06

    申请号：US12708059

    申请日：2010-02-18

    申请人： Michael A. Knipfer ,  John M. Edgell ,  Robbie L. Halvorson ,  Lawrence D. Swanson

    发明人： Michael A. Knipfer ,  John M. Edgell ,  Robbie L. Halvorson ,  Lawrence D. Swanson

    IPC分类号： A61N1/375

    CPC分类号： A61N1/3968 ,  A61N1/362 ,  A61N1/375 ,  Y10T29/49826

    摘要： Described herein is an implantable medical device and methods for making a device that includes a metal housing a molding process. In one embodiment, the housing includes a header attachment element extends from the housing. In another embodiment, the implantable medical device includes a header attachment surface comprising one or more header retaining features configured to secure a connector header to the header attachment surface. In another embodiment, the housing includes one or more structural elements extending from and integrally molded with the interior surface of the first or second portions of the housing. Also disclosed are methods of making the implantable medical device.

    摘要翻译： 本文描述了可植入医疗装置和用于制造包括金属壳体模制工艺的装置的方法。 在一个实施例中，壳体包括从壳体延伸的头部连接元件。 在另一个实施例中，可植入医疗装置包括头部附接表面，该头部附接表面包括一个或多个头部保持特征，其被配置为将连接头固定到头部附接表面。 在另一个实施例中，壳体包括从壳体的第一或第二部分的内表面延伸并与其一体模制的一个或多个结构元件。 还公开了制造可植入医疗装置的方法。

    Feedthrough system for implantable device components
    5.
    发明授权
    Feedthrough system for implantable device components 有权
    用于植入式装置部件的馈通系统

    公开(公告)号：US08612003B2

    公开(公告)日：2013-12-17

    申请号：US13028532

    申请日：2011-02-16

    申请人： Lawrence D. Swanson ,  John M. Edgell ,  John E. Hansen

    发明人： Lawrence D. Swanson ,  John M. Edgell ,  John E. Hansen

    IPC分类号： A61N1/375

    CPC分类号： H01R43/16 ,  A61N1/375 ,  A61N1/3758 ,  A61N1/3968 ,  Y10T29/49002 ,  Y10T29/49208

    摘要： The present subject matter provides feedthrough or interconnect systems for components of an implantable medical device and methods for their manufacture. A feedthrough system includes a wire or nailhead having a protruded tip. The wire or nailhead extends from an aperture in an encasement of a first component and is connected to a terminal conductor adapted to electrically connect to circuitry within the encasement. A ribbon wire has a distal end adapted to electrically connect to a second component and a proximal end having a pattern adapted to fit to the protruded tip of the wire or nailhead to provide for subsequent attachment of the ribbon wire to the nailhead.

    摘要翻译： 本主题为可植入医疗装置的部件提供馈通或互连系统及其制造方法。 馈通系统包括具有突出尖端的线或钉头。 电线或钉头从第一部件的外壳中的孔延伸并且连接到适于电连接到外壳内的电路的端子导体。 带状线具有适于电连接到第二部件的远端，并且近端具有适于配合到线或钉头的突出尖端的图案，以提供随后将带状丝线附接到钉头。

    Cantilevered spring contact for an implantable medical device
    6.
    发明授权
    Cantilevered spring contact for an implantable medical device 有权
    用于植入式医疗设备的悬臂弹簧触点

    公开(公告)号：US08784143B2

    公开(公告)日：2014-07-22

    申请号：US13435271

    申请日：2012-03-30

    申请人： John M. Edgell ,  David M. Flynn ,  John E. Hansen ,  Michael J. Kloosterboer ,  Lawrence D. Swanson

    发明人： John M. Edgell ,  David M. Flynn ,  John E. Hansen ,  Michael J. Kloosterboer ,  Lawrence D. Swanson

    IPC分类号： H01R13/187

    CPC分类号： A61N1/3752

    摘要： Some examples of an electrical contact spring for an implantable medical device includes a housing, rigid and tubular in shape, defining a housing passage extending along a longitudinal axis, from a proximal portion including a proximal lip that defines a proximal opening, to a distal portion including a distal lip that defines a distal opening and a spring disposed in the housing, the spring tubular in shape and defining a spring passage concentric to the housing passage, the spring including: a distal ring portion disposed adjacent the distal portion of the housing and physically coupled to the housing, a plurality of spring elements coupled to and extending from the distal ring portion toward the proximal portion of the housing and a proximal ring portion disposed adjacent the proximal portion of the housing, cantilevered and suspended inside of and spaced apart from the housing by the plurality of spring elements.

    摘要翻译： 用于可植入医疗装置的电接触弹簧的一些示例包括刚性和管状形状的壳体，其限定沿着纵向轴线延伸的壳体通道，从包括限定近端开口的近侧唇部的近端部分延伸到远端部分 包括限定远侧开口的远端唇缘和设置在所述壳体中的弹簧，所述弹簧管形状并且限定与所述壳体通道同心的弹簧通道，所述弹簧包括：邻近所述壳体的远端部分设置的远端环部分， 物理耦合到壳体，多个弹簧元件，其耦合到远端环部分并且朝向壳体的近端部分延伸并且邻近壳体的近端部分设置的近端环部分，其悬臂并悬挂在壳体的近侧部分内并与其间隔开 壳体由多个弹簧元件组成。

    Side mount feedthrough system for sealed components
    10.
    发明授权
    Side mount feedthrough system for sealed components 有权
    用于密封组件的侧装式馈通系统

    公开(公告)号：US08954150B2

    公开(公告)日：2015-02-10

    申请号：US12878406

    申请日：2010-09-09

    申请人： Lawrence D. Swanson ,  John M. Edgell ,  Nick A. Youker ,  John E. Hansen ,  David A. Chizek

    发明人： Lawrence D. Swanson ,  John M. Edgell ,  Nick A. Youker ,  John E. Hansen ,  David A. Chizek

    IPC分类号： A61N1/372 ,  A61N1/375

    CPC分类号： A61N1/3754 ,  A61N1/3758 ,  Y10T29/49002

    摘要： The present subject matter provides apparatus and methods for manufacturing an encasement for a component of an implantable medical device having a main circuit board. The method includes forming an encasement aperture on a lateral side of the encasement. The lateral side of the encasement is adapted to be placed substantially parallel to a surface of the main circuit board. A feedthrough assembly is connected through the encasement aperture. The feedthrough assembly includes at least one terminal conductor at least partially passing through the encasement aperture.

    摘要翻译： 本主题提供了用于制造具有主电路板的可植入医疗装置的部件的装置的装置和方法。 该方法包括在外壳的外侧上形成包围孔。 外壳的侧面适于基本上平行于主电路板的表面放置。 馈通组件通过封装孔连接。 馈通组件包括至少一个端部导体，至少部分穿过封装孔。