Flexible magnetron including partial rolling support and centering pins
    1.
    发明申请
    Flexible magnetron including partial rolling support and centering pins 审中-公开
    柔性磁控管包括部分滚动支撑和定心销

    公开(公告)号:US20070151841A1

    公开(公告)日:2007-07-05

    申请号:US11601576

    申请日:2006-11-17

    IPC分类号: C23C14/32 C23C14/00

    摘要: A magnetron scanning and support mechanism in which the magnetron is partially supported from an overhead scanning mechanism through multiple springs coupled to different horizontal locations on the magnetron and partially supported from below at multiple locations on the target, on which it slides or rolls. In one embodiment, the yoke plate is continuous and uniform. In another embodiment, the magnetron's magnetic yoke is divided into two flexible yokes, for example, of complementary serpentine shape and each supporting magnets of respective polarity. In another embodiment, the target and magnetron are divided into respective strips separated by other structure. Each magnetron strip is supported partially from above from a common scanning plate and partially on a respective target strip. A centering mechanism may align the different magnetron strips.

    摘要翻译: 一种磁控管扫描和支撑机构,其中磁控管通过耦合到磁控管上的不同水平位置的多个弹簧部分地从顶部扫描机构支撑,并且在靶上的多个位置处从其下方部分地支撑,在其上滑动或滚动。 在一个实施例中,轭板是连续且均匀的。 在另一个实施例中,磁控管的磁轭被分成两个柔性轭,例如互补的蛇形形状和各个极性的每个支撑磁体。 在另一个实施例中,靶和磁控管被分成由其它结构分开的相应条。 每个磁控管从上面部分地从普通扫描板支撑并部分地支撑在相应的目标条上。 定心机构可以对准不同的磁控管条。

    Apparatus and method of positioning a multizone magnetron assembly
    2.
    发明申请
    Apparatus and method of positioning a multizone magnetron assembly 有权
    定位多区域磁控管组件的装置和方法

    公开(公告)号:US20070051617A1

    公开(公告)日:2007-03-08

    申请号:US11301849

    申请日:2005-12-12

    IPC分类号: C23C14/32 C23C14/00

    CPC分类号: H01J37/3408 H01J37/3455

    摘要: The present invention generally provides an apparatus and method for processing a surface of a substrate in a PVD chamber that has a magnetron assembly whose shape can be distorted to adjust the magnetic field strength in the processing region of the deposition chamber to improve the deposition uniformity. In general, aspects of the present invention can be used for flat panel display processing, semiconductor processing, solar cell processing, or any other substrate processing. In one aspect, the processing chamber contains one or more magnetron regions and magnetron actuators that are used to increase and more evenly distribute the magnetic field strength throughout the processing region of the processing chamber during processing.

    摘要翻译: 本发明总体上提供了一种用于处理PVD室中的基板的表面的装置和方法,该PVD腔具有可以变形形状的磁控管组件,以调节沉积室的处理区域中的磁场强度,以提高沉积均匀性。 通常,本发明的各方面可用于平板显示处理,半导体处理,太阳能电池处理或任何其它基板处理。 在一个方面,处理室包含一个或多个磁控管区域和磁控管致动器,其用于在处理期间增加并均匀地分布整个处理室的处理区域的磁场强度。

    Reactive sputtering chamber with gas distribution tubes
    3.
    发明申请
    Reactive sputtering chamber with gas distribution tubes 审中-公开
    带气体分配管的反应溅射室

    公开(公告)号:US20070235320A1

    公开(公告)日:2007-10-11

    申请号:US11399233

    申请日:2006-04-06

    IPC分类号: C23C14/32 C23C14/00

    摘要: A sputtering apparatus for processing large area substrates is provided. By introducing gas across the entire target surface, a uniform composition film may be formed on the substrate. When the gas is introduced merely at the perimeter, the gas distribution is not uniform. By providing a gas introduction tube across the processing area, the reactive gas will uniformly distribute to the whole target. Also, providing the gas tube with multiple inner tubes provides a quick, effective gas dispersion capability.

    摘要翻译: 提供了一种用于处理大面积基板的溅射装置。 通过在整个靶表面上引入气体,可以在衬底上形成均匀的组成膜。 当气体仅在周边引入时,气体分布不均匀。 通过在处理区域内设置气体导入管,反应气体将均匀地分布到整个靶材上。 此外,为气体管提供多个内管提供了快速有效的气体分散能力。

    MAGNETRON SPUTTERING SYSTEM FOR LARGE-AREA SUBSTRATES HAVING REMOVABLE ANODES
    4.
    发明申请
    MAGNETRON SPUTTERING SYSTEM FOR LARGE-AREA SUBSTRATES HAVING REMOVABLE ANODES 审中-公开
    具有可拆卸阳极的大面积基底的MAGNETRON溅射系统

    公开(公告)号:US20070084720A1

    公开(公告)日:2007-04-19

    申请号:US11610772

    申请日:2006-12-14

    IPC分类号: C23C14/00

    CPC分类号: H01J37/3408 H01J37/3438

    摘要: The present invention generally provides an apparatus and method for processing a surface of a substrate in physical vapor deposition (PVD) chamber that has an increased anode surface area to improve the deposition uniformity on large area substrates. In general, aspects of the present invention can be used for flat panel display processing, semiconductor processing, solar cell processing, or any other substrate processing. In one aspect, the processing chamber contains one or more anode assemblies that are used to increase and more evenly distribute the anode surface area throughout the processing region of the processing chamber. In one aspect, the anode assembly contains a conductive member and conductive member support. In one aspect, the processing chamber is adapted to allow the conductive member to be removed from the processing chamber without removing any major components from the processing chamber.

    摘要翻译: 本发明通常提供一种用于处理物理气相沉积(PVD)室中的衬底的表面的装置和方法,其具有增加的阳极表面积以改善大面积衬底上的沉积均匀性。 通常,本发明的各方面可用于平板显示处理,半导体处理,太阳能电池处理或任何其它基板处理。 在一个方面,处理室包含一个或多个阳极组件,其用于增加并且更均匀地分布整个处理室的整个处理区域中的阳极表面区域。 在一个方面,阳极组件包含导电构件和导电构件支撑件。 在一个方面,处理室适于允许导电构件从处理室移除,而不会从处理室中移除任何主要部件。

    Magnetron sputtering system for large-area substrates
    5.
    发明申请
    Magnetron sputtering system for large-area substrates 审中-公开
    用于大面积衬底的磁控溅射系统

    公开(公告)号:US20070012558A1

    公开(公告)日:2007-01-18

    申请号:US11182034

    申请日:2005-07-13

    IPC分类号: C23C14/32 C23C14/00

    摘要: The present invention generally provides an apparatus and method for processing a surface of a substrate in physical vapor deposition (PVD) chamber that has an increased anode surface area to improve the deposition uniformity on large area substrates. In general, aspects of the present invention can be used for flat panel display processing, semiconductor processing, solar cell processing, or any other substrate processing. In one aspect, the processing chamber contains one or more adjustable anode assemblies that are used to increase and more evenly distribute the anode surface area throughout the processing region of the processing chamber. In one aspect, the one or more adjustable anode assemblies are adapted to exchange deposited on anode surfaces with new, un-deposited on, anode surfaces without breaking vacuum. In another aspect, a shadow frame that has a path to ground is adapted to contact a deposited layer on the surface of a substrate during deposition to increase the anode area and thus deposition uniformity.

    摘要翻译: 本发明通常提供一种用于处理物理气相沉积(PVD)室中的衬底的表面的装置和方法,其具有增加的阳极表面积以改善大面积衬底上的沉积均匀性。 通常,本发明的各方面可用于平板显示处理,半导体处理,太阳能电池处理或任何其它基板处理。 在一个方面,处理室包含一个或多个可调阳极组件,其用于增加并且更均匀地分布整个处理室的整个处理区域中的阳极表面区域。 在一个方面,一个或多个可调节阳极组件适于在不破坏真空的情况下交换沉积在阳极表面上的新的未沉积的阳极表面。 在另一方面,具有到地的路径的阴影框架适于在沉积期间接触衬底的表面上的沉积层以增加阳极区域并因此沉积均匀性。

    Method of improving magnetron sputtering of large-area substrates using a removable anode
    6.
    发明申请
    Method of improving magnetron sputtering of large-area substrates using a removable anode 审中-公开
    使用可移除阳极改进大面积基板的磁控管溅射的方法

    公开(公告)号:US20070012559A1

    公开(公告)日:2007-01-18

    申请号:US11247438

    申请日:2005-10-11

    IPC分类号: C23C14/32

    摘要: The present invention generally provides an apparatus and method for processing a surface of a substrate in physical vapor deposition (PVD) chamber that has an increased anode surface area to improve the deposition uniformity on large area substrates. In general, aspects of the present invention can be used for flat panel display processing, semiconductor processing, solar cell processing, or any other substrate processing. In one aspect, the processing chamber contains one or more anode assemblies that are used to increase and more evenly distribute the anode surface area throughout the processing region of the processing chamber. In one aspect, the anode assembly contains a conductive member and conductive member support. In one aspect, the processing chamber is adapted to allow the conductive member to be removed from the processing chamber without removing any major components from the processing chamber.

    摘要翻译: 本发明通常提供一种用于处理物理气相沉积(PVD)室中的衬底的表面的装置和方法,其具有增加的阳极表面积以改善大面积衬底上的沉积均匀性。 通常,本发明的各方面可用于平板显示处理,半导体处理,太阳能电池处理或任何其它基板处理。 在一个方面,处理室包含一个或多个阳极组件,其用于增加并且更均匀地分布整个处理室的整个处理区域中的阳极表面区域。 在一个方面,阳极组件包含导电构件和导电构件支撑件。 在一个方面,处理室适于允许导电构件从处理室移除,而不会从处理室中移除任何主要部件。

    Partially suspended rolling magnetron
    7.
    发明申请
    Partially suspended rolling magnetron 有权
    部分悬浮磁控管

    公开(公告)号:US20070193881A1

    公开(公告)日:2007-08-23

    申请号:US11347667

    申请日:2006-02-03

    IPC分类号: C23C14/00

    摘要: A magnetron scanning and support mechanism in which the magnetron is partially supported from an overhead scanning mechanism through multiple springs coupled to different horizontal locations on the magnetron and partially supported from below at multiple locations on the target, on which it slides or rolls. In one embodiment, the yoke plate is continuous and uniform. In another embodiment, the magnetron's magnetic yoke is divided into two flexible yokes, for example, of complementary serpentine shape and each supporting magnets of respective polarity. The yokes separated by a gap sufficiently small that the two yokes are magnetically coupled. Each yoke has its own set of spring supports from above and rolling/sliding supports from below to allow the magnetron shape to conform to that of the target. Alternatively, narrow slots are formed in a unitary yoke.

    摘要翻译: 一种磁控管扫描和支撑机构,其中磁控管通过耦合到磁控管上的不同水平位置的多个弹簧部分地从顶部扫描机构支撑,并且在其上滑动或滚动的靶上的多个位置处从下方部分支撑。 在一个实施例中,轭板是连续且均匀的。 在另一个实施例中,磁控管的磁轭被分成两个柔性轭,例如互补的蛇形形状和各个极性的每个支撑磁体。 磁轭分开足够小的间隙,使得两个磁轭磁耦合。 每个轭具有其自己的一组弹簧支撑件,从上方起滚动/滑动支撑件,从而允许磁控管形状与靶材的形状一致。 或者,窄槽形成为单一轭。

    Large-area magnetron sputtering chamber with individually controlled sputtering zones
    8.
    发明申请
    Large-area magnetron sputtering chamber with individually controlled sputtering zones 审中-公开
    具有单独控制溅射区的大面积磁控溅射室

    公开(公告)号:US20070056850A1

    公开(公告)日:2007-03-15

    申请号:US11225922

    申请日:2005-09-13

    IPC分类号: C23C14/00

    CPC分类号: C23C14/352 C23C14/3407

    摘要: The present invention generally provides an apparatus for processing a surface of a substrate in a physical vapor deposition (PVD) chamber that has a sputtering target that has separately biasable sections, regions or zones to improve the deposition uniformity. In general, aspects of the present invention can be used for flat panel display processing, semiconductor processing, solar cell processing, or any other substrate processing. In one aspect, each of the target sections of the multizone target assembly are biased at a different cathodic biases by use of one or more DC or RF power sources. In one aspect, each of the target sections of the multizone target assembly are biased at a different cathodic biases by use of one power source and one or more resistive, capacitive and/or inductive elements. In one aspect, the processing chamber contains a multizone target assembly that has one or more ports that are adapted deliver a processing gas to the processing region of the PVD chamber. In one aspect, the processing chamber contains a multizone target assembly that has one or more magnetron assemblies positioned adjacent to one or more of the target sections.

    摘要翻译: 本发明总体上提供了一种用于处理物理气相沉积(PVD)室中的衬底的表面的设备,其具有具有可分离的偏压部分,区域或区域以提高沉积均匀性的溅射靶。 通常,本发明的各方面可用于平板显示处理,半导体处理,太阳能电池处理或任何其它基板处理。 在一个方面,通过使用一个或多个DC或RF电源将多区域目标组件的每个目标区段偏置在不同的阴极偏压。 在一个方面,通过使用一个电源和一个或多个电阻,电容和/或电感元件,多区域目标组件的每个目标部分被偏置在不同的阴极偏压。 在一个方面,处理室包含一个多区域目标组件,其具有适于将处理气体输送到PVD室的处理区域的一个或多个端口。 在一个方面,处理室包含一个多区域目标组件,其具有邻近一个或多个目标区段定位的一个或多个磁控管组件。

    Method of processing a substrate using a large-area magnetron sputtering chamber with individually controlled sputtering zones
    9.
    发明申请
    Method of processing a substrate using a large-area magnetron sputtering chamber with individually controlled sputtering zones 审中-公开
    使用具有单独控制的溅射区域的大面积磁控溅射室来处理衬底的方法

    公开(公告)号:US20070056843A1

    公开(公告)日:2007-03-15

    申请号:US11225923

    申请日:2005-09-13

    IPC分类号: C23C14/32

    CPC分类号: C23C14/3407 C23C14/352

    摘要: The present invention generally provides a method for processing a surface of a substrate in a physical vapor deposition (PVD) chamber that has a sputtering target that has separately biasable sections, regions or zones to improve the deposition uniformity. In general, aspects of the present invention can be used for flat panel display processing, semiconductor processing, solar cell processing, or any other substrate processing. In one aspect, each of the target sections of the multizone target assembly are biased at a different cathodic biases by use of one or more DC or RF power sources. In one aspect, each of the target sections of the multizone target assembly are biased at a different cathodic biases by use of one power source and one or more resistive, capacitive and/or inductive elements. In one aspect, the processing chamber contains a multizone target assembly that has one or more ports that are adapted deliver a processing gas to the processing region of the PVD chamber. In one aspect, the processing chamber contains a multizone target assembly that has one or more magnetron assemblies positioned adjacent to one or more of the target sections.

    摘要翻译: 本发明通常提供了一种用于处理物理气相沉积(PVD)室中的衬底的表面的方法,所述物理气相沉积(PVD)室具有分离的偏压部分,区域或区域以提高沉积均匀性的溅射靶。 通常,本发明的各方面可用于平板显示处理,半导体处理,太阳能电池处理或任何其它基板处理。 在一个方面,通过使用一个或多个DC或RF电源将多区域目标组件的每个目标区段偏置在不同的阴极偏压。 在一个方面,通过使用一个电源和一个或多个电阻,电容和/或电感元件,多区域目标组件的每个目标部分被偏置在不同的阴极偏压。 在一个方面,处理室包含一个多区域目标组件,其具有适于将处理气体输送到PVD室的处理区域的一个或多个端口。 在一个方面,处理室包含一个多区域目标组件,其具有邻近一个或多个目标区段定位的一个或多个磁控管组件。