公开(公告)号：US06805541B1

公开(公告)日：2004-10-19

申请号：US09503170

申请日：2000-02-14

申请人： Kenji Hashimoto

发明人： Kenji Hashimoto

IPC分类号： H01L2156

CPC分类号： H01L23/3157 ,  H01L21/56 ,  H01L23/3114 ,  H01L23/49572 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099

摘要： A semiconductor device is retained on a retaining section. A mask is set on the semiconductor device and has an opening at which part of the semiconductor device is exposed. An extruding section is moved by a first drive section over an opening in the mask and, during this movement, extrudes a fluidizing resin into the opening in the mask. A squeegee is moved by a second drive section over the opening in the mask to allow a movement of the fluidizing resin present over the opening which is extruded into the opening from an extruding section and a removal of any excessive resin from the plane of the opening.

摘要翻译： 半导体器件保持在保持部分上。 掩模设置在半导体器件上，并且具有露出半导体器件的一部分的开口。 挤压部分由第一驱动部分移动到掩模上的开口上，并且在该移动期间，将流化树脂挤出到掩模中的开口中。 刮板通过第二驱动部分移动到面罩中的开口上方，以允许存在于从挤出部分挤出到开口中的开口上的流化树脂的运动和从开口的平面去除任何过量的树脂 。

公开(公告)号：US06297069B1

公开(公告)日：2001-10-02

申请号：US09239469

申请日：1999-01-28

申请人： Pierino Italo Zappella ,  William Richard Fewer

发明人： Pierino Italo Zappella ,  William Richard Fewer

IPC分类号： H01L2156

CPC分类号： B81C1/00896

摘要： A method is provided for supporting the mechanical members of a micro-electronic substrate during the manufacture of the substrate into a micro-mechanical or micro-electromechanical device. The method provides supporting material that surrounds the various mechanical members of the micro-electronic substrate and stabilizes these mechanical members during manufacture. The method also facilitates precise photolithographic as well as other microfabrication techniques. Specifically, the method provides support material that surrounds the perimeter of the micro-electronic substrate and that has a surface that is coplanar with one surface of the micro-electronic substrate. Photoresist or other materials can then be deposited, such as by spinning, on the surface of the micro-electronic substrate such that the edges of the photoresist or other materials lie upon the supporting material. By placing the outer edges of the photoresist or other material on the surface of the support material, the surface of the micro-electronic substrate remains planar for subsequent photolithographic or other microfabrication procedures. An intermediate micro-electronic device assembly is also provided in which a mechanical member, such as a membrane, is supported by the supporting material.

摘要翻译： 提供了一种用于在将基板制造成微机电或微机电装置期间将微电子基板的机械构件支撑的方法。 该方法提供围绕微电子基板的各种机械构件的支撑材料，并且在制造期间使这些机械构件稳定。 该方法还有助于精确的光刻以及其他微细加工技术。 具体地，该方法提供围绕微电子基板的周边并且具有与微电子基板的一个表面共面的表面的支撑材料。 然后可以将光致抗蚀剂或其它材料例如通过旋转沉积在微电子基板的表面上，使得光致抗蚀剂或其它材料的边缘位于支撑材料上。 通过将光致抗蚀剂或其他材料的外边缘放置在支撑材料的表面上，微电子基板的表面保持平面以用于随后的光刻或其它微细加工步骤。 还提供了一种中间微电子器件组件，其中诸如膜的机械构件由支撑材料支撑。

公开(公告)号：US06573652B1

公开(公告)日：2003-06-03

申请号：US09553187

申请日：2000-04-20

申请人： Gordon Lee Graff ,  Peter Maclyn Martin ,  Mark Edward Gross ,  Ming Kun Shi ,  Michael Gene Hall ,  Eric Sidney Mast

发明人： Gordon Lee Graff ,  Peter Maclyn Martin ,  Mark Edward Gross ,  Ming Kun Shi ,  Michael Gene Hall ,  Eric Sidney Mast

IPC分类号： H01L2156

CPC分类号： H01M2/08 ,  G02F2001/133337 ,  H01L23/562 ,  H01L51/5253 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/00

摘要： An encapsulated display device. The device includes a substrate, an environmentally sensitive display device adjacent to the substrate, and at least one first barrier stack adjacent to the environmentally sensitive display device. The barrier stack encapsulates the environmentally sensitive display device. It includes at least one first barrier layer and at least one first polymer layer. The encapsulated display device optionally includes at least one second barrier stack located between the substrate and the environmentally sensitive display device. The second barrier stack includes at least one second barrier layer and at least one second polymer layer. A method for making an encapsulated display device is also disclosed.

摘要翻译： 封装的显示设备。 该装置包括基板，与基板相邻的对环境敏感的显示装置以及与环境敏感的显示装置相邻的至少一个第一屏障堆叠。 屏障堆叠封装环境敏感的显示设备。 它包括至少一个第一阻挡层和至少一个第一聚合物层。 封装的显示装置可选地包括位于基板和环境敏感显示装置之间的至少一个第二势垒堆叠。 第二阻挡层包括至少一个第二阻挡层和至少一个第二聚合物层。 还公开了一种制造封装的显示装置的方法。

公开(公告)号：US06423560B1

公开(公告)日：2002-07-23

申请号：US09693383

申请日：2000-10-20

申请人： John A. Trezza ,  Gregory K. Duddoff

发明人： John A. Trezza ,  Gregory K. Duddoff

IPC分类号： H01L2156

CPC分类号： H01S5/0262 ,  H01L21/30621 ,  H01L25/167 ,  H01L33/0062 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05572 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01S5/0217 ,  H01S5/0224 ,  H01S5/02272 ,  H01S5/183 ,  H01S5/209 ,  H01S5/423 ,  H01S2301/176 ,  H01L2924/00

摘要： This invention provides a method for making interdigitated optoelectronic devices in which the surfaces of the photonic devices, emitters and detectors, are protected from contaminants during processing through the use of multiple etch stop layers.

摘要翻译： 本发明提供了一种用于制造交错光电器件的方法，其中光子器件，发射器和检测器的表面在处理期间通过使用多个蚀刻停止层而被保护免受污染物的影响。

公开(公告)号：US06800507B2

公开(公告)日：2004-10-05

申请号：US10325908

申请日：2002-12-23

申请人： Takahiro Kasuga ,  Seiichi Tomihara ,  Kazuo Tasaka

发明人： Takahiro Kasuga ,  Seiichi Tomihara ,  Kazuo Tasaka

IPC分类号： H01L2156

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/10162 ,  H01L2924/181 ,  H05K3/3426 ,  H05K3/3442 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： Upon the manufacture of a non-leaded type semiconductor device having an encapsulater, and a gate cured resin and air vent cured resins which remain as a result of the exposure of leads and tub-suspension leads to a mounting surface of the encapsulater and the formation of the encapsulater, a groove through which a resin flows is not provided over the full circumference of a cavity defined in a mold die for forming the encapsulater. A gate and air vents are provided outside an area in which no groove is defined. The flow of the resin between the cavity and each of the gate and air vents is made through a gap or space defined between each of the adjacent leads and each tub-suspension lead. If the leads and the tub-suspension leads are cut at a groove-free place, then the occurrence of resin waste and a resin crack can be restrained because the gate cured resin and the air vent cured resins have their surfaces which are flat and level with the leads and the tub-suspension leads.

摘要翻译： 在制造具有封装剂的非铅型半导体器件以及由固化树脂和通气口固化的树脂时，由于引线和槽 - 悬浮液引线暴露于密封剂的安装表面和地层 封装器的树脂流动的槽不设置在限定在用于形成封装器的模具中的空腔的整个圆周上。 门和通风口设置在没有限定槽的区域之外。 通过在每个相邻引线和每个桶 - 悬挂引线之间限定的间隙或空间来形成腔和每个闸门和通风口之间的树脂流动。 如果在无槽的地方切割引线和水槽悬挂引线，则可以抑制树脂废料和树脂裂纹的发生，因为浇口固化树脂和通风口固化树脂的表面是平坦的和水平的 引线和浴缸悬挂导线。

公开(公告)号：US06781248B2

公开(公告)日：2004-08-24

申请号：US09916197

申请日：2001-07-27

申请人： Chong Chin Hui ,  Lee Kian Chai ,  Jason Pittam

发明人： Chong Chin Hui ,  Lee Kian Chai ,  Jason Pittam

IPC分类号： H01L2156

CPC分类号： H01L23/3128 ,  H01L21/56 ,  H01L23/13 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for packaging semiconductor device assemblies. An assembly is formed which includes a semiconductor die, a tape positioned over the active surface of the die, and a substrate element positioned on an opposite side of the tape from the die. Bond pads of the die are exposed through a slot formed through the tape and an aligned opening formed through the substrate element facilitate the extension of intermediate conductive elements from the bond pads and through the slot and opening, to corresponding contact areas on the substrate element. One or both ends of the slot extend beyond an outer periphery of the die to facilitate introduction of an encapsulant material into a channel or receptacles defined by the slot, opening, and active surface of the semiconductor die. Prior to encapsulation, the side of the opening of the substrate element is sealed opposite the tape with a coverlay to contain the encapsulant material within the channel or receptacle. Assemblies and packages formed by the method are also disclosed.

摘要翻译： 一种用于封装半导体器件组件的方法。 形成了一个组件，其包括半导体管芯，位于管芯的有效表面上的带以及位于与管芯相反的带的另一侧上的衬底元件。 管芯的接合焊盘通过穿过带形成的槽暴露，并且通过衬底元件形成的对准的开口促进中间导电元件从接合焊盘的延伸，并且通过槽和开口延伸到衬底元件上的对应的接触区域。 槽的一端或两端延伸超过管芯的外周，以便于将密封剂材料引入由半导体管芯的槽，开口和有源表面限定的通道或插座中。 在封装之前，衬底元件的开口侧面用带有覆盖层的带密封，以将密封剂材料容纳在通道或容器内。 还公开了通过该方法形成的组件和封装。

公开(公告)号：US06548329B1

公开(公告)日：2003-04-15

申请号：US09561870

申请日：2000-05-01

申请人： Richard Joseph Saia ,  Kevin Matthew Durocher ,  James Wilson Rose

发明人： Richard Joseph Saia ,  Kevin Matthew Durocher ,  James Wilson Rose

IPC分类号： H01L2156

CPC分类号： H01L23/49894 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A hard layer of amorphous hydrogenated carbon (DLC) overlies a polymer film structure and a plurality of soft layers of DLC alternate with a plurality of hard layers of DLC over the barrier base to form a corrosion resistant structure. The polymer film structure and a circuit chip can be elements of a circuit module. The DLC and the polymer film structure can have vias extending to contact pads, and a pattern of electrical conductors can extend through the vias to the contact pads. In one embodiment the DLC forms a hermetic (and therefore corrosion resistant) seal over the polymer film structure.

摘要翻译： 无定形氢化碳（DLC）的硬层覆盖聚合物膜结构，并且DLC的多个软层与阻挡基底上的多个DLC硬层交替以形成耐腐蚀结构。 聚合物膜结构和电路芯片可以是电路模块的元件。 DLC和聚合物膜结构可以具有延伸到接触焊盘的通孔，并且电导体的图案可以延伸穿过通孔到接触焊盘。 在一个实施方案中，DLC在聚合物膜结构上形成密封（因此是耐腐蚀的）密封。

公开(公告)号：US06315540B1

公开(公告)日：2001-11-13

申请号：US09680915

申请日：2000-10-06

申请人： Hisayuki Tsuruta

发明人： Hisayuki Tsuruta

IPC分类号： H01L2156

CPC分类号： H01L24/97 ,  B29C45/14655 ,  B29C45/2669 ,  B29C45/2708 ,  H01L21/565 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A molding die used for concurrently packaging semiconductor chips in a large piece of synthetic resin has a cavity rectangular in cross section and having two long peripheral lines and two short peripheral lines for accommodating a circuit panel where the semiconductor chips are mounted, melted synthetic resin is supplied through a gate extending along one of the long peripheral lines to the cavity so that the melted synthetic resin smoothly flows over the cavity, and the smooth flow prevents the molded product from voids and a wire weep.

摘要翻译： 用于在大片合成树脂中同时封装半导体芯片的成型模具具有矩形横截面的空腔，并且具有两条长的外围线和两条短的外围线，用于容纳安装半导体芯片的电路板，熔融的合成树脂为 通过沿着长周边线之一延伸到空腔的门提供，使得熔融的合成树脂平滑地流过空腔，并且平滑流动防止模制产品的空隙和电线被弄湿。

公开(公告)号：US06746886B2

公开(公告)日：2004-06-08

申请号：US10101669

申请日：2002-03-18

申请人： Walter M. Duncan ,  Simon Joshua Jacobs ,  Michael R. Douglass ,  Richard O. Gale

发明人： Walter M. Duncan ,  Simon Joshua Jacobs ,  Michael R. Douglass ,  Richard O. Gale

IPC分类号： H01L2156

CPC分类号： G02B1/14 ,  B81B7/0012 ,  B81B2201/042 ,  G02B1/105 ,  G02B26/0833 ,  G03B27/42 ,  G03F7/70291 ,  G03F7/70983

摘要： A process for protecting a MEMS device used in a UV illuminated application from damage due to a photochemical activation between the UV flux and package gas constituents, formed from the out-gassing of various lubricants and passivants put in the device package to prevent sticking of the MEMS device's moving parts. This process coats the exposed surfaces of the MEMS device and package's optical window surfaces with a metal-halide film to eliminate this photochemical activation and therefore significantly extend the reliability and lifetime of the MEMS device.

摘要翻译： 用于保护在紫外线照射应用中使用的MEMS器件的过程不会由于UV通量和封装气体成分之间的光化学活化而损坏，所述UV通量和封装气体成分由放置在器件封装中的各种润滑剂和钝化剂的排出物形成，以防止粘附 MEMS器件的运动部件。 该方法用金属卤化物膜涂覆MEMS器件和封装的光学窗表面的暴露表面以消除该光化学活化，因此显着地延长了MEMS器件的可靠性和使用寿命。

公开(公告)号：US06649450B2

公开(公告)日：2003-11-18

申请号：US10022653

申请日：2001-12-18

申请人： Georg Ernst ,  Horst Gröninger ,  Thomas Zeiler

发明人： Georg Ernst ,  Horst Gröninger ,  Thomas Zeiler

IPC分类号： H01L2156

CPC分类号： H01L21/56 ,  H01L23/3107 ,  H01L2924/0002 ,  H01L2924/00

摘要： A circuit is described which has a semiconductor component surrounded by a plastic housing and with which contact can be made via conductor tracks. Between each dividing surface of the conductor tracks and an area of the plastic housing surrounding the relevant dividing surface, as viewed in plan view of the dividing surface, a spacing is provided in each case.

摘要翻译： 描述了一种电路，其具有由塑料外壳包围的半导体部件，并且可以通过导体轨迹与其接触。 在导体轨道的每个分隔表面和围绕相关分隔表面的塑料壳体的区域之间，如在分隔表面的平面图中所示，在每种情况下都设置间隔。