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1.发明申请公开(公告)号：US20150072196A1
公开(公告)日：2015-03-12
申请号：US14230737
申请日：2014-03-31
Applicant: Johnson Controls Technology Company
Inventor： Edward J. Soleski , Richard M. DeKeuster , Brian L. Thieme , Ronald J. Dulle , Mikhail S. Balk
CPC classification number: H01M2/22 , B60L1/003 , B60L1/02 , B60L1/14 , B60L3/0046 , B60L3/12 , B60L11/123 , B60L11/14 , B60L11/1803 , B60L11/1851 , B60L11/1861 , B60L11/1864 , B60L11/1874 , B60L11/1877 , B60L11/1879 , B60L15/20 , B60L2210/10 , B60L2210/40 , B60L2240/34 , B60L2240/545 , B60L2240/547 , B60L2240/549 , B60L2250/10 , B60L2260/26 , B60L2270/20 , B60R16/03 , B60R16/033 , G01R31/025 , G01R31/362 , G01R31/3627 , H01H47/325 , H01M2/1077 , H01M2/1205 , H01M2/1211 , H01M2/1252 , H01M2/20 , H01M2/206 , H01M2/24 , H01M2/305 , H01M2/32 , H01M2/34 , H01M2/342 , H01M4/661 , H01M4/665 , H01M10/04 , H01M10/0413 , H01M10/058 , H01M10/425 , H01M10/4257 , H01M10/482 , H01M10/486 , H01M10/6551 , H01M2010/4271 , H01M2010/4278 , H01M2200/103 , H01M2220/20 , H01M2250/20 , H01R12/716 , H02H7/18 , H02J7/0021 , H02J7/0063 , H05K1/0262 , H05K1/0263 , H05K1/18 , H05K3/32 , H05K2201/10492 , H05K2201/1053 , H05K2201/10545 , Y02T10/6217 , Y02T10/645 , Y02T10/7005 , Y02T10/7016 , Y02T10/7044 , Y02T10/705 , Y02T10/7061 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y02T10/7275 , Y10T29/49108 , Y10T29/4911 , Y10T29/49114
Abstract: A printed circuit board (PCB) assembly may include a PCB and a high current interconnect mounted on the PCB. The high current interconnect may be configured to electrically couple a first high current bladed component, a second high current bladed component, and a trace disposed on the PCB. The high current interconnect may include feet made of a conductive material that are coupled to the PCB. The trace may be coupled to the feet via a weld.
Abstract translation: 印刷电路板（PCB）组件可以包括PCB和安装在PCB上的高电流互连。 高电流互连可以被配置为电耦合第一高电流叶片部件，第二高电流叶片部件和布置在PCB上的迹线。 高电流互连可以包括由与PCB连接的导电材料制成的脚。 迹线可以通过焊缝连接到脚部。
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