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    Techniques to manage collaborative documents
    1.
    发明授权
    Techniques to manage collaborative documents 有权
    管理协作文件的技巧

    公开(公告)号：US09053079B2

    公开(公告)日：2015-06-09

    申请号：US13316763

    申请日：2011-12-12

    申请人： Jonathan Bailor ,  Matthew Wood ,  Brian Marshall

    发明人： Jonathan Bailor ,  Matthew Wood ,  Brian Marshall

    IPC分类号： G06F17/22 ,  G06F9/34 ,  G06F17/24

    CPC分类号： G06F11/1446 ,  G06F11/1464 ,  G06F17/2288 ,  G06F17/24 ,  G06F17/241 ,  G06F17/30011 ,  G06F17/30575 ,  G06F2201/84

    摘要： Techniques to manage collaborative documents are described. An application program may comprise a document render component to render a first document instance of a collaborative document, a document share component to receive a document update list comprising a set of change records for a second document instance of the collaborative document, and modify properties of one or more constructs for the first document instance based on the change records to form a merged document instance of the collaborative document, and an undo manager component to manage a local undo stack for the first document instance, the local undo stack comprising a set of undo records, and determine whether to preserve one or more of the undo records of the local undo stack after formation of the merged document instance based on one or more of the change records. Other embodiments are described and claimed.

    摘要翻译： 描述管理协作文档的技术。 应用程序可以包括用于呈现协作文档的第一文档实例的文档呈现组件，用于接收文档更新列表的文档共享组件，所述文档更新列表包括协作文档的第二文档实例的一组改变记录，并且修改 基于所述改变记录的所述第一文档实例的一个或多个构造，以形成所述协作文档的合并文档实例;以及撤销管理器组件，用于管理所述第一文档实例的本地撤消堆栈，所述本地撤销堆栈包括一组 撤消记录，并根据一个或多个更改记录，确定是否在形成合并文档实例之后保留本地撤消堆栈的一个或多个撤销记录。 描述和要求保护其他实施例。

    XML FILE FORMAT OPTIMIZED FOR EFFICIENT ATOMIC ACCESS
    2.
    发明申请
    XML FILE FORMAT OPTIMIZED FOR EFFICIENT ATOMIC ACCESS 审中-公开
    用于有效的原子访问优化的XML文件格式

    公开(公告)号：US20130218930A1

    公开(公告)日：2013-08-22

    申请号：US13400344

    申请日：2012-02-20

    申请人： Matthew Wood ,  Jonathan Bailor ,  Robert Little ,  Brian Marshall ,  Andrew Smith

    发明人： Matthew Wood ,  Jonathan Bailor ,  Robert Little ,  Brian Marshall ,  Andrew Smith

    IPC分类号： G06F17/30

    CPC分类号： G06F16/13

    摘要： Systems and methods are disclosed that provide a flexible file capable of storing rich content. A flexible file may include a section object, one or more tile objects stored within the section object, and one or more clip objects associated with each tile object. A clip objects may store a content item. Alternatively a clip object may store one or more references to a content item, the content item being stored externally to the flexible file. The disclosed flexible file allows an application to adjust the atomicity based upon the needs of a user or application.

    摘要翻译： 公开了提供能够存储丰富内容的灵活文件的系统和方法。 柔性文件可以包括段对象，存储在段对象内的一个或多个瓦片对象以及与每个瓦片对象相关联的一个或多个剪辑对象。 剪辑对象可以存储内容项。 或者，剪辑对象可以存储对内容项的一个或多个引用，所述内容项被外部存储到所述灵活文件。 所公开的灵活文件允许应用程序根据用户或应用程序的需要调整原子性。

    TECHNIQUES TO MANAGE COLLABORATIVE DOCUMENTS
    3.
    发明申请
    TECHNIQUES TO MANAGE COLLABORATIVE DOCUMENTS 有权

    公开(公告)号：US20130151940A1

    公开(公告)日：2013-06-13

    申请号：US13316763

    申请日：2011-12-12

    申请人： Jonathan Bailor ,  Matthew Wood ,  Brian Marshall

    发明人： Jonathan Bailor ,  Matthew Wood ,  Brian Marshall

    IPC分类号： G06F17/00

    CPC分类号： G06F11/1446 ,  G06F11/1464 ,  G06F17/2288 ,  G06F17/24 ,  G06F17/241 ,  G06F17/30011 ,  G06F17/30575 ,  G06F2201/84

    摘要： Techniques to manage collaborative documents are described. An application program may comprise a document render component to render a first document instance of a collaborative document, a document share component to receive a document update list comprising a set of change records for a second document instance of the collaborative document, and modify properties of one or more constructs for the first document instance based on the change records to form a merged document instance of the collaborative document, and an undo manager component to manage a local undo stack for the first document instance, the local undo stack comprising a set of undo records, and determine whether to preserve one or more of the undo records of the local undo stack after formation of the merged document instance based on one or more of the change records. Other embodiments are described and claimed.

    Methods for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
    5.
    发明授权
    Methods for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates 有权
    分析和控制微电子基板机械和化学机械平面化性能参数的方法

    公开(公告)号：US07182668B2

    公开(公告)日：2007-02-27

    申请号：US11301575

    申请日：2005-12-13

    申请人： Brian Marshall

    发明人： Brian Marshall

    IPC分类号： B24B49/00 ,  B24B51/00

    CPC分类号： B24B37/20 ,  B24B37/04 ,  B24B37/11 ,  B24B49/10 ,  B24B49/16 ,  B24B57/02

    摘要： Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or chemical-mechanical planarization includes a table, a planarizing pad on the table, a carrier assembly, and an array of force sensors embedded in at least one of the planarizing pad, a sub-pad under the planarizing pad, or the table. The force sensor array can include shear and/or normal force sensors, and can be configured in a grid pattern, concentric pattern, radial pattern, or a combination thereof. Analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates includes removing material from the microelectronic substrate by pressing the substrate against a planarizing surface, determining a force distribution exerted against the substrate by sensing a plurality of forces at a plurality of discrete nodes as the substrate rubs against the planarizing surface, and controlling a planarizing parameter of a planarizing cycle according to the determined force distribution. A planarizing pad or sub-pad for mechanical or chemical-mechanical planarization in accordance with an embodiment of the invention can include a body having a plurality of raised portions and a plurality of low regions between the raised portions, and a plurality of force sensors embedded in the body at locations relative to the raised portions. Positioning the sensors relative to the raised portion can isolate shear and/or normal forces exerted against the pad by the microelectronic substrate during planarization.

    摘要翻译： 用于分析和控制微电子基板平面化性能参数的方法和装置。 在一个实施例中，用于机械或化学机械平面化的平面化机器包括工作台，工作台上的平面化焊盘，载体组件和嵌入在平坦化焊盘中的至少一个中的力传感器阵列， 平坦化垫或桌子。 力传感器阵列可以包括剪切和/或法向力传感器，并且可以被配置成格栅图案，同心图案，径向图案或其组合。 分析和控制微电子衬底的机械和化学机械平面化中的性能参数包括通过将衬底压靠在平坦化表面上来从微电子衬底移除材料，通过感测多个离散的多个力来确定施加于衬底上的力分布 作为基板的节点与平坦化表面摩擦，并且根据确定的力分布来控制平坦化循环的平坦化参数。 根据本发明的实施例的用于机械或化学机械平面化的平坦化焊盘或子焊盘可以包括具有多个凸起部分和在凸起部分之间的多个低区域的主体，以及嵌入的多个力传感器 在相对于凸起部分的位置处的主体。 相对于凸起部分定位传感器可以隔离在平坦化期间由微电子衬底施加在衬垫上的剪切力和/或法向力。

    Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
    6.
    发明申请
    Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates 有权

    公开(公告)号：US20060160470A1

    公开(公告)日：2006-07-20

    申请号：US11301575

    申请日：2005-12-13

    申请人： Brian Marshall

    发明人： Brian Marshall

    IPC分类号： B24B49/00

    CPC分类号： B24B37/20 ,  B24B37/04 ,  B24B37/11 ,  B24B49/10 ,  B24B49/16 ,  B24B57/02

    摘要： Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or chemical-mechanical planarization includes a table, a planarizing pad on the table, a carrier assembly, and an array of force sensors embedded in at least one of the planarizing pad, a sub-pad under the planarizing pad, or the table. The force sensor array can include shear and/or normal force sensors, and can be configured in a grid pattern, concentric pattern, radial pattern, or a combination thereof. Analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates includes removing material from the microelectronic substrate by pressing the substrate against a planarizing surface, determining a force distribution exerted against the substrate by sensing a plurality of forces at a plurality of discrete nodes as the substrate rubs against the planarizing surface, and controlling a planarizing parameter of a planarizing cycle according to the determined force distribution. A planarizing pad or sub-pad for mechanical or chemical-mechanical planarization in accordance with an embodiment of the invention can include a body having a plurality of raised portions and a plurality of low regions between the raised portions, and a plurality of force sensors embedded in the body at locations relative to the raised portions. Positioning the sensors relative to the raised portion can isolate shear and/or normal forces exerted against the pad by the microelectronic substrate during planarization.

    Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
    7.
    发明授权
    Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates 失效
    用于分析和控制微电子基板的机械和化学机械平面化性能参数的方法和装置

    公开(公告)号：US06974364B2

    公开(公告)日：2005-12-13

    申请号：US10334424

    申请日：2002-12-31

    申请人： Brian Marshall

    发明人： Brian Marshall

    IPC分类号： B24B37/04 ,  B24B49/10 ,  B24B49/16 ,  B24B57/02 ,  B24D13/14 ,  B24B49/00 ,  B24B51/00

    CPC分类号： B24B37/20 ,  B24B37/04 ,  B24B37/11 ,  B24B49/10 ,  B24B49/16 ,  B24B57/02

    摘要： Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or chemical-mechanical planarization includes a table, a planarizing pad on the table, a carrier assembly, and an array of force sensors embedded in at least one of the planarizing pad, a sub-pad under the planarizing pad, or the table. The force sensor array can include shear and/or normal force sensors, and can be configured in a grid pattern, concentric pattern, radial pattern, or a combination thereof. Analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates includes removing material from the microelectronic substrate by pressing the substrate against a planarizing surface, determining a force distribution exerted against the substrate by sensing a plurality of forces at a plurality of discrete nodes as the substrate rubs against the planarizing surface, and controlling a planarizing parameter of a planarizing cycle according to the determined force distribution. A planarizing pad or sub-pad for mechanical or chemical-mechanical planarization in accordance with an embodiment of the invention can include a body having a plurality of raised portions and a plurality of low regions between the raised portions, and a plurality of force sensors embedded in the body at locations relative to the raised portions. Positioning the sensors relative to the raised portion can isolate shear and/or normal forces exerted against the pad by the microelectronic substrate during planarization.

    摘要翻译： 用于分析和控制微电子基板平面化性能参数的方法和装置。 在一个实施例中，用于机械或化学机械平面化的平面化机器包括工作台，工作台上的平面化焊盘，载体组件和嵌入在平坦化焊盘中的至少一个中的力传感器阵列， 平坦化垫或桌子。 力传感器阵列可以包括剪切和/或法向力传感器，并且可以被配置成格栅图案，同心图案，径向图案或其组合。 分析和控制微电子衬底的机械和化学机械平面化中的性能参数包括通过将衬底压靠在平坦化表面上来从微电子衬底移除材料，通过感测多个离散的多个力来确定施加于衬底上的力分布 作为基板的节点与平坦化表面摩擦，并且根据确定的力分布来控制平坦化循环的平坦化参数。 根据本发明的实施例的用于机械或化学机械平面化的平坦化焊盘或子焊盘可以包括具有多个凸起部分和在凸起部分之间的多个低区域的主体，以及嵌入的多个力传感器 在相对于凸起部分的位置处的主体。 相对于凸起部分定位传感器可以隔离在平坦化期间由微电子衬底施加在衬垫上的剪切力和/或法向力。

    Weft presenter mechanisms
    8.
    发明授权
    Weft presenter mechanisms 失效
    纬向导演机制

    公开(公告)号：US4191222A

    公开(公告)日：1980-03-04

    申请号：US881938

    申请日：1978-02-28

    申请人： Brian Marshall

    发明人： Brian Marshall

    IPC分类号： D03D47/38

    CPC分类号： D03D47/38

    摘要： A weft presenting mechanism for use with looms having a stationary weft supply in which individual weft yarns are selectively moved into position to be picked up by the weft inserting mechanism and inserted into a warp shed. The device includes a plurality of weft presenting fingers and a drive means, all pivoted about a common axis.

    摘要翻译： 一种纬纱提供机构，用于具有固定纬纱供应的织机，其中单个纬纱选择性地移动到由纬纱插入机构拾取并插入经纱梭口中的位置。 该装置包括多个纬纱提指指和一个驱动装置，全部绕公共轴线枢转。

    Incremental Layout Analysis
    9.
    发明申请
    Incremental Layout Analysis 审中-公开
    增量布局分析

    公开(公告)号：US20120047479A1

    公开(公告)日：2012-02-23

    申请号：US12530453

    申请日：2008-03-09

    申请人： James M. Paris ,  Brian Marshall ,  John G. Ferguson ,  Anant S. Adke

    发明人： James M. Paris ,  Brian Marshall ,  John G. Ferguson ,  Anant S. Adke

    IPC分类号： G06F17/50

    CPC分类号： G06F17/5081 ,  G06F16/00

    摘要： Techniques for incrementally analyzing layout design data are disclose. With various implementations, a subsequent incremental analysis can be made for only portions of layout design data, using a subset of available analysis criteria, or some combination of both. For example, the analysis can be limited to errors identified in a previous analysis process, to changes in the layout design data made after a previous analysis process, to particular areas specified by a designer, or some combination thereof. Still further, the analysis process may be performed using only a subset of analysis criteria relevant to the portions of the design data being analyzed, a subset of the initial analysis criteria that the design data failed in a previous analysis process, a subset of the initial analysis criteria selected by the designer, or some combination thereof. Further, such an incremental analysis process can be initiated before a previous analysis process has completed.

    摘要翻译： 披露了逐步分析布图设计数据的技术。 通过各种实现，可以使用可用分析标准的子集或两者的某种组合对布局设计数据的仅部分进行后续增量分析。 例如，分析可以限于在先前的分析过程中识别的错误，在先前分析过程之后进行的布局设计数据的变化，到由设计者指定的特定区域或其某种组合。 此外，分析过程可以仅使用与正在分析的设计数据的部分相关的分析标准的子集来执行，初始分析标准的子集在设计数据在先前的分析过程中失败，初始化的子集 由设计者选择的分析标准，或其某些组合。 此外，可以在先前的分析过程完成之前启动这种增量分析过程。