Multi-layer highly reflective ohmic contacts for semiconductor devices
    1.
    发明授权
    Multi-layer highly reflective ohmic contacts for semiconductor devices 有权
    用于半导体器件的多层高反射欧姆接触

    公开(公告)号:US06992334B1

    公开(公告)日:2006-01-31

    申请号:US09469652

    申请日:1999-12-22

    IPC分类号: H01L33/00

    CPC分类号: H01L33/405

    摘要: A high performance, highly reflective ohmic contact, in the visible spectrum (400 nm–750 nm), has the following multi-layer metal profile. A uniform and thin ohmic contact material is deposited and optionally alloyed to the semiconductor surface. A thick reflector layer selected from a group that includes Al, Cu, Au, Rh, Pd, Ag and any multi-layer combinations is deposited over the ohmic contact material.

    摘要翻译: 在可见光谱(400nm-750nm)中的高性能,高反射欧姆接触具有以下多层金属分布。 均匀且薄的欧姆接触材料被沉积并任选地与半导体表面合金化。 选自包括Al,Cu,Au,Rh,Pd,Ag以及任何多层组合的组的厚反射层沉积在欧姆接触材料上。