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    ELECTROLYTE FOR ELECTRO-CHEMICAL MACHINING OF METAL PRODUCT
    1.
    发明申请
    ELECTROLYTE FOR ELECTRO-CHEMICAL MACHINING OF METAL PRODUCT 审中-公开
    电解液用于金属产品的电化学加工

    公开(公告)号：US20090139875A1

    公开(公告)日：2009-06-04

    申请号：US12245181

    申请日：2008-10-03

    申请人： Jong Yun KIM ,  Seoung Jae Lee ,  Bae Kyun Kim ,  Young Tae Kim ,  Mi Jin Choi

    发明人： Jong Yun KIM ,  Seoung Jae Lee ,  Bae Kyun Kim ,  Young Tae Kim ,  Mi Jin Choi

    IPC分类号： C25F3/02

    CPC分类号： B23H3/08 ,  C25F3/02

    摘要： Disclosed is an electrolyte for electrochemical machining of a metal product, which can reduce a defect of an electro-chemical machining product, increase a lifespan of an electrolyte and an electrode, and improve efficiency of the electrochemical machining. The electrolyte includes an inorganic salt and at least one of a complexing agent and a reducing agent in a solvent.

    摘要翻译： 公开了用于电化学加工金属产品的电解质，其可以减少电化学加工产品的缺陷，增加电解质和电极的寿命，并提高电化学加工的效率。 电解质包括无机盐和溶剂中的络合剂和还原剂中的至少一种。

    Solid electrolytic capacitor and method of manufacturing the same
    2.
    发明授权
    Solid electrolytic capacitor and method of manufacturing the same 有权
    固体电解电容器及其制造方法

    公开(公告)号：US07969710B2

    公开(公告)日：2011-06-28

    申请号：US12007195

    申请日：2008-01-08

    申请人： Hee Sung Choi ,  Seoung Jae Lee ,  Yeoung Jin Lee ,  Sung Han Won ,  Ha Yong Jung ,  Hyun Ho Shin ,  Jung Tae Park ,  Jae Youn Jeong

    发明人： Hee Sung Choi ,  Seoung Jae Lee ,  Yeoung Jin Lee ,  Sung Han Won ,  Ha Yong Jung ,  Hyun Ho Shin ,  Jung Tae Park ,  Jae Youn Jeong

    IPC分类号： H01G4/228 ,  H01G9/04 ,  H01G9/10 ,  H05K5/03

    CPC分类号： H01G9/15 ,  H01G2/065 ,  H01G9/012 ,  H01G9/10 ,  Y10T29/417 ,  Y10T29/435

    摘要： Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one side is inserted into the capacitor element and the other side projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; an anode lead frame fixed to the side of the capacitor element, where the anode wire projects outward, and having an insertion portion into which the projecting end of the anode wire is inserted; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire, the outer surface of the anode lead frame, and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire and the anode lead frame; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of the conductive bumps.

    摘要翻译： 提供一种包括具有正极性的电容器元件的固体电解电容器; 阳极线一侧插入电容器元件，另一侧从电容器元件向外突出; 形成在所述电容器元件上的阴极引出层; 形成在阴极提取层上的多个导电凸块; 阳极引线框架固定在电容器元件的侧面，其中阳极线向外伸出，并且具有插入阳极线的突出端插入其中的插入部分; 形成为围绕电容器元件并暴露阳极线的突出端，阳极引线框架的外表面和导电凸块的端部的模制部分; 阳极引线端子，设置在模制部分上，以便电连接到阳极引线和阳极引线框架的暴露端; 以及阴极引线端子，设置在模制部分上以与导电凸块的暴露端电连接。

    SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME 有权
    固体电解电容器及其制造方法

    公开(公告)号：US20100115746A1

    公开(公告)日：2010-05-13

    申请号：US12689866

    申请日：2010-01-19

    申请人： Hee Sung CHOI ,  Seoung Jae Lee ,  Yeoung Jin Lee ,  Sung Han Won ,  Ha Yong Jung ,  Hyun Ho Shin ,  Jung Tae Park ,  Jae Youn Jeong

    发明人： Hee Sung CHOI ,  Seoung Jae Lee ,  Yeoung Jin Lee ,  Sung Han Won ,  Ha Yong Jung ,  Hyun Ho Shin ,  Jung Tae Park ,  Jae Youn Jeong

    IPC分类号： H01G9/15

    CPC分类号： H01G9/15 ,  H01G2/065 ,  H01G9/012 ,  H01G9/10 ,  Y10T29/417 ,  Y10T29/435

    摘要： Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one side is inserted into the capacitor element and the other side projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; an anode lead frame fixed to the side of the capacitor element, where the anode wire projects outward, and having an insertion portion into which the projecting end of the anode wire is inserted; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire, the outer surface of the anode lead frame, and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire and the anode lead frame; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of the conductive bumps.

    摘要翻译： 提供一种包括具有正极性的电容器元件的固体电解电容器; 阳极线一侧插入电容器元件，另一侧从电容器元件向外突出; 形成在所述电容器元件上的阴极引出层; 形成在阴极提取层上的多个导电凸块; 阳极引线框架固定在电容器元件的侧面，其中阳极线向外伸出，并且具有插入阳极线的突出端插入其中的插入部分; 形成为围绕电容器元件并暴露阳极线的突出端，阳极引线框架的外表面和导电凸块的端部的模制部分; 阳极引线端子，设置在模制部分上，以便电连接到阳极引线和阳极引线框架的暴露端; 以及阴极引线端子，设置在模制部分上以与导电凸块的暴露端电连接。

    Solid electrolytic capacitor and method of manufacturing the same
    4.
    发明申请
    Solid electrolytic capacitor and method of manufacturing the same 有权
    固体电解电容器及其制造方法

    公开(公告)号：US20090154068A1

    公开(公告)日：2009-06-18

    申请号：US12007195

    申请日：2008-01-08

    申请人： Hee Sung Choi ,  Seoung Jae Lee ,  Yeoung Jin Lee ,  Sung Han Won ,  Ha Yong Jung ,  Hyun Ho Shin ,  Jung Tae Park ,  Jae Youn Jeong

    发明人： Hee Sung Choi ,  Seoung Jae Lee ,  Yeoung Jin Lee ,  Sung Han Won ,  Ha Yong Jung ,  Hyun Ho Shin ,  Jung Tae Park ,  Jae Youn Jeong

    IPC分类号： H01G9/04 ,  H01G7/00

    CPC分类号： H01G9/15 ,  H01G2/065 ,  H01G9/012 ,  H01G9/10 ,  Y10T29/417 ,  Y10T29/435

    摘要： Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one side is inserted into the capacitor element and the other side projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; an anode lead frame fixed to the side of the capacitor element, where the anode wire projects outward, and having an insertion portion into which the projecting end of the anode wire is inserted; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire, the outer surface of the anode lead frame, and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire and the anode lead frame; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of the conductive bumps.

    摘要翻译： 提供一种包括具有正极性的电容器元件的固体电解电容器; 阳极线一侧插入电容器元件，另一侧从电容器元件向外突出; 形成在所述电容器元件上的阴极引出层; 形成在阴极提取层上的多个导电凸块; 阳极引线框架固定在电容器元件的侧面，其中阳极线向外伸出，并且具有插入阳极线的突出端插入其中的插入部分; 形成为围绕电容器元件并暴露阳极线的突出端，阳极引线框架的外表面和导电凸块的端部的模制部分; 阳极引线端子，设置在模制部分上，以便电连接到阳极引线和阳极引线框架的暴露端; 以及阴极引线端子，设置在模制部分上以与导电凸块的暴露端电连接。

    Solid electrolytic capacitor and method of manufacturing the same
    5.
    发明授权
    Solid electrolytic capacitor and method of manufacturing the same 有权
    固体电解电容器及其制造方法

    公开(公告)号：US07619875B2

    公开(公告)日：2009-11-17

    申请号：US12007191

    申请日：2008-01-08

    申请人： Hee Sung Choi ,  Seoung Jae Lee ,  Yeoung Jin Lee ,  Sung Han Won ,  Ha Yong Jung ,  Hyun Ho Shin ,  Jung Tae Park ,  Jae Youn Jeong

    发明人： Hee Sung Choi ,  Seoung Jae Lee ,  Yeoung Jin Lee ,  Sung Han Won ,  Ha Yong Jung ,  Hyun Ho Shin ,  Jung Tae Park ,  Jae Youn Jeong

    IPC分类号： H01G4/228 ,  H01G9/00

    CPC分类号： H01G9/012 ,  H01G2/065 ,  H01G9/10 ,  H01G9/15 ,  Y10T29/417

    摘要： Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire inserted and connected to a lower portion of the capacitor element; a cathode extraction layer formed on the capacitor element; an anode lead frame provided on one side of the lower surface of the capacitor element so as to be electrically insulated from the cathode extraction layer, the anode lead frame having an insertion portion into which a projecting lower portion of the anode wire is inserted; a cathode lead frame provided on the other side of the lower surface of the capacitor element so as to be electrically connected to the cathode extraction layer; a molding portion formed to surround the capacitor element and exposing the lower end surface of the anode wire, the lower surface of the anode lead frame, and the lower surface of the cathode lead frame; an anode lead terminal provided on the molding portion so as to be electrically connected to the lower end surface of the anode wire and the lower surface of the anode lead frame; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the lower surface of the cathode lead frame.

    摘要翻译： 提供一种包括具有正极性的电容器元件的固体电解电容器; 阳极线插入并连接到电容器元件的下部; 形成在所述电容器元件上的阴极引出层; 阳极引线框架，其设置在所述电容器元件的下表面的一侧，以与所述阴极引出层电绝缘，所述阳极引线框架具有插入部分，所述阳极引线的突出下部插入所述插入部分; 阴极引线框，设置在所述电容器元件的下表面的另一侧，以电连接到所述阴极提取层; 形成为围绕电容器元件并暴露阳极引线的下端表面，阳极引线框架的下表面和阴极引线框架的下表面的模制部分; 阳极引线端子，设置在成型部上，以与阳极引线的下端面和阳极引线框架的下表面电连接; 以及阴极引线端子，设置在模制部分上，以便电连接到阴极引线框架的下表面。

    Method of manufacturing PCB and PCB manufactured by the same
    6.
    发明申请
    Method of manufacturing PCB and PCB manufactured by the same 审中-公开
    制造PCB和PCB的方法

    公开(公告)号：US20090277679A1

    公开(公告)日：2009-11-12

    申请号：US12219660

    申请日：2008-07-25

    申请人： Ha Yong Jung ,  Dek Gin Yang ,  Cheol Ho Heo ,  Chan-Yeup Chung ,  Keun Ho Kim ,  Seoung Jae Lee

    发明人： Ha Yong Jung ,  Dek Gin Yang ,  Cheol Ho Heo ,  Chan-Yeup Chung ,  Keun Ho Kim ,  Seoung Jae Lee

    IPC分类号： H05K3/42 ,  H05K1/11

    CPC分类号： H05K3/44 ,  H05K1/056 ,  H05K3/429 ,  H05K2201/09554 ,  H05K2203/073

    摘要： Provided is a method of manufacturing a PCB, the method comprising: providing a substrate including an aluminum core; forming a via hole passing through the substrate; substituting the surface of the aluminum core with a zinc film by performing a zincate treatment on the inner surface of the via hole; substituting the zinc film with a metal film by performing substitution plating on the zinc film; forming a first plated film on the surface of the via hole, where the metal film is formed, through electroless plating; and forming a second plated film on the first plated film through electroplating.

    摘要翻译： 提供一种制造PCB的方法，该方法包括：提供包括铝芯的基板; 形成通过所述基板的通孔; 通过在通孔的内表面上进行锌酸盐处理，用锌膜代替铝芯的表面; 通过在锌膜上进行取代电镀用金属膜代替锌膜; 在形成金属膜的通孔的表面上通过无电镀形成第一镀膜; 以及通过电镀在所述第一镀膜上形成第二镀膜。

    Solid electrolytic capacitor and method of manufacturing the same
    9.
    发明授权
    Solid electrolytic capacitor and method of manufacturing the same 有权
    固体电解电容器及其制造方法

    公开(公告)号：US07633740B2

    公开(公告)日：2009-12-15

    申请号：US12007190

    申请日：2008-01-08

    申请人： Hee Sung Choi ,  Seoung Jae Lee ,  Yeoung Jin Lee ,  Sung Han Won ,  Ha Yong Jung ,  Hyun Ho Shin ,  Jung Tae Park ,  Jae Youn Jeong

    发明人： Hee Sung Choi ,  Seoung Jae Lee ,  Yeoung Jin Lee ,  Sung Han Won ,  Ha Yong Jung ,  Hyun Ho Shin ,  Jung Tae Park ,  Jae Youn Jeong

    IPC分类号： H01G4/228 ,  H01G9/10

    CPC分类号： H01G9/10 ,  H01G9/012 ,  H01G9/15 ,  Y10T29/417

    摘要： Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one end is inserted into the capacitor element and the other end projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of the conductive bumps.

    摘要翻译： 提供一种包括具有正极性的电容器元件的固体电解电容器; 阳极线一端插入电容器元件，另一端从电容器元件向外突出; 形成在所述电容器元件上的阴极引出层; 形成在阴极提取层上的多个导电凸块; 模制部分，形成为围绕电容器元件并暴露阳极线的突出端和导电凸块的端部; 阳极引线端子，设置在模制部分上，以便电连接到阳极线的暴露端; 以及阴极引线端子，设置在模制部分上以与导电凸块的暴露端电连接。