摘要:
An apparatus for transferring a wafer in a semiconductor manufacturing process, and for carrying a wafer between a cassette and a wafer chuck without an additional tool such as a tripod. The apparatus includes: a holder capable of holding the side of the wafer; a wafer transfer assembly including an actuator of the holder and a detector that detects a malfunction of the holder; and a process reactor having a vacuum exhaust port installed under a wafer chuck so as to guide gas in an axially-symmetric flow pattern. The holder grasps the rounded side of a wafer. Removal of additional tools makes the structure of an overall system more simple and an exhaust port can be installed under the reactor so as to cause processing gas to be guided in an axially-symmetric flow, resulting in an enhancement of the process uniformity.
摘要:
Provided is a method for modifying the surface of cycloolefin copolymer substrates, which includes oxygen plasma treatment and acid treatment for immobilizing a variety of functional groups or compounds having the functional groups onto the surface so that the surface can be easily modified, or can have hydrophilic property or biocompatibility. The method for modifying surface of cycloolefin copolymer substrates includes the steps of: a) treating the surface of a cycloolefin copolymer substrate with oxygen plasma to form hydroxyl groups on the surface; b) treating the oxygen plasma treated surface with an acid; and c) immobilizing one or more compounds having a functional group to the acid treated surface.
摘要:
The present invention relates to a micro electro mechanical system (MEMS); and, more particularly, to a micro pump used in micro fluid transportation and control and a method for fabricating the same. The micro pump according to the present invention comprises: trenches formed in a silicon substrate in order to form a pumping region including a main pumping region and an auxiliary pumping region; channels formed on both sides of the pumping region; a flow prevention region having backward-flow preventing layers to resist a fluid flow; inlet/outlet regions formed at each of the channels which are disposed on both ends of the pumping region; an outer layer covering the trenches of the silicon substrate and opening portions of the inlet/outlet regions; and a thermal conducting layer formed on the outer layer and over the main pumping region so that a pressure of the fluid in the main pumping region is increased by the thermal conducting layer.
摘要:
The disclosure concerns to an optical filter for use in an optical communication device such as a multiplexer and demultiplexer. The optical filter is a Fabry-Perot filter that is formed with a silicon substrate by using a silicon micromachining process and a silicon etching process. The optical filters are applied to various optical communication devices, such as multiplexer (MUX) or demultiplexer (DEMUX) In each of the optical communication devices, the optical filters are installed and integrated on the silicon substrate together with input/output optical fibers and collimating lenses, resulting in simplifying the manufacturing process thereof and, hence, in reducing the manufacturing cost thereof. Furthermore, each of the optical filters incorporates therein an actuator so as to be tunable (wavelength-selective) in the optical filtering function and to be capable of filtering more various wavelengths in a range.
摘要:
Disclosed is a a method of fabricating a MEMS device by means of surface micromachining without leaving any stiction or residues by etching silicon oxide of a sacrificial layer, which is an intermediate layer between a substrate and a microstructure, rather than by etching silicon oxide of a semiconductor device. The method according to the invention includes the steps of supplying alcohol vapor bubbled with anhydrous HF, maintaining a temperature of the supplying device and a moving path of the anhydrous HF and the alcohol to be higher than a boiling point of the alcohol, performing a vapor etching by controlling a temperature and a pressure to be within the vapor region of a phase equilibrium diagram of water, and removing silicon oxide of a sacrificial layer on a lower portion of the microstructure.