Thermally driven micro-pump buried in a silicon substrate and method for fabricating the same

    公开(公告)号:US06531417B2

    公开(公告)日:2003-03-11

    申请号:US09834586

    申请日:2001-04-12

    IPC分类号: H01L2100

    摘要: The present invention relates to a micro electro mechanical system (MEMS); and, more particularly, to a micro pump used in micro fluid transportation and control and a method for fabricating the same. The micro pump according to the present invention comprises: trenches formed in a silicon substrate in order to form a pumping region including a main pumping region and an auxiliary pumping region; channels formed on both sides of the pumping region; a flow prevention region having backward-flow preventing layers to resist a fluid flow; inlet/outlet regions formed at each of the channels which are disposed on both ends of the pumping region; an outer layer covering the trenches of the silicon substrate and opening portions of the inlet/outlet regions; and a thermal conducting layer formed on the outer layer and over the main pumping region so that a pressure of the fluid in the main pumping region is increased by the thermal conducting layer.

    Stiction-free microstructure releasing method for fabricating MEMS device
    2.
    发明授权
    Stiction-free microstructure releasing method for fabricating MEMS device 有权
    用于制造MEMS器件的无静电微结构释放方法

    公开(公告)号:US06806205B2

    公开(公告)日:2004-10-19

    申请号:US09753065

    申请日:2000-12-29

    IPC分类号: H01L21302

    摘要: Disclosed is a a method of fabricating a MEMS device by means of surface micromachining without leaving any stiction or residues by etching silicon oxide of a sacrificial layer, which is an intermediate layer between a substrate and a microstructure, rather than by etching silicon oxide of a semiconductor device. The method according to the invention includes the steps of supplying alcohol vapor bubbled with anhydrous HF, maintaining a temperature of the supplying device and a moving path of the anhydrous HF and the alcohol to be higher than a boiling point of the alcohol, performing a vapor etching by controlling a temperature and a pressure to be within the vapor region of a phase equilibrium diagram of water, and removing silicon oxide of a sacrificial layer on a lower portion of the microstructure.

    摘要翻译: 公开了一种通过表面微机械加工制造MEMS器件的方法,而不通过蚀刻作为衬底和微结构之间的中间层的牺牲层的氧化硅而不留下任何残留物,而不是通过蚀刻半导体的氧化硅 设备。 根据本发明的方法包括以下步骤:提供用无水HF鼓泡的醇蒸汽,保持供料装置的温度和无水HF和醇的移动路径高于醇的沸点,进行蒸汽 通过控制温度和压力在水的相平衡图的蒸汽区域内进行蚀刻,并且在微结构的下部去除牺牲层的氧化硅。

    Optical tunable filters and optical communication device incorporated therein optical tunable filters
    3.
    发明授权
    Optical tunable filters and optical communication device incorporated therein optical tunable filters 失效
    光可调谐滤波器和光通信装置并入其中的光可调谐滤波器

    公开(公告)号:US06798940B2

    公开(公告)日:2004-09-28

    申请号:US09853289

    申请日:2001-05-09

    IPC分类号: G02B626

    摘要: The disclosure concerns to an optical filter for use in an optical communication device such as a multiplexer and demultiplexer. The optical filter is a Fabry-Perot filter that is formed with a silicon substrate by using a silicon micromachining process and a silicon etching process. The optical filters are applied to various optical communication devices, such as multiplexer (MUX) or demultiplexer (DEMUX) In each of the optical communication devices, the optical filters are installed and integrated on the silicon substrate together with input/output optical fibers and collimating lenses, resulting in simplifying the manufacturing process thereof and, hence, in reducing the manufacturing cost thereof. Furthermore, each of the optical filters incorporates therein an actuator so as to be tunable (wavelength-selective) in the optical filtering function and to be capable of filtering more various wavelengths in a range.

    摘要翻译: 本公开涉及用于诸如复用器和解复用器的光通信设备中的光学滤波器。 滤光器是通过使用硅微加工工艺和硅蚀刻工艺由硅衬底形成的法布里 - 珀罗滤光器。 光滤波器被应用于诸如多路复用器(MUX)或解复用器(DEMUX)的各种光通信设备。在每个光通信设备中,光滤波器与输入/输出光纤一起安装并集成在硅衬底上并准直 透镜,从而简化了其制造工艺,并因此降低了其制造成本。 此外,每个光学滤波器在其中结合有致动器,以便在光学滤波功能中是可调谐的(波长选择性的),并且能够在一定范围内滤波更多的各种波长。

    Scanning micromirror for optical communication systems and method of manufacturing the same

    公开(公告)号:US06822776B2

    公开(公告)日:2004-11-23

    申请号:US10308137

    申请日:2002-12-03

    IPC分类号: G02B2608

    摘要: The present invention relates to a scanning micromirror for optical communications. The scanning micromirror comprises an outer frame having an aperture therein, an inner frame located within the aperture of the outer frame and having an aperture therein, an optical reflecting means located within the aperture of the inner frame, a plurality of first torsion springs connected between an inner wall of the outer frame and an outer wall of the inner frame, for supporting the inner frame, a plurality of second torsion springs connected between the inner wall of the inner frame and the optical reflecting means, for supporting the optical reflecting means, first comb-type electrostatic actuators for applying electrostatic torque by which the inner frame is rotated about an axis of the first torsion springs, and second comb-type electrostatic actuators for applying electrostatic torque by which the optical reflecting means is rotated about an axis of the second torsion springs. Therefore, as the present invention uses vertical comb-type electrostatic actuators, an available rotation angle can be made large compared to a conventional case using a parallel-plate type electrostatic actuator. As the vertical asymmetry of the fixed combs and the movable combs are large, a large rotation angle can be obtained in non-resonant mode as well as resonant mode.

    CAPACITIVE ACCELEROMETER
    5.
    发明申请
    CAPACITIVE ACCELEROMETER 有权
    电容式加速度计

    公开(公告)号:US20100050771A1

    公开(公告)日:2010-03-04

    申请号:US12517068

    申请日:2007-12-05

    IPC分类号: G01P15/125

    CPC分类号: G01P15/125 G01P15/0802

    摘要: A conventional capacitive accelerometer has a limitation in reducing a distance between a sensing electrode and a reference electrode, and requires a complex process and a separate method of correcting a clearance difference caused by a process error. However, the capacitive accelerometer of the present invention has high sensitivity, can be simply manufactured by maintaining a very narrow distance between a reference electrode and a sensing electrode, and can make it unnecessary to individually correct each manufactured accelerometer by removing or drastically reducing a functional difference due to a process error.

    摘要翻译: 常规的电容加速度计在减小感测电极和参考电极之间的距离方面具有局限性,并且需要一种复杂的过程和用于校正由过程误差引起的间隙差异的单独方法。 然而,本发明的电容加速度计具有高的灵敏度,可以通过在参考电极和感测电极之间保持非常窄的距离来简单地制造,并且可以使得不需要通过去除或大幅度地减少功能性来单独校正每个制造的加速度计 差异由于过程错误。

    Capacitive accelerometer
    6.
    发明授权
    Capacitive accelerometer 有权
    电容式加速度计

    公开(公告)号:US08113054B2

    公开(公告)日:2012-02-14

    申请号:US12517068

    申请日:2007-12-05

    IPC分类号: G01P15/125

    CPC分类号: G01P15/125 G01P15/0802

    摘要: A conventional capacitive accelerometer has a limitation in reducing a distance between a sensing electrode and a reference electrode, and requires a complex process and a separate method of correcting a clearance difference caused by a process error. However, the capacitive accelerometer of the present invention has high sensitivity, can be simply manufactured by maintaining a very narrow distance between a reference electrode and a sensing electrode, and can make it unnecessary to individually correct each manufactured accelerometer by removing or drastically reducing a functional difference due to a process error.

    摘要翻译: 常规的电容加速度计在减小感测电极和参考电极之间的距离方面具有局限性,并且需要一种复杂的过程和用于校正由过程误差引起的间隙差异的单独方法。 然而,本发明的电容加速度计具有高的灵敏度,可以通过在参考电极和感测电极之间保持非常窄的距离来简单地制造,并且可以使得不需要通过去除或大幅度地减少功能性来单独校正每个制造的加速度计 差异由于过程错误。

    MEMS package and packaging method thereof
    7.
    发明授权
    MEMS package and packaging method thereof 失效
    MEMS封装及其封装方法

    公开(公告)号:US08035176B2

    公开(公告)日:2011-10-11

    申请号:US12517557

    申请日:2007-07-25

    IPC分类号: H01L29/84 H01L21/00

    摘要: Provided are a Micro Electro-Mechanical System (MEMS) package and a method of packaging the MEMS package. The MEMS package includes: a MEMS device including MEMS structures formed on a substrate, first pad electrodes driving the MEMS structures, first sealing parts formed at an edge of the substrate, and connectors formed on the first pad electrodes and the first sealing parts; and a MEMS driving electronic device including second pad electrodes and second sealing parts respectively corresponding to the first pad electrodes and the first sealing parts to be sealed with and bonded to the MEMS device through the connectors to form an air gap having a predetermined width.

    摘要翻译: 提供了微机电系统(MEMS)封装以及封装MEMS封装的方法。 MEMS封装包括:包括形成在衬底上的MEMS结构的MEMS器件,驱动MEMS结构的第一焊盘电极,形成在衬底边缘的第一密封部分和形成在第一焊盘电极和第一密封部分上的连接器; 以及MEMS驱动电子器件,其包括分别对应于第一焊盘电极和第一密封部分的第二焊盘电极和第二密封部分,以通过连接器密封并结合到MEMS器件,以形成具有预定宽度的气隙。