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    Method of manufacturing film bulk acoustic resonator using internal stress of metallic film and resonator manufactured thereby
    1.
    发明授权
    Method of manufacturing film bulk acoustic resonator using internal stress of metallic film and resonator manufactured thereby 有权
    使用金属膜的内部应力和由此制造的谐振器制造膜体声波谐振器的方法

    公开(公告)号：US07671427B2

    公开(公告)日：2010-03-02

    申请号：US10838326

    申请日：2004-05-05

    申请人： Jong-seok Kim ,  Sung-hoon Choa ,  In-sang Song ,  Young-tack Hong

    发明人： Jong-seok Kim ,  Sung-hoon Choa ,  In-sang Song ,  Young-tack Hong

    IPC分类号： H01L47/00

    CPC分类号： H03H9/02133 ,  H03H3/02 ,  H03H9/172 ,  Y10T29/42

    摘要： A method of manufacturing a film bulk acoustic resonator and the resonator manufactured thereby. The method includes the laminating a sacrificial layer on a semiconductor substrate, removing a predetermined area from the sacrificial layer to realize electric contact between a signal line of the semiconductor substrate and a lower electrode, forming the lower electrode by depositing metal film for lower electrode on the sacrificial layer, by patterning based on a shape of the sacrificial layer, forming a piezoelectric layer by depositing a piezoelectric material on the lower electrode and by patterning based on a shape of the lower electrode, and forming an upper electrode by depositing metal film on the piezoelectric layer and by patterning based on a shape of the piezoelectric layer, wherein at least one of a deposition pressure and a deposition power is controlled to generate upward stress when depositing the metal film for the lower electrode.

    摘要翻译： 一种制造薄膜体声波谐振器的方法和由此制造的谐振器。 该方法包括在半导体衬底上层叠牺牲层，从牺牲层去除预定区域以实现半导体衬底的信号线与下电极之间的电接触，通过在下电极上沉积金属膜形成下电极 牺牲层，通过基于牺牲层的形状进行图案化，通过在下电极上沉积压电材料并基于下电极的形状进行图案化形成压电层，并且通过将金属膜沉积在上而形成上电极 压电层和基于压电层的形状的图案化，其中当沉积用于下电极的金属膜时，沉积压力和沉积功率中的至少一个被控制以产生向上的应力。

    Method of manufacturing film bulk acoustic resonator using internal stress of metallic film and resonator manufactured thereby
    2.
    发明授权
    Method of manufacturing film bulk acoustic resonator using internal stress of metallic film and resonator manufactured thereby 有权
    使用金属膜的内部应力和由此制造的谐振器制造膜体声波谐振器的方法

    公开(公告)号：US07939356B2

    公开(公告)日：2011-05-10

    申请号：US12684454

    申请日：2010-01-08

    申请人： Jong-seok Kim ,  Sung-hoon Choa ,  In-sang Song ,  Young-tack Hong

    发明人： Jong-seok Kim ,  Sung-hoon Choa ,  In-sang Song ,  Young-tack Hong

    IPC分类号： H01L21/00

    CPC分类号： H03H9/02133 ,  H03H3/02 ,  H03H9/172 ,  Y10T29/42

    摘要： A method of manufacturing a film bulk acoustic resonator and the resonator manufactured thereby. The method includes the laminating a sacrificial layer on a semiconductor substrate, removing a predetermined area from the sacrificial layer to realize electric contact between a signal line of the semiconductor substrate and a lower electrode, forming the lower electrode by depositing metal film for lower electrode on the sacrificial layer, by patterning based on a shape of the sacrificial layer, forming a piezoelectric layer by depositing a piezoelectric material on the lower electrode and by patterning based on a shape of the lower electrode, and forming an upper electrode by depositing metal film on the piezoelectric layer and by patterning based on a shape of the piezoelectric layer, wherein at least one of a deposition pressure and a deposition power is controlled to generate upward stress when depositing the metal film for the lower electrode.

    摘要翻译： 一种制造薄膜体声波谐振器的方法和由此制造的谐振器。 该方法包括在半导体衬底上层叠牺牲层，从牺牲层去除预定区域以实现半导体衬底的信号线与下电极之间的电接触，通过在下电极上沉积金属膜形成下电极 牺牲层，通过基于牺牲层的形状进行图案化，通过在下电极上沉积压电材料并基于下电极的形状进行图案化形成压电层，并且通过将金属膜沉积在上而形成上电极 压电层和基于压电层的形状的图案化，其中当沉积用于下电极的金属膜时，沉积压力和沉积功率中的至少一个被控制以产生向上的应力。

    Method of manufacturing film bulk acoustic resonator using internal stress of metallic film and resonator manufactured thereby
    3.
    发明申请
    Method of manufacturing film bulk acoustic resonator using internal stress of metallic film and resonator manufactured thereby 有权
    使用金属膜的内部应力和由此制造的谐振器制造膜体声波谐振器的方法

    公开(公告)号：US20050001274A1

    公开(公告)日：2005-01-06

    申请号：US10838326

    申请日：2004-05-05

    申请人： Jong-seok Kim ,  Sung-hoon Choa ,  In-sang Song ,  Young-tack Hong

    发明人： Jong-seok Kim ,  Sung-hoon Choa ,  In-sang Song ,  Young-tack Hong

    IPC分类号： H03H9/15 ,  H03H3/02 ,  H03H9/17 ,  H01L21/00 ,  H01L27/14 ,  H01L29/82

    CPC分类号： H03H9/02133 ,  H03H3/02 ,  H03H9/172 ,  Y10T29/42

    摘要： A method of manufacturing a film bulk acoustic resonator and the resonator manufactured thereby. The method includes the laminating a sacrificial layer on a semiconductor substrate, removing a predetermined area from the sacrificial layer to realize electric contact between a signal line of the semiconductor substrate and a lower electrode, forming the lower electrode by depositing metal film for lower electrode on the sacrificial layer, by patterning based on a shape of the sacrificial layer, forming a piezoelectric layer by depositing a piezoelectric material on the lower electrode and by patterning based on a shape of the lower electrode, and forming an upper electrode by depositing metal film on the piezoelectric layer and by patterning based on a shape of the piezoelectric layer, wherein at least one of a deposition pressure and a deposition power is controlled to generate upward stress when depositing the metal film for the lower electrode.

    摘要翻译： 一种制造薄膜体声波谐振器的方法和由此制造的谐振器。 该方法包括在半导体衬底上层叠牺牲层，从牺牲层去除预定区域以实现半导体衬底的信号线与下电极之间的电接触，通过在下电极上沉积金属膜形成下电极 牺牲层，通过基于牺牲层的形状进行图案化，通过在下电极上沉积压电材料并基于下电极的形状进行图案化形成压电层，并且通过将金属膜沉积在上而形成上电极 压电层和基于压电层的形状的图案化，其中当沉积用于下电极的金属膜时，沉积压力和沉积功率中的至少一个被控制以产生向上的应力。

    MEMS device package and method of manufacturing the same
    5.
    发明授权
    MEMS device package and method of manufacturing the same 有权
    MEMS器件封装及其制造方法

    公开(公告)号：US07719742B2

    公开(公告)日：2010-05-18

    申请号：US11368626

    申请日：2006-03-07

    申请人： Jong-seok Kim ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Yun-kwon Park ,  Seok-chul Yun ,  Sung-hoon Choa ,  In-sang Song

    发明人： Jong-seok Kim ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Yun-kwon Park ,  Seok-chul Yun ,  Sung-hoon Choa ,  In-sang Song

    IPC分类号： G02B26/00 ,  G02B26/08

    CPC分类号： B81B7/0051 ,  B81B7/007

    摘要： A MEMS device package and a method of manufacturing the same. The MEMS device package includes a device substrate having a surface on which a MEMS active device is formed, and multiple sealing pads arranged around the MEMS active device so that the sealing pads provide electric paths for the MEMS active device. In addition, the MEMS device package may include a cap substrate bonded to the device substrate through the multiple sealing pads, the cap substrate including a trench, within which the MEMS active device is positioned, and via holes. One or more outer electrode pads may be formed on one surface of the cap substrate to be electrically connected with the multiple sealing pads through the via holes. Because there are several bonding and sealing areas between the device substrate and the cap substrate, the sealing intensity is strengthened.

    摘要翻译： 一种MEMS器件封装及其制造方法。 MEMS器件封装包括具有其上形成有MEMS器件的表面的器件衬底以及围绕MEMS有源器件布置的多个密封焊盘，使得密封垫为MEMS有源器件提供电路径。 此外，MEMS器件封装可以包括通过多个密封焊盘结合到器件衬底的帽衬底，帽衬底包括其中定位MEMS有源器件的沟槽和通孔。 可以在盖基板的一个表面上形成一个或多个外电极焊盘，以通过通孔与多个密封垫电连接。 由于在器件基板和盖基板之间存在多个接合和密封区域，所以密封强度得以加强。

    MEMS device package and method of manufacturing the same
    6.
    发明申请
    MEMS device package and method of manufacturing the same 有权
    MEMS器件封装及其制造方法

    公开(公告)号：US20060199297A1

    公开(公告)日：2006-09-07

    申请号：US11368626

    申请日：2006-03-07

    申请人： Jong-seok Kim ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Yun-kwon Park ,  Seok-chul Yun ,  Sung-hoon Choa ,  In-sang Song

    发明人： Jong-seok Kim ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Yun-kwon Park ,  Seok-chul Yun ,  Sung-hoon Choa ,  In-sang Song

    IPC分类号： H01L21/00

    CPC分类号： B81B7/0051 ,  B81B7/007

    摘要： A MEMS device package and a method of manufacturing the same. The MEMS device package includes a device substrate having a surface on which a MEMS active device is formed, and multiple sealing pads arranged around the MEMS active device so that the sealing pads provide electric paths for the MEMS active device. In addition, the MEMS device package may include a cap substrate bonded to the device substrate through the multiple sealing pads, the cap substrate including a trench, within which the MEMS active device is positioned, and via holes. One or more outer electrode pads may be formed on one surface of the cap substrate to be electrically connected with the multiple sealing pads through the via holes. Because there are several bonding and sealing areas between the device substrate and the cap substrate, the sealing intensity is strengthened.

    摘要翻译： 一种MEMS器件封装及其制造方法。 MEMS器件封装包括具有其上形成有MEMS器件的表面的器件衬底以及围绕MEMS有源器件布置的多个密封焊盘，使得密封垫为MEMS有源器件提供电路径。 此外，MEMS器件封装可以包括通过多个密封焊盘结合到器件衬底的帽衬底，帽衬底包括其中定位MEMS有源器件的沟槽和通孔。 可以在盖基板的一个表面上形成一个或多个外电极焊盘，以通过通孔与多个密封垫电连接。 由于在器件基板和盖基板之间存在多个接合和密封区域，所以密封强度得以加强。

    MEMS SWITCH
    9.
    发明申请
    MEMS SWITCH 有权
    MEMS开关

    公开(公告)号：US20110108400A1

    公开(公告)日：2011-05-12

    申请号：US13007017

    申请日：2011-01-14

    申请人： Young-tack HONG ,  Dong-kyun Kim ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon ,  Jong-seok Kim ,  Che-heung Kim

    发明人： Young-tack HONG ,  Dong-kyun Kim ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon ,  Jong-seok Kim ,  Che-heung Kim

    IPC分类号： H01H57/00

    CPC分类号： B41J2/04581 ,  B41J2/04541

    摘要： A Micro Electro Mechanical System (MEMS) switch includes a substrate, a fixed signal line formed on the substrate, a movable signal line spaced apart from one of an upper surface and a lower surface of the fixed signal line, and at least one piezoelectric actuator connected to a first end of the movable signal line so as to bring or separate the movable signal line in contact with or from the fixed signal line. The piezoelectric actuator includes a first electrode, a piezoelectric layer formed on the first electrode, a second electrode formed on the piezoelectric layer, and a connecting layer formed on the second electrode and connected with the movable signal line.

    摘要翻译： 微机电系统（MEMS）开关包括基板，形成在基板上的固定信号线，与固定信号线的上表面和下表面之一间隔开的可移动信号线，以及至少一个压电致动器 连接到可移动信号线的第一端，以使可移动信号线与固定信号线接触或分离。 压电致动器包括第一电极，形成在第一电极上的压电层，形成在压电层上的第二电极，以及形成在第二电极上并与可移动信号线连接的连接层。