公开(公告)号：US20170055062A1

公开(公告)日：2017-02-23

申请号：US15210384

申请日：2016-07-14

Applicant: Jonggi LEE

Inventor： Jonggi LEE

IPC: H04R1/10

CPC classification number: H04R1/1033 ,  H04R1/1016 ,  H04R1/1058 ,  H04R1/1066 ,  H04R5/033 ,  H04R2201/109 ,  H04R2420/07

Abstract: A protection assembly for an ear-mounted sound-output device, the assembly comprising: one pair of sound-output unit covers, each cover having an inner space formed therein and a first open end to allow a sound-output unit of the ear-mounted sound-output device to be received in the inner space, and a coupling hole defined at a second closed end of the cover, wherein the first and second ends are opposite to each other; and one pair of connection lines, each line coupled to each of one pair of the ear-mounted sound-output unit covers at the second end of the cover, each line having a first end passing through the hole, each line having a stopper received in the inner space at the first of the line, each line having a loop at a second end of the line to allow a sound-transfer cable connected the sound-output unit to slidably pass through the loop.

Abstract translation: 一种用于耳塞式声音输出装置的保护组件，该组件包括：一对声音输出单元盖，每个盖具有形成在其中的内部空间和第一开口端，以允许耳塞式声音输出装置的声音输出单元， 安装的声音输出装置被容纳在内部空间中，以及联接孔，限定在所述盖的第二封闭端，其中所述第一和第二端彼此相对; 以及一对连接线，每条线在盖的第二端耦合到一对耳挂式声音输出单元盖中的每一条，每条线具有穿过该孔的第一端，每条线具有接收的止动件 在第一行的内部空间中，每条线在线的第二端具有一个环，以允许连接声音输出单元的声音传输电缆可滑动地穿过环路。

公开(公告)号：US20100117213A1

公开(公告)日：2010-05-13

申请号：US12615507

申请日：2009-11-10

Applicant: Minill KIM ,  Kwang Yong LEE ,  Jonggi LEE ,  Ji-Seok HONG ,  Hyun Jeong WOO

Inventor： Minill KIM ,  Kwang Yong LEE ,  Jonggi LEE ,  Ji-Seok HONG ,  Hyun Jeong WOO

IPC: H01L23/488 ,  H05B6/36

CPC classification number: H05B6/36 ,  B23K1/0016 ,  B23K1/002 ,  B23K2101/40 ,  H01L24/81 ,  H01L2224/81222 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2203/101

Abstract: An apparatus to package a semiconductor chip includes a coil configured to use induction heating to reflow a solder ball of the semiconductor chip. The coil includes a first body, a second body parallel to the first body, a third body extending from the first body to the second body. The first and second bodies are symmetrical with respect to a vertical plane disposed therebetween. The first and second bodies have inclined surfaces facing each other, and the inclined surfaces are distant from each other downward.

Abstract translation: 封装半导体芯片的装置包括配置为使用感应加热来回流半导体芯片的焊球的线圈。 线圈包括第一主体，平行于第一主体的第二主体，从第一主体延伸到第二主体的第三主体。 第一和第二主体相对于设置在它们之间的垂直平面是对称的。 第一和第二主体具有彼此面对的倾斜表面，并且倾斜表面彼此向下延伸。