Top-emitting nitride-based light emitting device and method of manufacturing the same
    1.
    发明申请
    Top-emitting nitride-based light emitting device and method of manufacturing the same 有权
    顶部发射氮化物基发光器件及其制造方法

    公开(公告)号:US20050133809A1

    公开(公告)日:2005-06-23

    申请号:US11011154

    申请日:2004-12-15

    CPC分类号: H01L33/42 H01L33/32

    摘要: Provided are a top-emitting N-based light emitting device and a method of manufacturing the same. The device includes a substrate, an n-type clad layer, an active layer, a p-type clad layer, and a multi ohmic contact layer, which are sequentially stacked. The multi ohmic contact layer includes one or more stacked structures, each including a modified metal layer and a transparent conductive thin film layer, which are repetitively stacked on the p-type clad layer. The modified metal layer is formed of an Ag-based material.

    摘要翻译: 提供了一种顶发射N型发光器件及其制造方法。 该器件包括依次层叠的衬底,n型覆盖层,有源层,p型覆盖层和多欧姆接触层。 多欧姆接触层包括一个或多个堆叠结构,每个层叠结构包括重复堆叠在p型覆盖层上的改性金属层和透明导电薄膜层。 改性金属层由Ag基材料形成。

    Top-emitting nitride-based light emitting device and method of manufacturing the same
    2.
    发明授权
    Top-emitting nitride-based light emitting device and method of manufacturing the same 有权
    顶部发射氮化物基发光器件及其制造方法

    公开(公告)号:US07417264B2

    公开(公告)日:2008-08-26

    申请号:US11011154

    申请日:2004-12-15

    IPC分类号: H01L33/00

    CPC分类号: H01L33/42 H01L33/32

    摘要: Provided are a top-emitting N-based light emitting device and a method of manufacturing the same. The device includes a substrate, an n-type clad layer, an active layer, a p-type clad layer, and a multi ohmic contact layer, which are sequentially stacked. The multi ohmic contact layer includes one or more stacked structures, each including a modified metal layer and a transparent conductive thin film layer, which are repetitively stacked on the p-type clad layer. The modified metal layer is formed of an Ag-based material.

    摘要翻译: 提供了一种顶发射N型发光器件及其制造方法。 该器件包括依次层叠的衬底,n型覆盖层,有源层,p型覆盖层和多欧姆接触层。 多欧姆接触层包括一个或多个堆叠结构,每个层叠结构包括重复堆叠在p型覆盖层上的改性金属层和透明导电薄膜层。 改性金属层由Ag基材料形成。

    Reflective electrode and compound semiconductor light emitting device including the same
    3.
    发明申请
    Reflective electrode and compound semiconductor light emitting device including the same 有权
    反射电极和包含该反射电极的化合物半导体发光器件

    公开(公告)号:US20080105890A1

    公开(公告)日:2008-05-08

    申请号:US12000870

    申请日:2007-12-18

    IPC分类号: H01L33/00

    摘要: Provided are a reflective electrode and a compound semiconductor light emitting device, such as an LED or an LD, including the same. The reflective electrode, which is formed on a p-type compound semiconductor layer, includes: a first electrode layer forming an ohmic contact with the p-type compound semiconductor layer; a second electrode layer disposed on the first electrode layer and formed of transparent conductive oxide; and a third electrode layer disposed on the second electrode layer and formed of an optical reflective material.

    摘要翻译: 提供反射电极和化合物半导体发光器件,例如包括其的LED或LD。 形成在p型化合物半导体层上的反射电极包括:与p型化合物半导体层形成欧姆接触的第一电极层; 设置在第一电极层上并由透明导电氧化物形成的第二电极层; 以及设置在第二电极层上并由光学反射材料形成的第三电极层。

    GaN-based III - V group compound semiconductor light emitting device and method of fabricating the same
    5.
    发明申请
    GaN-based III - V group compound semiconductor light emitting device and method of fabricating the same 审中-公开
    GaN基III-V族化合物半导体发光器件及其制造方法

    公开(公告)号:US20050212006A1

    公开(公告)日:2005-09-29

    申请号:US10978426

    申请日:2004-11-02

    CPC分类号: H01L33/32 H01L33/40

    摘要: Provided are a GaN-based III-V group compound semiconductor light emitting device and a method of fabricating the GaN-based III-V group compound semiconductor light emitting device. The GaN-based III-V group compound semiconductor light emitting device includes: at least an n-type compound semiconductor layer, an active layer, and a p-type compound semiconductor layer, which are disposed between an n-type electrode and a p-type electrode. The p-type electrode includes a first electrode layer which is formed of Ag or an Ag-alloy on the p-type GaN-based compound semiconductor layer and a second electrode which is formed of at least one selected from the group consisting of Ni, Ni-alloy, Zn, Zn-alloy, Cu, Cu-alloy, Ru, Ir, and Rh on the first electrode layer.

    摘要翻译: 提供了一种基于GaN的III-V族化合物半导体发光器件和制造GaN基III-V族化合物半导体发光器件的方法。 GaN基III-V族化合物半导体发光器件包括:至少n型化合物半导体层,有源层和p型化合物半导体层,其设置在n型电极和p型 型电极。 p型电极包括由p型GaN基化合物半导体层上的Ag或Ag合金形成的第一电极层和由选自Ni, Ni合金,Zn,Zn合金,Cu,Cu合金,Ru,Ir和Rh。

    Top-emitting nitride-based light emitting device and method of manufacturing the same
    8.
    发明授权
    Top-emitting nitride-based light emitting device and method of manufacturing the same 有权
    顶部发射氮化物基发光器件及其制造方法

    公开(公告)号:US07666693B2

    公开(公告)日:2010-02-23

    申请号:US12180312

    申请日:2008-07-25

    IPC分类号: H01L21/00

    CPC分类号: H01L33/42 H01L33/32

    摘要: Provided are a top-emitting N-based light emitting device and a method of manufacturing the same. The device includes a substrate, an n-type clad layer, an active layer, a p-type clad layer, and a multi ohmic contact layer, which are sequentially stacked. The multi ohmic contact layer includes one or more stacked structures, each including a modified metal layer and a transparent conductive thin film layer, which are repetitively stacked on the p-type clad layer. The modified metal layer is formed of an Ag-based material.

    摘要翻译: 提供了一种顶发射N型发光器件及其制造方法。 该器件包括依次层叠的衬底,n型覆盖层,有源层,p型覆盖层和多欧姆接触层。 多欧姆接触层包括一个或多个堆叠结构,每个层叠结构包括重复堆叠在p型覆盖层上的改性金属层和透明导电薄膜层。 改性金属层由Ag基材料形成。

    TOP-EMITTING NITRIDE-BASED LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    9.
    发明申请
    TOP-EMITTING NITRIDE-BASED LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    基于氮化物的发光装置及其制造方法

    公开(公告)号:US20080299687A1

    公开(公告)日:2008-12-04

    申请号:US12180312

    申请日:2008-07-25

    IPC分类号: H01L33/00

    CPC分类号: H01L33/42 H01L33/32

    摘要: Provided are a top-emitting N-based light emitting device and a method of manufacturing the same. The device includes a substrate, an n-type clad layer, an active layer, a p-type clad layer, and a multi ohmic contact layer, which are sequentially stacked. The multi ohmic contact layer includes one or more stacked structures, each including a modified metal layer and a transparent conductive thin film layer, which are repetitively stacked on the p-type clad layer. The modified metal layer is formed of an Ag-based material.

    摘要翻译: 提供了一种顶发射N型发光器件及其制造方法。 该器件包括依次层叠的衬底,n型覆盖层,有源层,p型覆盖层和多欧姆接触层。 多欧姆接触层包括一个或多个堆叠结构,每个层叠结构包括重复堆叠在p型覆盖层上的改性金属层和透明导电薄膜层。 改性金属层由Ag基材料形成。