Miniature implantable connectors
    1.
    发明授权
    Miniature implantable connectors 有权
    微型可植入连接器

    公开(公告)号:US06738672B2

    公开(公告)日:2004-05-18

    申请号:US09971848

    申请日:2001-10-04

    IPC分类号: A61N105

    CPC分类号: A61N1/3752 A61N1/05

    摘要: The invention discloses methods of making electrical connections in living tissue between an electrically conductive wire and an implantable miniature device. The device may either stimulate muscles or nerves in the body or detect signals and transmit these signals outside the body or transmit the signals for use at another location within the body. The device is comprised of an electrically insulating or electrically conductive case with at least one electrode for transmitting electrical signals. The electrodes and the wire-electrode connections are protected from the aggressive environment within the body to avoid corrosion of the electrode and to avoid damage to the living tissue surrounding the device.

    摘要翻译: 本发明公开了在导电线和可植入微型装置之间的生物组织中进行电连接的方法。 该装置可以刺激身体中的肌肉或神经,或者检测信号并将这些信号传输到身体外部,或者传输信号以在体内的另一位置使用。 该装置由具有至少一个用于传输电信号的电极的电绝缘或导电壳体组成。 电极和线电极连接被保护免受身体内的侵蚀性环境,以避免电极的腐蚀并且避免损坏设备周围的活体组织。

    Electrically sensing and stimulating system for placement of a nerve stimulator or sensor
    2.
    发明授权
    Electrically sensing and stimulating system for placement of a nerve stimulator or sensor 有权
    用于放置神经刺激器或传感器的电感和刺激系统

    公开(公告)号:US06829508B2

    公开(公告)日:2004-12-07

    申请号:US10116619

    申请日:2002-04-04

    IPC分类号: A61N105

    摘要: An electrically sensing and stimulating outer sheath for ensuring accurate surgical placement of a microsensor or a microstimulator near a nerve in living tissue is disclosed. The electrically sensing outer sheath may also be used to verify the function of the microstimulator or microsensor during surgical placement but before the outer sheath is removed. In the event that the microstimulator is not optimally placed near the nerve, or if the microstimulator is malfunctioning, this can be determined prior to removal of the outer sheath, thus reducing the possibility of nerve or tissue damage that might be incurred during a separate operation to remove the microstimulator.

    摘要翻译: 公开了一种用于确保精细手术放置生物组织中神经附近的微传感器或微型刺激器的电感和刺激外护套。 电感外护套还可以用于在外科手术放置期间,但在外护套被移除之前验证微刺激器或微传感器的功能。 在微型刺激器没有被最佳地放置在神经附近的情况下,或者如果微型刺激器发生故障,则可以在去除外鞘之前确定这一点,从而减少在单独操作期间可能引起的神经或组织损伤的可能性 去除微型激励器。

    Method for removing surgically implanted devices
    3.
    发明授权
    Method for removing surgically implanted devices 有权
    手术植入装置的移除方法

    公开(公告)号:US08055336B1

    公开(公告)日:2011-11-08

    申请号:US11871776

    申请日:2007-10-12

    IPC分类号: A61N1/05

    摘要: A method of removing an implantable electronic microdevice by an integral removal loop or circumferential ring to facilitate removal of the implanted microdevice without additional surgery. The device is removed by pulling it along the surgically created implantation path. Optionally a radio-opaque tether provides a method of locating the implantable microdevice without additional surgery and attachment of one end of the tether to a radio-opaque marker provides a method of locating the end of the tether to facilitate removal of the implantable microdevice from living tissue.

    摘要翻译: 一种通过整体移除环或周向环移除可植入电子微型装置的方法,以便于无需另外手术即可移除植入的微型装置。 通过沿着手术产生的植入路径拉动装置来移除该装置。 可选地,不透射线的系绳提供了一种定位可植入微型装置的方法,而无需额外的手术,并且将系绳的一端附接到不透射线的标记物提供了一种定位系绳端部以便于移除可植入微型装置从生活的方法 组织。

    Structure for placement of an implantable device
    4.
    发明授权
    Structure for placement of an implantable device 有权
    可植入装置的放置结构

    公开(公告)号:US08301266B1

    公开(公告)日:2012-10-30

    申请号:US12233482

    申请日:2008-09-18

    IPC分类号: A61N1/05

    摘要: A device configured for implantation beneath a patient's skin for the purpose of tissue, e.g., nerve or muscle, stimulation and/or parameter monitoring and/or data communication. Devices in accordance with the invention are comprised of a sealed housing, typically having an axial dimension of less than 60 mm and a lateral dimension of less than 6 mm, containing a power source for powering electronic circuitry within. A placement structure is shown for facilitating placement of the implantable device proximate to neural/muscular tissue.

    摘要翻译: 一种被配置为植入患者皮肤下方以用于组织例如神经或肌肉,刺激和/或参数监测和/或数据通信的装置。 根据本发明的装置包括通常具有小于60mm的轴向尺寸和小于6mm的横向尺寸的密封壳体,其包含用于为其内的电子电路供电的电源。 示出了放置结构,以便于植入式装置靠近神经/肌肉组织的放置。

    Hearing aid system including speaker implanted in middle ear
    6.
    发明授权
    Hearing aid system including speaker implanted in middle ear 有权
    助听器系统包括植入中耳的扬声器

    公开(公告)号:US06648813B2

    公开(公告)日:2003-11-18

    申请号:US09882496

    申请日:2001-06-15

    IPC分类号: H04R2500

    CPC分类号: H04R25/606 H04R2225/31

    摘要: A system for enhancing a patient's hearing using electrically driven sound transducer, i.e., a speaker, implanted in the patient's middle ear cavity. More particularly, the speaker is implanted in the middle ear cavity inward of the tympanic membrane and oriented to direct sound energy toward the ossicles or the round window. In a first arrangement, the speaker functions to vibrate the ossicles and thus, via the oval window, actuate the perilymph in the cochlea. In an alternative arrangement, the speaker functions to actuate the cochlea via sound injected into the round window.

    摘要翻译: 一种用于使用植入患者中耳腔中的电驱动声换能器(即,扬声器)增强患者听力的系统。 更具体地说,扬声器被植入到鼓膜内侧的中耳腔内并被定向以将声能引向小骨或圆窗。 在第一布置中,扬声器用于振动小骨,并因此通过椭圆形窗口致动耳蜗内的外淋巴。 在另一种布置中,扬声器用于通过注入到圆窗中的声音来致动耳蜗。

    Implantable middle ear implant
    7.
    发明授权
    Implantable middle ear implant 有权
    植入式中耳植入物

    公开(公告)号:US06572531B2

    公开(公告)日:2003-06-03

    申请号:US09882562

    申请日:2001-06-15

    IPC分类号: H04R2500

    CPC分类号: H04R25/606 A61N1/36036

    摘要: A hearing aid comprised of conventional cochlear implant electronics implanted in the middle ear and coupled to an actuator configured to mechanically vibrate the middle ear ossicles. The implant electronics, typically used for driving an electrode array implanted in the cochlea, is used instead to supply electric drive signals to the actuator for mechanically vibrating the ossicles.

    摘要翻译: 助听器包括植入中耳的常规的人工耳蜗植入电子器件,并耦合到构造成机械振动中耳小骨的致动器。 通常用于驱动植入在耳蜗中的电极阵列的植入物电子器件用于向致动器提供电驱动信号以机械振动小骨。

    Hybrid middle ear/cochlea implant system
    8.
    发明授权
    Hybrid middle ear/cochlea implant system 有权
    混合中耳/耳蜗植入系统

    公开(公告)号:US06611718B2

    公开(公告)日:2003-08-26

    申请号:US09881832

    申请日:2001-06-15

    IPC分类号: A61N100

    CPC分类号: A61N1/36036

    摘要: A system for enhancing hearing comprised of both a middle ear implant and a cochlear implant. The system directs signals relating to lower frequency sound to the middle ear implant and signals relating to higher frequency sound to the cochlear implant. The middle ear implant comprises an electrically driven actuator, e.g., a speaker, for vibrating the middle ear ossicles via air conducted sound energy or a mechanical transducer for physically contacting and mechanically vibrating the ossicles. The cochlear implant includes electrodes preferably implanted at a shallow level at the basal end of the cochlea.

    摘要翻译: 一种用于增强听力的系统,包括中耳植入物和耳蜗植入物。 该系统将与低频声音相关的信号引导到中耳植入物和与较高频率声音相关的信号到耳蜗植入物。 中耳植入物包括电驱动致动器,例如扬声器,用于通过空气传导声能振动中耳小骨,或用于物理接触和机械振动小骨的机械换能器。 耳蜗植入物包括优选植入耳蜗基底端浅层的电极。

    Method of manufacture of an electrode array
    10.
    发明授权
    Method of manufacture of an electrode array 有权
    电极阵列的制造方法

    公开(公告)号:US08991680B1

    公开(公告)日:2015-03-31

    申请号:US13211233

    申请日:2011-08-16

    IPC分类号: B23K31/02 B23K1/19

    CPC分类号: B23K1/19 A61N1/0531

    摘要: The electrode array is a device for making electrical contacts with cellular tissue or organs. The electrode array includes an assembly of electrically conductive electrodes arising from a substrate where the electrodes are hermetically bonded to the substrate. A method of manufacture of an electrode array and associated circuitry is disclosed where the braze preform tab disappears during the braze bonding process and is completely drawn into the substrate feedthrough holes such that the braze perform tab is completely involved in the braze joint and is no longer connecting the adjacent electrodes.

    摘要翻译: 电极阵列是用于与细胞组织或器官进行电接触的装置。 电极阵列包括由电极产生的导电电极的组件,其中电极气密地结合到衬底上。 公开了一种制造电极阵列和相关联的电路的方法,其中钎焊预成型件接头在钎焊接合过程期间消失,并且完全拉入衬底馈通孔中,使得钎焊性能接头完全参与钎焊接头并且不再 连接相邻的电极。