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18 条记录 (耗时 0.029 秒)

    System and method for thermal limiting of the temperature of a cooktop without using a temperature sensor
    2.
    发明授权
    System and method for thermal limiting of the temperature of a cooktop without using a temperature sensor 有权
    不使用温度传感器来限制炉灶温度的系统和方法

    公开(公告)号：US06753511B2

    公开(公告)日：2004-06-22

    申请号：US10255361

    申请日：2002-09-26

    申请人： Harry Kirk Mathews, Jr. ,  Joseph Lucian Smolenski ,  John Stanley Glaser

    发明人： Harry Kirk Mathews, Jr. ,  Joseph Lucian Smolenski ,  John Stanley Glaser

    IPC分类号： H05B102

    CPC分类号： H05B3/746 ,  H05B2213/07

    摘要： A system and method for limiting the temperature of a burner for a cooking appliance without the use of a temperature sensor. The method includes the step of sensing the conduction state of a thermal switch and feeding back the sensed signal to control the duty-cycle (and thus “on” time) of bang-bang thermal limiting control. The power to the burner is reduced until the sensed duty-cycle (near 100%) cycling is reduced (lower frequency and amplitude) resulting in smoother power and temperature control. Preferably, the control system and method is implemented for controlling power applied to a burner for a glass-ceramic cooktop.

    摘要翻译： 一种用于在不使用温度传感器的情况下限制烹饪器具的燃烧器的温度的系统和方法。 该方法包括检测热开关的导通状态并反馈感测信号以控制爆轰热限制控制的占空比（因此“开”）的步骤。 燃烧器的功率降低，直到感测到的占空比（近100％）循环减小（较低的频率和幅度），从而实现更平稳的功率和温度控制。 优选地，控制系统和方法被实施用于控制施加到用于玻璃 - 陶瓷炉灶的燃烧器的功率。

    System and method of detecting temperature of a cooking utensil over a radiant cooktop
    3.
    发明授权
    System and method of detecting temperature of a cooking utensil over a radiant cooktop 有权
    在辐射炉灶上检测烹饪用具的温度的系统和方法

    公开(公告)号：US07307246B2

    公开(公告)日：2007-12-11

    申请号：US10878067

    申请日：2004-06-28

    申请人： Joseph Lucian Smolenski ,  Harry Kirk Mathews, Jr.

    发明人： Joseph Lucian Smolenski ,  Harry Kirk Mathews, Jr.

    IPC分类号： H05B1/02

    CPC分类号： G01K13/00 ,  G01K1/14 ,  G01K1/16 ,  G01K2207/00

    摘要： A system for detecting temperature of a cooking utensil over a radiant cooktop includes a cooktop having an upper surface and a lower surface and a radiant heating element adapted to heat the cooktop. A temperature detector is disposed adjacent the lower surface of the cooktop and is adapted to detect temperature of the lower surface of the cooktop. The system also includes a thermal insulation barrier disposed intermediate the temperature detector and the radiant heating element.

    摘要翻译： 用于检测烹饪用具在辐射炉灶上的温度的系统包括具有上表面和下表面的炉灶面和适于加热炉灶的辐射加热元件。 温度检测器设置在炉灶面的下表面附近并适于检测炉灶面下表面的温度。 该系统还包括设置在温度检测器和辐射加热元件之间的隔热屏障。

    Power converting apparatus having improved electro-thermal characteristics
    7.
    发明授权
    Power converting apparatus having improved electro-thermal characteristics 有权
    具有改善的电热特性的电力转换装置

    公开(公告)号：US08675379B2

    公开(公告)日：2014-03-18

    申请号：US13204834

    申请日：2011-08-08

    申请人： Joseph Lucian Smolenski ,  Michael Schutten ,  Eladio Clemente Delgado ,  Richard Alfred Beaupre

    发明人： Joseph Lucian Smolenski ,  Michael Schutten ,  Eladio Clemente Delgado ,  Richard Alfred Beaupre

    IPC分类号： H05K7/20 ,  H02M7/5387

    CPC分类号： H01L25/16 ,  H01L2924/0002 ,  H02M7/003 ,  H05K7/1432 ,  H01L2924/00

    摘要： A power-converting apparatus, such as a power module, may include a base plate (16), a first direct current (DC) bus and a second DC bus (22, 24). A power semiconductor component (18, 20) may be electrically coupled to one of the buses, and may be disposed on a substrate (12, 14) physically coupled to the base plate. The power semiconductor component may be made from a high-temperature, wide bandgap material, and the substrate may be exposed to a heat flux based on an operational temperature of the power semiconductor component. At least a first capacitor (50) may be coupled across the first and second DC buses, and at least second and third capacitors (52) may be respectively coupled across respective ones of the first and second buses and an alternating current (AC) return path. Capacitors (50, 52) may each be located inside the power module to establish circuit connections sufficiently proximate to the first power semiconductor component to reduce a formation of parasitic inductances, and further may each be located physically apart from the substrate and thus not exposed to the heat flux.

    摘要翻译： 诸如功率模块的电力转换装置可以包括基板（16），第一直流（DC）总线和第二DC总线（22,24）。 功率半导体部件（18,20）可以电耦合到总线中的一个，并且可以设置在物理耦合到基板的基板（12,14）上。 功率半导体部件可以由高温，宽带隙材料制成，并且基板可以基于功率半导体部件的工作温度暴露于热通量。 至少第一电容器（50）可以跨越第一和第二DC总线耦合，并且至少第二和第三电容器（52）可以分别耦合在第一和第二总线中的相应的第一和第二总线上，并且交流（AC）返回 路径。 电容器（50,52）可以各自位于功率模块内部，以建立足够靠近第一功率半导体部件的电路连接，以减少寄生电感的形成，并且还可以分别位于与衬底物理分开的位置，从而不暴露于 热通量。

    COOLING DEVICE FOR A POWER MODULE, AND A RELATED METHOD THEREOF
    9.
    发明申请
    COOLING DEVICE FOR A POWER MODULE, AND A RELATED METHOD THEREOF 有权
    用于功率模块的冷却装置及其相关方法

    公开(公告)号：US20120327603A1

    公开(公告)日：2012-12-27

    申请号：US13168030

    申请日：2011-06-24

    申请人： Richard Alfred Beaupre ,  Joseph Lucian Smolenski ,  William Dwight Gerstler ,  Xiaochun Shen

    发明人： Richard Alfred Beaupre ,  Joseph Lucian Smolenski ,  William Dwight Gerstler ,  Xiaochun Shen

    IPC分类号： H05K7/20 ,  B23P19/00 ,  F28F9/02

    CPC分类号： H01L23/473 ,  H01L2924/0002 ,  Y10T29/49817 ,  H01L2924/00

    摘要： A cooling device for a power module having an electronic module disposed on a base plate via a substrate is disclosed. The cooling device includes a heat sink plate having at least one cooling segment. The cooling segment includes an inlet plenum for entry of a cooling medium, a plurality of inlet manifold channels, a plurality of outlet manifold channels, and an outlet plenum. The plurality of inlet manifold channels are coupled orthogonally to the inlet plenum for receiving the cooling medium from the inlet plenum. The plurality of outlet manifold channels are disposed parallel to the inlet manifold channels. The outlet plenum is coupled orthogonally to the plurality of outlet manifold channels for exhaust of the cooling medium. A plurality of millichannels are disposed in the base plate orthogonally to the inlet and the outlet manifold channels. The plurality of milli channels direct the cooling medium from the plurality of inlet manifold channels to the plurality of outlet manifold channels.

    摘要翻译： 公开了一种具有通过基板设置在基板上的电子模块的功率模块的冷却装置。 冷却装置包括具有至少一个冷却段的散热板。 冷却段包括用于进入冷却介质的入口增压室，多个入口歧管通道，多个出口歧管通道和出口增压室。 多个入口歧管通道正交地连接到入口气室，用于从入口通风室接收冷却介质。 多个出口歧管通道平行于入口歧管通道设置。 出口增压室正交地连接到多个出口歧管通道，用于排出冷却介质。 多个毫通道与入口和出口歧管通道正交地布置在基板中。 多个毫通道将冷却介质从多个入口歧管通道引导到多个出口歧管通道。