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公开(公告)号：US20120200362A1
公开(公告)日：2012-08-09
申请号：US13448261
申请日：2012-04-16
IPC分类号： H03L7/00
摘要： A system and method is disclosed that provides a technique for generating an accurate time base for MEMS sensors and actuators which has a vibrating MEMS structure. The accurate clock is generated from the MEMS oscillations and converted to the usable range by means of a frequency translation circuit.
摘要翻译： 公开了一种系统和方法，其提供了一种用于为具有振动MEMS结构的MEMS传感器和致动器产生精确时基的技术。 精确时钟由MEMS振荡产生，并通过频率转换电路转换成可用的范围。
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公开(公告)号：US20100253437A1
公开(公告)日：2010-10-07
申请号：US12418547
申请日：2009-04-03
IPC分类号： H03L7/00
摘要： A system and method is disclosed that provides a technique for generating an accurate time base for MEMS sensors and actuators which has a vibrating MEMS structure. The accurate clock is generated from the MEMS oscillations and converted to the usable range by means of a frequency translation circuit.
摘要翻译： 公开了一种系统和方法，其提供了一种用于为具有振动MEMS结构的MEMS传感器和致动器产生精确时基的技术。 精确时钟由MEMS振荡产生，并通过频率转换电路转换成可用的范围。
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3.发明申请PERFORMANCE-ENHANCING TWO-SIDED MEMS ANCHOR DESIGN FOR VERTICALLY INTEGRATED MICROMACHINED DEVICES 有权性能增强的两面MEMS锚固设计用于垂直集成的微型设备公开(公告)号：US20100252897A1
公开(公告)日：2010-10-07
申请号：US12418554
申请日：2009-04-03
IPC分类号： H01L29/84
CPC分类号： B81C1/00039 , B81B2203/0307
摘要： An anchoring assembly for anchoring MEMS device is disclosed. The anchoring assembly comprises: a top substrate; a bottom substrate substantially parallel to the top substrate; and a first portion of the anchor between the top substrate and the bottom substrate. The first portion of the anchor is rigidly connected to the top substrate; and the first portion of the anchor is rigidly connected to the bottom substrate. A second portion of the anchor is between the top substrate and the bottom substrate. The second portion of the anchor is rigidly connected to the top substrate; the second portion of the anchor being an anchoring point for the MEMS device. A substantially flexible mechanical element coupling the first portion of the anchor and the second portion of the anchor; the flexible element providing the electrical connection between the first portion of the anchor and the second portion of the anchor.
摘要翻译： 公开了一种用于锚定MEMS装置的锚固组件。 锚固组件包括：顶部基底; 基本上平行于顶部衬底的底部衬底; 以及锚固件在顶部基底和底部基底之间的第一部分。 锚的第一部分刚性地连接到顶部基底; 并且锚的第一部分刚性地连接到底部基底。 锚的第二部分在顶部基底和底部基底之间。 锚的第二部分刚性地连接到顶部基底; 锚的第二部分是用于MEMS装置的锚定点。 将锚固件的第一部分和锚固件的第二部分联接的基本上柔性的机械元件; 所述柔性元件提供所述锚固件的第一部分和所述锚固件的第二部分之间的电连接。
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4.发明申请HERMETICALLY SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT WITH VERTICALLY INTEGRATED ELECTRONICS 审中-公开具有暴露于垂直集成电子环境的部件的密封式MEMS器件公开(公告)号：US20130001550A1
公开(公告)日：2013-01-03
申请号：US13536798
申请日：2012-06-28
申请人： Joseph SEEGER , Igor TCHERTKOV , Hasan AKYOL , Goksen G. YARALIOGLU , Steven S. NASIRI , Ilya GURIN
发明人： Joseph SEEGER , Igor TCHERTKOV , Hasan AKYOL , Goksen G. YARALIOGLU , Steven S. NASIRI , Ilya GURIN
CPC分类号： G01L9/0073 , B81B7/02 , B81B2201/025 , B81B2201/0257 , B81B2201/0264 , B81B2207/015 , B81C99/0045 , B81C2203/0771 , G01L1/142 , G01L5/223 , G01L19/0636 , G01L27/007 , G01P15/125 , G01P2015/084 , H01L2924/16235
摘要： A system and method for providing a MEMS device with integrated electronics are disclosed. The MEMS device comprises an integrated circuit substrate and a MEMS subassembly coupled to the integrated circuit substrate. The integrated circuit substrate includes at least one circuit coupled to at least one fixed electrode. The MEMS subassembly includes at least one standoff formed by a lithographic process, a flexible plate with a top surface and a bottom surface, and a MEMS electrode coupled to the flexible plate and electrically coupled to the at least one standoff. A force acting on the flexible plate causes a change in a gap between the MEMS electrode and the at least one fixed electrode.
摘要翻译： 公开了一种用于向MEMS器件提供集成电子器件的系统和方法。 MEMS器件包括集成电路基板和耦合到集成电路基板的MEMS子组件。 集成电路基板包括耦合到至少一个固定电极的至少一个电路。 MEMS子组件包括由光刻工艺形成的至少一个支座，具有顶表面和底表面的柔性板，以及耦合到柔性板并电耦合到至少一个支座的MEMS电极。 作用在柔性板上的力导致MEMS电极与至少一个固定电极之间的间隙的变化。
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5.发明申请Vertically integrated 3-axis MEMS angular accelerometer with integrated electronics 有权垂直集成的3轴MEMS角加速度计与集成电子公开(公告)号：US20090145225A1
公开(公告)日：2009-06-11
申请号：US11953762
申请日：2007-12-10
IPC分类号： G01P15/02
CPC分类号： G01P15/0888 , B60R2021/01327 , G01P15/0802 , G01P15/125 , G01P15/18
摘要： Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.
摘要翻译： 公开了用于测量围绕三个相互正交的轴X，Y，Z或围绕这些轴的组合的角加速度的传感器。 传感器包括传感器子组件。 传感器子组件还包括基本上平行于X-Y感测平面的基座; 设置在XY感测平面中并被约束以基于X和/或Y和/或Z 1至少一个连杆旋转的检测质量体，并响应于围绕X和/或Y的角加速度和/ 或Z方向。 最后，传感器在基板处包括至少一个电极或垂直于基板，以及至少一个传感器，用于响应于角加速度的传感器子组件的每个感测方向。 通过调整弯曲和电极的配置可实现多轴检测。
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6.发明申请INTEGRATED HEATER ON MEMS CAP FOR WAFER SCALE PACKAGED MEMS SENSORS 有权集成加热器在MEMS封装的WAFER SCALE包装MEMS传感器公开(公告)号：US20130001765A1
公开(公告)日：2013-01-03
申请号：US13527497
申请日：2012-06-19
申请人： Goksen G. YARALIOGLU , Martin LIM
发明人： Goksen G. YARALIOGLU , Martin LIM
CPC分类号： B81B7/0087 , B81B2207/012 , B81C1/0069 , H01L23/345 , H01L24/48 , H01L2224/48091 , H01L2924/00014 , H01L2924/01322 , H01L2924/1461 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A system and method for controlling temperature of a MEMS sensor are disclosed. In a first aspect, the system comprises a MEMS cap encapsulating the MEMS sensor and a CMOS die vertically arranged to the MEMS cap. The system includes a heater integrated into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor. In a second aspect, the method comprises encapsulating the MEMS sensor with a MEMS cap and coupling a CMOS die to the MEMS cap. The method includes integrating a heater into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor.
摘要翻译： 公开了一种用于控制MEMS传感器的温度的系统和方法。 在第一方面，该系统包括封装MEMS传感器的MEMS盖和垂直地布置到MEMS盖的CMOS模头。 该系统包括集成到MEMS盖中的加热器。 集成加热器被激活以控制MEMS传感器的温度。 在第二方面，该方法包括用MEMS盖封装MEMS传感器，并将CMOS管芯耦合到MEMS盖。 该方法包括将加热器集成到MEMS盖中。 集成加热器被激活以控制MEMS传感器的温度。
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