Nonvolatile memory device and method of fabricating the same
    2.
    发明申请
    Nonvolatile memory device and method of fabricating the same 审中-公开
    非易失性存储器件及其制造方法

    公开(公告)号:US20060186462A1

    公开(公告)日:2006-08-24

    申请号:US11357329

    申请日:2006-02-21

    IPC分类号: H01L29/788

    摘要: Provided are example embodiments of fabrication methods and resulting structures suitable for use in nonvolatile memory devices formed on semiconductor substrates. The example embodiments of the gate structures include a first insulating film formed on the semiconductor substrate, a storage node formed on the first insulating film for storing charges, a second insulating film formed on the storage node, a third insulating film formed on the second insulating film, and a gate electrode formed on the third insulating film. The insulating films are selected whereby the dielectric constant of one or both of the second and third insulating films is greater than the dielectric constant of the first insulating film.

    摘要翻译: 提供了适用于形成在半导体衬底上的非易失性存储器件中的制造方法和结果结构的示例性实施例。 栅极结构的示例实施例包括形成在半导体衬底上的第一绝缘膜,形成在用于存储电荷的第一绝缘膜上的存储节点,形成在存储节点上的第二绝缘膜,形成在第二绝缘层上的第三绝缘膜 膜和形成在第三绝缘膜上的栅电极。 选择绝缘膜,由此第二和第三绝缘膜中的一个或两个的介电常数大于第一绝缘膜的介电常数。

    CMOS thin film transistor comprising common gate, logic device comprising the CMOS thin film transistor, and method of manufacturing the CMOS thin film transistor
    7.
    发明授权
    CMOS thin film transistor comprising common gate, logic device comprising the CMOS thin film transistor, and method of manufacturing the CMOS thin film transistor 有权
    包括公共栅极的CMOS薄膜晶体管,包括CMOS薄膜晶体管的逻辑器件和制造CMOS薄膜晶体管的方法

    公开(公告)号:US07432554B2

    公开(公告)日:2008-10-07

    申请号:US11305394

    申请日:2005-12-16

    IPC分类号: H01L27/08

    CPC分类号: H01L21/84 H01L27/1203

    摘要: A complementary metal oxide semiconductor (CMOS) thin film transistor including a common gate, a logic device including the CMOS thin film transistor, and a method of manufacturing the CMOS thin film transistor are provided. In one embodiment, the CMOS thin film transistor includes a base substrate and a semiconductor layer formed on the base substrate. A PMOS transistor and an NMOS transistor are formed on a single semiconductor layer to intersect each other, and a common gate is formed on the intersection area. In addition, a Schottky barrier inducing material layer is formed on a source and a drain of the PMOS transistor.

    摘要翻译: 提供了包括公共栅极的互补金属氧化物半导体(CMOS)薄膜晶体管,包括CMOS薄膜晶体管的逻辑器件和制造CMOS薄膜晶体管的方法。 在一个实施例中,CMOS薄膜晶体管包括基底基板和形成在基底基板上的半导体层。 PMOS晶体管和NMOS晶体管形成在单个半导体层上以彼此相交,并且在交叉区域上形成公共栅极。 此外,在PMOS晶体管的源极和漏极上形成肖特基势垒诱导材料层。

    CMOS thin film transistor comprising common gate, logic device comprising the CMOS thin film transistor, and method of manufacturing the CMOS thin film transistor
    8.
    发明申请
    CMOS thin film transistor comprising common gate, logic device comprising the CMOS thin film transistor, and method of manufacturing the CMOS thin film transistor 有权
    包括公共栅极的CMOS薄膜晶体管,包括CMOS薄膜晶体管的逻辑器件和制造CMOS薄膜晶体管的方法

    公开(公告)号:US20060131653A1

    公开(公告)日:2006-06-22

    申请号:US11305394

    申请日:2005-12-16

    IPC分类号: H01L27/12 H01L21/84

    CPC分类号: H01L21/84 H01L27/1203

    摘要: A complementary metal oxide semiconductor (CMOS) thin film transistor including a common gate, a logic device including the CMOS thin film transistor, and a method of manufacturing the CMOS thin film transistor are provided. In one embodiment, the CMOS thin film transistor includes a base substrate and a semiconductor layer formed on the base substrate. A PMOS transistor and an NMOS transistor are formed on a single semiconductor layer to intersect each other, and a common gate is formed on the intersection area. In addition, a Schottky barrier inducing material layer is formed on a source and a drain of the PMOS transistor.

    摘要翻译: 提供了包括公共栅极的互补金属氧化物半导体(CMOS)薄膜晶体管,包括CMOS薄膜晶体管的逻辑器件和制造CMOS薄膜晶体管的方法。 在一个实施例中,CMOS薄膜晶体管包括基底基板和形成在基底基板上的半导体层。 PMOS晶体管和NMOS晶体管形成在单个半导体层上以彼此相交,并且在交叉区域上形成公共栅极。 此外,在PMOS晶体管的源极和漏极上形成肖特基势垒诱导材料层。