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1.发明申请公开(公告)号：US20120199625A1
公开(公告)日：2012-08-09
申请号：US13021399
申请日：2011-02-04
申请人： Jun Qi , Wayne H. Fu , Chenhui Wang , Kuanying Lin , Nathan K. Gupta , Victor H. Yin
发明人： Jun Qi , Wayne H. Fu , Chenhui Wang , Kuanying Lin , Nathan K. Gupta , Victor H. Yin
CPC分类号： B26D3/08 , B26F3/002 , B28D1/222 , B28D1/225 , Y10T225/12 , Y10T225/321
摘要： Layers of material such as glass layers for displays may be cut using scribing and breaking techniques. Scribing-and-breaking equipment may include a scribe tip that forms a loop-shaped scribe line in the surface of a layer of material. The loop-shaped scribe line may have a rectangular shape with four straight sides and four rounded corners. A breaking structure such as a rectangular ring-shaped metal break frame with rounded corners may be configured to match the shape of the scribe line. During breaking operations, the layer of material may be supported on a support structure. The support structure may have a flexible material such as an elastomer and a lower-friction coating layer such as a polytetrafluoroethylene coating. The break frame may be aligned with the scribe line and may be used to press down on the layer of material, thereby breaking the layer of material along the scribe line.
摘要翻译： 诸如用于显示器的玻璃层的材料层可以使用划线和断裂技术进行切割。 划痕破碎设备可能包括在一层材料表面形成环形划线的划痕。 环形划线可以具有四个直边和四个圆角的矩形形状。 诸如具有圆角的矩形环形金属断裂框架的断裂结构可以被配置成与划线的形状相匹配。 在断裂操作期间，材料层可以被支撑在支撑结构上。 支撑结构可以具有柔性材料，例如弹性体和诸如聚四氟乙烯涂层的低摩擦涂层。 断裂框架可以与划线对准，并且可以用于向下按压材料层，从而沿着划线断裂材料层。
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公开(公告)号：US08801889B2
公开(公告)日：2014-08-12
申请号：US13021526
申请日：2011-02-04
申请人： Jun Qi , Wayne H. Fu , Chenhui Wang , Kuanying Lin , Nathan K. Gupta , Victor H. Yin , Silvio Grespan
发明人： Jun Qi , Wayne H. Fu , Chenhui Wang , Kuanying Lin , Nathan K. Gupta , Victor H. Yin , Silvio Grespan
IPC分类号： B32B38/00 , B32B38/04 , B32B38/10 , G02F1/1333 , B26F3/00
CPC分类号： B26F3/00 , G02F1/133351 , Y10T83/0591 , Y10T156/1052 , Y10T156/1056 , Y10T156/1057 , Y10T156/1062
摘要： Structures such as display structures and other electronic device structures may be shaped using water jet cutting equipment. The water jet cutting equipment may be used to produce a water jet. The water jet may be used to cut layer of material such as display layers and other structures. Water jet cutting may form edge cuts, cuts for openings in the structures, chamfers, and other features. Multiple layers may be simultaneously cut using water jet cutting. Positioning equipment may be used to control the position of a workpiece relative to a water jet nozzle. The positioning equipment may be controlled using a control unit. During water jet cutting operations, the workpiece may be trimmed, openings may be formed, and features such as chamfers may be created. A workpiece may include a cover glass, a color filter array, a thin-film transistor layer, and other display layers and device structures.
摘要翻译： 诸如显示结构和其他电子设备结构的结构可以使用水射流切割设备成型。 喷水切割设备可用于生产水射流。 水射流可用于切割诸如显示层和其它结构的材料层。 水射流切割可以形成边缘切割，用于结构中的开口的切口，倒角和其它特征。 可以使用水射流切割同时切割多层。 定位设备可用于控制工件相对于喷水嘴的位置。 定位设备可以使用控制单元进行控制。 在水射流切割操作期间，可以修剪工件，可以形成开口，并且可能产生诸如倒角的特征。 工件可以包括盖玻璃，滤色器阵列，薄膜晶体管层以及其它显示层和器件结构。
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公开(公告)号：US08482713B2
公开(公告)日：2013-07-09
申请号：US13021183
申请日：2011-02-04
申请人： Jun Qi , Wayne H. Fu , Chenhui Wang , Kuanying Lin , Nathan K. Gupta , Victor H. Yin
发明人： Jun Qi , Wayne H. Fu , Chenhui Wang , Kuanying Lin , Nathan K. Gupta , Victor H. Yin
CPC分类号： B23K26/38 , B23K26/0876 , B23K26/103 , B23K26/402 , B23K2103/42 , B23K2103/50 , B29C2793/0027 , B32B38/105 , Y10T156/108 , Y10T156/1348
摘要： Electronic devices may be provided with display structures such as glass and polymer layers in a liquid crystal display. The glass layers may serve as substrates for components such as a color filter layer and thin-film transistor layer. The polymer layers may include films such as a polarizer film and other optical films. During fabrication of a display, the polymer layers and glass layers may be laminated to one another. Portions of the polymer layers may extend past the edges of the glass layers. Laser cutting techniques may be used to trim away excess portions of the polymer layer that do not overlap underlying portions of the glass layers. Laser cutting may involve application of an adjustable infrared laser beam.
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公开(公告)号：US20120200812A1
公开(公告)日：2012-08-09
申请号：US13021183
申请日：2011-02-04
申请人： Jun Qi , Wayne H. Fu , Chenhui Wang , Kuanying Lin , Nathan K. Gupta , Victor H. Yin
发明人： Jun Qi , Wayne H. Fu , Chenhui Wang , Kuanying Lin , Nathan K. Gupta , Victor H. Yin
IPC分类号： G02F1/1335 , B29D11/00 , B32B38/04 , B23K26/38
CPC分类号： B23K26/38 , B23K26/0876 , B23K26/103 , B23K26/402 , B23K2103/42 , B23K2103/50 , B29C2793/0027 , B32B38/105 , Y10T156/108 , Y10T156/1348
摘要： Electronic devices may be provided with display structures such as glass and polymer layers in a liquid crystal display. The glass layers may serve as substrates for components such as a color filter layer and thin-film transistor layer. The polymer layers may include films such as a polarizer film and other optical films. During fabrication of a display, the polymer layers and glass layers may be laminated to one another. Portions of the polymer layers may extend past the edges of the glass layers. Laser cutting techniques may be used to trim away excess portions of the polymer layer that do not overlap underlying portions of the glass layers. Laser cutting may involve application of an adjustable infrared laser beam.
摘要翻译： 电子设备可以在液晶显示器中提供诸如玻璃和聚合物层的显示结构。 玻璃层可以用作诸如滤色器层和薄膜晶体管层的部件的基板。 聚合物层可以包括诸如偏振膜和其它光学膜的膜。 在制造显示器期间，聚合物层和玻璃层可以彼此层压。 聚合物层的一部分可以延伸超过玻璃层的边缘。 可以使用激光切割技术来修剪不与玻璃层的下面部分重叠的聚合物层的多余部分。 激光切割可涉及应用可调节的红外激光束。
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公开(公告)号：US20120200480A1
公开(公告)日：2012-08-09
申请号：US13021526
申请日：2011-02-04
申请人： Jun Qi , Wayne H. Fu , Chenhui Wang , Kuanying Lin , Nathan K. Gupta , Victor H. Yin , Silvio Grespan
发明人： Jun Qi , Wayne H. Fu , Chenhui Wang , Kuanying Lin , Nathan K. Gupta , Victor H. Yin , Silvio Grespan
CPC分类号： B26F3/00 , G02F1/133351 , Y10T83/0591 , Y10T156/1052 , Y10T156/1056 , Y10T156/1057 , Y10T156/1062
摘要： Structures such as display structures and other electronic device structures may be shaped using water jet cutting equipment. The water jet cutting equipment may be used to produce a water jet. The water jet may be used to cut layer of material such as display layers and other structures. Water jet cutting may form edge cuts, cuts for openings in the structures, chamfers, and other features. Multiple layers may be simultaneously cut using water jet cutting. Positioning equipment may be used to control the position of a workpiece relative to a water jet nozzle. The positioning equipment may be controlled using a control unit. During water jet cutting operations, the workpiece may be trimmed, openings may be formed, and features such as chamfers may be created. A workpiece may include a cover glass, a color filter array, a thin-film transistor layer, and other display layers and device structures.
摘要翻译： 诸如显示结构和其他电子设备结构的结构可以使用水射流切割设备成型。 喷水切割设备可用于生产水射流。 水射流可用于切割诸如显示层和其它结构的材料层。 水射流切割可以形成边缘切割，用于结构中的开口的切口，倒角和其它特征。 可以使用水射流切割同时切割多层。 定位设备可用于控制工件相对于喷水嘴的位置。 定位设备可以使用控制单元进行控制。 在水射流切割操作期间，可以修剪工件，可以形成开口，并且可能产生诸如倒角的特征。 工件可以包括盖玻璃，滤色器阵列，薄膜晶体管层以及其它显示层和器件结构。
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