公开(公告)号：US06884984B2

公开(公告)日：2005-04-26

申请号：US10755809

申请日：2004-01-12

申请人： Jun Ye ,  R. Fabian W. Pease ,  Xun Chen

发明人： Jun Ye ,  R. Fabian W. Pease ,  Xun Chen

IPC分类号： G01N21/956 ,  G01J1/02 ,  G01J1/04 ,  G01M11/00 ,  G03F1/08 ,  G03F7/20 ,  H01L21/027 ,  H01L27/14 ,  H01L27/00

CPC分类号： G03F7/7085 ,  G03F7/70591 ,  G03F7/7065

摘要： In one aspect, the present invention is a technique of, and a system and sensor for measuring, inspecting, characterizing and/or evaluating optical lithographic equipment, methods, and/or materials used therewith, for example, photomasks. In one embodiment, the system, sensor and technique measures, collects and/or detects an aerial image (or portion thereof) produced or generated by the interaction between the photomask and lithographic equipment. An image sensor unit may measure, collect, sense and/or detect the aerial image in situ—that is, the aerial image at the wafer plane produced, in part, by a production-type photomask (i.e., a wafer having integrated circuits formed during the integrated circuit fabrication process) and/or by associated lithographic equipment used, or to be used, to manufacture of integrated circuits. A processing unit, coupled to the image sensor unit, may measure the critical dimensions of features of the photomask, using data which is representative of the intensity of light sampled by the image sensor unit, to control at least one operating parameter of the lithographic equipment.

摘要翻译： 一方面，本发明是用于测量，检查，表征和/或评估与其一起使用的光学平版印刷设备，方法和/或材料的技术，以及系统和传感器，例如光掩模。 在一个实施例中，系统，传感器和技术测量，收集和/或检测由光掩模和光刻设备之间的相互作用产生或产生的空间图像（或其部分）。 图像传感器单元可以原位测量，收集，感测和/或检测空中图像，即，晶片平面上的空间图像，部分地由生产型光掩模（即，已形成集成电路的晶片 在集成电路制造工艺期间）和/或通过使用或被使用的相关光刻设备来制造集成电路。 耦合到图像传感器单元的处理单元可以使用表示由图像传感器单元采样的光的强度的数据来测量光掩模的特征的关键尺寸，以控制光刻设备的至少一个操作参数 。

公开(公告)号：US06806456B1

公开(公告)日：2004-10-19

申请号：US10646313

申请日：2003-08-22

申请人： Jun Ye ,  R. Fabian W. Pease ,  Xun Chen

发明人： Jun Ye ,  R. Fabian W. Pease ,  Xun Chen

IPC分类号： H01L2700

CPC分类号： G03F7/7085 ,  G03F7/70591 ,  G03F7/7065

摘要： In one aspect, the present invention is a technique of, and a system and sensor for measuring, inspecting, characterizing and/or evaluating optical lithographic equipment, methods, and/or materials used therewith, for example, photomasks. In one embodiment, the system, sensor and technique measures, collects and/or detects an aerial image produced or generated by the interaction between the photomask and lithographic equipment. An image sensor unit may measure, collect, sense and/or detect the aerial image in situ—that is, the aerial image at the wafer plane produced, in part, by a product-type photomask (i.e., a wafer having integrated circuits formed during the integrated circuit fabrication process) and/or by associated lithographic equipment used, or to be used, to manufacture of integrated circuits. In this way, the aerial image used, generated or produced to measure, inspect, characterize and/or evaluate the photomask is the same aerial image used, generated or produced during wafer exposure in integrated circuit manufacturing. In another embodiment, the system, sensor and technique characterizes and/or evaluates the performance of the optical lithographic equipment, for example, the optical sub-system of such equipment. In this regard, in one embodiment, an image sensor unit measures, collects, senses and/or detects the aerial image produced or generated by the interaction between lithographic equipment and a photomask having a known, predetermined or fixed pattern (i.e., test mask). In this way, the system, sensor and technique collects, senses and/or detects the aerial image produced or generated by the test mask—lithographic equipment in order to inspect, evaluate and/or characterize the performance of the lithographic equipment.

摘要翻译： 一方面，本发明是用于测量，检查，表征和/或评估与其一起使用的光学平版印刷设备，方法和/或材料的技术，以及系统和传感器，例如光掩模。 在一个实施例中，系统，传感器和技术测量，收集和/或检测由光掩模和光刻设备之间的相互作用产生或产生的空间图像。 图像传感器单元可以在原位测量，收集，感测和/或检测空中图像，即晶片平面上的空间图像，部分地由产品型光掩模（即，形成集成电路的晶片 在集成电路制造工艺期间）和/或通过使用或被使用的相关光刻设备来制造集成电路。 以这种方式，使用，生成或产生用于测量，检查，表征和/或评估光掩模的空间图像是在集成电路制造期间的晶片曝光期间使用，产生或产生的相同的空间图像。在另一个实施例中，系统，传感器 并且技术表征和/或评估光学平版印刷设备（例如，这种设备的光学子系统）的性能。 在这方面，在一个实施例中，图像传感器单元测量，收集，感测和/或检测由光刻设备和具有已知的，预定的或固定的图案（即，测试掩模）的光掩模之间的相互作用产生或产生的空间图像， 。 以这种方式，系统，传感器和技术收集，感测和/或检测由测试掩模 - 光刻设备产生或产生的空间图像，以便检查，评估和/或表征平版印刷设备的性能。

公开(公告)号：US06969837B2

公开(公告)日：2005-11-29

申请号：US10863915

申请日：2004-06-09

申请人： Jun Ye ,  R. Fabian W. Pease ,  Xun Chen

发明人： Jun Ye ,  R. Fabian W. Pease ,  Xun Chen

IPC分类号： G01N21/956 ,  G01J1/02 ,  G01J1/04 ,  G01M11/00 ,  G03F1/08 ,  G03F7/20 ,  H01L21/027 ,  H01L27/14 ,  H01L27/00

CPC分类号： G03F7/7085 ,  G03F7/70591 ,  G03F7/7065

摘要： A system and sensor for measuring, inspecting, characterizing, evaluating and/or controlling optical lithographic equipment and/or materials used therewith, for example, photomasks. In one embodiment, the system and sensor measures, collects and/or detects an aerial image (or portion thereof) produced or generated by the interaction between the photomask and lithographic equipment. An image sensor unit may measure, collect, sense and/or detect the aerial image in situ—that is, the aerial image at the wafer plane produced, in part, by a production-type photomask (i.e., a wafer having integrated circuits formed therein/thereon) and/or by associated lithographic equipment used, or to be used, to manufacture of integrated circuits. A processing unit, coupled to the image sensor unit, may generate image data which is representative of the aerial image by interleaving the intensity of light sampled by each sensor cell at the plurality of location of the platform.

摘要翻译： 用于测量，检查，表征，评估和/或控制与其一起使用的光学平版印刷设备和/或材料的系统和传感器，例如光掩模。 在一个实施例中，系统和传感器测量，收集和/或检测由光掩模和光刻设备之间的相互作用产生或产生的空间图像（或其部分）。 图像传感器单元可以原位测量，收集，感测和/或检测空中图像，即在晶片平面上的部分由生产型光掩模（即，形成有集成电路的晶片）产生的空间图像 其中/之上）和/或通过使用或用于制造集成电路的相关平版印刷设备。 耦合到图像传感器单元的处理单元可以通过交织由平台的多个位置处的每个传感器单元采样的光的强度来生成代表空间图像的图像数据。

公开(公告)号：US06828542B2

公开(公告)日：2004-12-07

申请号：US10390806

申请日：2003-03-18

申请人： Jun Ye ,  R. Fabian W. Pease ,  Xun Chen

发明人： Jun Ye ,  R. Fabian W. Pease ,  Xun Chen

IPC分类号： H01L2700

CPC分类号： G03F7/7085 ,  G03F7/70591 ,  G03F7/7065

摘要： In one aspect, the present invention is a technique of, and a system and sensor for measuring, inspecting, characterizing and/or evaluating optical lithographic equipment, methods, and/or materials used therewith, for example, photomasks. In one embodiment of this aspect of the invention, the system, sensor and/or technique measures, collects and/or detects an aerial image produced or generated by the interaction between the photomask and lithographic equipment. An image sensor unit may measure, collect, sense and/or detect the aerial image in situ—that is, the aerial image at the wafer plane produced, in part, by a production-type photomask (i.e., a wafer having integrated circuits formed during the integrated circuit fabrication process) and/or by associated lithographic equipment used, or to be used, to manufacture of integrated circuits.

摘要翻译： 一方面，本发明是用于测量，检查，表征和/或评估与其一起使用的光学平版印刷设备，方法和/或材料的技术，以及系统和传感器，例如光掩模。 在本发明的该方面的一个实施例中，系统，传感器和/或技术测量，收集和/或检测由光掩模和光刻设备之间的相互作用产生或产生的空间图像。 图像传感器单元可以原位测量，收集，感测和/或检测空中图像，即，晶片平面上的空间图像，部分地由生产型光掩模（即，已形成集成电路的晶片 在集成电路制造工艺期间）和/或通过使用或被使用的相关光刻设备来制造集成电路。

公开(公告)号：US07053355B2

公开(公告)日：2006-05-30

申请号：US11212308

申请日：2005-08-25

申请人： Jun Ye ,  R. Fabian W. Pease ,  Xun Chen

发明人： Jun Ye ,  R. Fabian W. Pease ,  Xun Chen

IPC分类号： H01L27/00

CPC分类号： G03F1/84 ,  G03F7/70591 ,  G03F7/70666 ,  G03F7/7085 ,  H01L21/67253

摘要： A system and sensor for measuring, inspecting, characterizing, evaluating and/or controlling optical lithographic equipment and/or materials used therewith, for example, photomasks. In one embodiment, the system and sensor measures, collects and/or detects an aerial image (or portion thereof) produced or generated by the interaction between the photomask and lithographic equipment. An image sensor unit may measure, collect, sense and/or detect the aerial image in situ—that is, the aerial image at the wafer plane produced, in part, by a production-type photomask (i.e., a wafer having integrated circuits formed therein/thereon) and/or by associated lithographic equipment used, or to be used, to manufacture of integrated circuits. A processing unit, coupled to the image sensor unit, may generate image data which is representative of the aerial image by, in one embodiment, interleaving the intensity of light sampled by each sensor cell at the plurality of location of the platform. Notably, there are many inventions/embodiments disclosed herein.

摘要翻译： 用于测量，检查，表征，评估和/或控制与其一起使用的光学平版印刷设备和/或材料的系统和传感器，例如光掩模。 在一个实施例中，系统和传感器测量，收集和/或检测由光掩模和光刻设备之间的相互作用产生或产生的空间图像（或其部分）。 图像传感器单元可以原位测量，收集，感测和/或检测空中图像，即，晶片平面上的空间图像，部分地由生产型光掩模（即，已形成集成电路的晶片 其中/之上）和/或通过使用或用于制造集成电路的相关平版印刷设备。 耦合到图像传感器单元的处理单元可以在一个实施例中，通过在平台的多个位置交织由每个传感器单元采样的光的强度来生成代表空中图像的图像数据。 值得注意的是，本文公开了许多发明/实施例。

公开(公告)号：US06969864B2

公开(公告)日：2005-11-29

申请号：US10873539

申请日：2004-06-21

申请人： Jun Ye ,  R. Fabian W. Pease ,  Xun Chen

发明人： Jun Ye ,  R. Fabian W. Pease ,  Xun Chen

IPC分类号： G01N21/956 ,  G01J1/02 ,  G01J1/04 ,  G01M11/00 ,  G03F1/08 ,  G03F7/20 ,  H01L21/027 ,  H01L27/14 ,  G01N21/86

CPC分类号： G03F7/7085 ,  G03F7/70591 ,  G03F7/7065

摘要： A system and sensor for measuring, inspecting, characterizing, evaluating and/or controlling optical lithographic equipment and/or materials used therewith, for example, photomasks. In one embodiment, the system and sensor measures, collects and/or detects an aerial image (or portion thereof) produced or generated by the interaction between the photomask and lithographic equipment. An image sensor unit may measure, collect, sense and/or detect the aerial image in situ—that is, the aerial image at the wafer plane produced, in part, by a production-type photomask (i.e., a wafer having integrated circuits formed therein/thereon) and/or by associated lithographic equipment used, or to be used, to manufacture of integrated circuits. A processing unit, coupled to the image sensor unit, may generate image data which is representative of the aerial image by, in one embodiment, interleaving the intensity of light sampled by each sensor cell at the plurality of location of the platform. Notably, many inventions/embodiments are disclosed herein.

摘要翻译： 用于测量，检查，表征，评估和/或控制与其一起使用的光学平版印刷设备和/或材料的系统和传感器，例如光掩模。 在一个实施例中，系统和传感器测量，收集和/或检测由光掩模和光刻设备之间的相互作用产生或产生的空间图像（或其部分）。 图像传感器单元可以原位测量，收集，感测和/或检测空中图像，即，晶片平面上的空间图像，部分地由生产型光掩模（即，已形成集成电路的晶片 其中/之上）和/或通过使用或用于制造集成电路的相关平版印刷设备。 耦合到图像传感器单元的处理单元可以在一个实施例中，通过在平台的多个位置交织由每个传感器单元采样的光的强度来生成代表空中图像的图像数据。 值得注意的是，本文公开了许多发明/实施例。

公开(公告)号：US06803554B2

公开(公告)日：2004-10-12

申请号：US10703732

申请日：2003-11-07

申请人： Jun Ye ,  R. Fabian W. Pease ,  Xun Chen

发明人： Jun Ye ,  R. Fabian W. Pease ,  Xun Chen

IPC分类号： H01L2700

CPC分类号： G03F7/7085 ,  G03F7/70591 ,  G03F7/7065

摘要： In one aspect, the present invention is a technique of, and a system and sensor for measuring, inspecting, characterizing and/or evaluating optical lithographic equipment, methods, and/or materials used therewith, for example, photomasks. In one embodiment of this aspect of the invention, the system, sensor and technique measures, collects and/or detects an aerial image produced or generated by the interaction between the photomask and lithographic equipment. An image sensor unit may measure, collect, sense and/or detect the aerial image in situ—that is, the aerial image at the wafer plane produced, in part, by a product-type photomask (i.e., a wafer having integrated circuits formed during the integrated circuit fabrication process) and/or by associated lithographic equipment used, or to be used, to manufacture of integrated circuits.

摘要翻译： 一方面，本发明是用于测量，检查，表征和/或评估与其一起使用的光学平版印刷设备，方法和/或材料的技术，以及系统和传感器，例如光掩模。 在本发明的该方面的一个实施例中，系统，传感器和技术测量，收集和/或检测由光掩模和光刻设备之间的相互作用产生或产生的空间图像。 图像传感器单元可以在原位测量，收集，感测和/或检测空中图像，即晶片平面上的空间图像，部分地由产品型光掩模（即，形成集成电路的晶片 在集成电路制造工艺期间）和/或通过使用或被使用的相关光刻设备来制造集成电路。

公开(公告)号：US06906305B2

公开(公告)日：2005-06-14

申请号：US10337510

申请日：2003-01-07

申请人： R. Fabian W. Pease ,  Jun Ye

发明人： R. Fabian W. Pease ,  Jun Ye

IPC分类号： G03F1/00 ,  G03F7/20 ,  H01L21/027 ,  H01L27/00

CPC分类号： G03F7/7085 ,  G03F1/84 ,  G03F7/70591 ,  G03F7/7065 ,  G03F7/70666 ,  G03F9/7069

摘要： A system to sense an aerial image produced by optical equipment used in, for example, semiconductor fabrication. In one embodiment, the system includes a photo-electron emission device which, in response to an aerial image projected thereon, emits electrons in a pattern corresponding to the light intensity distribution produced by the aerial image. Electron optics provides an enlarged pattern of the pattern in which the electrons are emitted. A sensing unit senses the enlarged pattern. In another embodiment, the system employs a photo-conducting layer to project the aerial image thereon. The photo-conducting layer, in response to the projection of the aerial image thereon, produces local charge depletion corresponding to the light intensity distribution. A steering device delivers electrons to the photo-conducting layer to produce local re-charging currents in proportion to the local charge depletion. A pattern corresponding to the aerial image may be obtained from the re-charging currents.

摘要翻译： 用于感测由例如半导体制造中使用的光学设备产生的空间图像的系统。 在一个实施例中，该系统包括光电子发射装置，其响应于其上投影的空中图像以对应于由空间图像产生的光强度分布的图案发射电子。 电子光学器件提供了发射电子的图案的放大图案。 感测单元感测放大的图案。 在另一个实施例中，该系统采用光导层在其上投影空中图像。 响应于其上的空间图像的投影，光导层产生对应于光强度分布的局部电荷消耗。 转向装置将电子传递到光导层以产生与局部电荷消耗成比例的局部再充电电流。 可以从再充电电流获得与空间图像相对应的图案。

公开(公告)号：US20120021343A1

公开(公告)日：2012-01-26

申请号：US13244218

申请日：2011-09-23

申请人： Jun Ye ,  Moshe E. Preil ,  Xun Chen ,  Shauh-Teh Juang ,  James Wiley

发明人： Jun Ye ,  Moshe E. Preil ,  Xun Chen ,  Shauh-Teh Juang ,  James Wiley

IPC分类号： G03F1/00

CPC分类号： G03F7/70641 ,  G03F1/44 ,  G03F7/705 ,  G03F7/70625

摘要： A method for identifying process window signature patterns in a device area of a mask is disclosed. The signature patterns collectively provide a unique response to changes in a set of process condition parameters to the lithography process. The signature patterns enable monitoring of associated process condition parameters for signs of process drift, analyzing of the process condition parameters to determine which are limiting and affecting the chip yields, analyzing the changes in the process condition parameters to determine the corrections that should be fed back into the lithography process or forwarded to an etch process, identifying specific masks that do not transfer the intended pattern to wafers as intended, and identifying groups of masks that share common characteristics and behave in a similar manner with respect to changes in process condition parameters when transferring the pattern to the wafer.

摘要翻译： 公开了一种用于识别掩模的设备区域中的处理窗口签名图案的方法。 签名图案集合地提供了对一组工艺条件参数对光刻工艺的变化的唯一响应。 签名模式可以监控相关的过程状态参数，以了解过程漂移的迹象，分析过程状态参数，以确定哪些是限制和影响芯片产量，分析过程状态参数的变化以确定应反馈的校正 进入光刻工艺或转发到蚀刻工艺，识别不按照预期将预期图案转印到晶片的特定掩模，以及鉴定相对于工艺条件参数的变化共享共同特性并以类似方式表现的掩模组， 将图案转移到晶片。

公开(公告)号：US20100151364A1

公开(公告)日：2010-06-17

申请号：US12660313

申请日：2010-02-23

申请人： Jun Ye ,  Moshe E. Preil ,  Xun Chen ,  Shauh-Teh Juang ,  James Wiley

发明人： Jun Ye ,  Moshe E. Preil ,  Xun Chen ,  Shauh-Teh Juang ,  James Wiley

IPC分类号： G03F1/00

CPC分类号： G03F7/70641 ,  G03F1/44 ,  G03F7/705 ,  G03F7/70625

摘要： A method for identifying process window signature patterns in a device area of a mask is disclosed. The signature patterns collectively provide a unique response to changes in a set of process condition parameters to the lithography process. The signature patterns enable monitoring of associated process condition parameters for signs of process drift, analyzing of the process condition parameters to determine which are limiting and affecting the chip yields, analyzing the changes in the process condition parameters to determine the corrections that should be fed back into the lithography process or forwarded to an etch process, identifying specific masks that do not transfer the intended pattern to wafers as intended, and identifying groups of masks that share common characteristics and behave in a similar manner with respect to changes in process condition parameters when transferring the pattern to the wafer.