公开(公告)号：US20080093739A1

公开(公告)日：2008-04-24

申请号：US11873618

申请日：2007-10-17

申请人： Junichi KIMURA ,  Hideki Niimi ,  Yuji Fuwa ,  Tsuyoshi Sakaue

发明人： Junichi KIMURA ,  Hideki Niimi ,  Yuji Fuwa ,  Tsuyoshi Sakaue

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H01L21/563 ,  H01L23/3135 ,  H01L23/3142 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/023 ,  H05K3/305 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.

摘要翻译： 根据本发明的半导体安装基板包括：基板; 安装在该基板上的半导体器件; 焊料凸块，其连接半导体器件和衬底; 填充在半导体器件和衬底之间的空间中的第一树脂; 以及安装在半导体装置的半导体装置的正面侧的电子部件，其中，接合强度增强树脂部至少设置在半导体装置的角部附近的侧面和 所述基板处于与所述角部对应的位置。

公开(公告)号：US20100146779A1

公开(公告)日：2010-06-17

申请号：US12709575

申请日：2010-02-22

申请人： Kazuhiko HONJO ,  Toshihiko MORI ,  Eiji KAWAMOTO ,  Junichi KIMURA ,  Motoyoshi KITAGAWA

发明人： Kazuhiko HONJO ,  Toshihiko MORI ,  Eiji KAWAMOTO ,  Junichi KIMURA ,  Motoyoshi KITAGAWA

IPC分类号： H05K3/30

CPC分类号： H05K1/186 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K3/284 ,  H05K3/4652 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2224/0401

摘要： A component-embedded printed wiring board (PWB) is disclosed. This PWB includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any air, and the reliable PWB is thus obtainable.

摘要翻译： 公开了一种组件嵌入式印刷电路板（PWB）。 该PWB包括（a）在与电子部件相对应的位置处形成的流体树脂嵌入部，使得嵌入部覆盖电子部件，（b）与电路基板的顶面平行设置的树脂流速加速器 并且包围所述嵌入部分，以及（c）至少在所述加速器和所述电路板之间配置树脂。 流体树脂嵌入部分填充与粘合树脂相同的树脂。 这种结构允许加速器在施加到PWB上的压力下压缩树脂，使得树脂趋于沿着电路板流动。 结果，流体树脂嵌入部分被树脂充分填充而不会留下任何空气，从而可获得可靠的PWB。