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公开(公告)号：US20120304460A1
公开(公告)日：2012-12-06
申请号：US13589782
申请日：2012-08-20
申请人： Jun'ichi Kimura , Tomohide Ogura , Takayuki Hiruma , Masahisa Nakaguchi , Misao Kanba , Motoyoshi Kitagawa
发明人： Jun'ichi Kimura , Tomohide Ogura , Takayuki Hiruma , Masahisa Nakaguchi , Misao Kanba , Motoyoshi Kitagawa
CPC分类号： H01L24/97 , H01L21/561 , H01L21/568 , H01L23/3121 , H01L23/552 , H01L24/16 , H01L24/48 , H01L2224/13111 , H01L2224/13139 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/81815 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/181 , H01L2924/19042 , H01L2924/30107 , H01L2924/3025 , Y10T29/49162 , H01L2224/85 , H01L2224/81 , H01L2924/00015 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In a method for manufacturing a module, a substrate is placed above a resin bath while a electronic component is directed downward. In addition, a resin thrown into the resin bath is softened until it becomes flowable. Then, a first surface of the substrate is brought into contact with a liquid surface of the softened resin. The softened resin is allowed to flow forcibly into a gap between the substrate and the electronic component. Then, the resin cures, and a resin portion is formed. Further, a metal thin film is formed on the surface of the resin portion by sputtering to form the shield metal film.
摘要翻译： 在制造模块的方法中，将基板放置在树脂熔池的上方，同时将电子部件向下引导。 此外，投入树脂浴中的树脂软化直到其变得可流动。 然后，使基板的第一表面与软化树脂的液面接触。 使软化的树脂强制地流入基板和电子部件之间的间隙。 然后，树脂固化，形成树脂部分。 此外，通过溅射在树脂部分的表面上形成金属薄膜以形成屏蔽金属膜。
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公开(公告)号：US20100147569A1
公开(公告)日：2010-06-17
申请号：US12709573
申请日：2010-02-22
IPC分类号： H05K1/00
CPC分类号： H05K1/186 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H01L2924/3511 , H05K3/284 , H05K3/4652 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2224/0401
摘要： A component-embedded printed wiring board (PWB) is disclosed. This PWB includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any air, and the reliable PWB is thus obtainable.
摘要翻译： 公开了一种组件嵌入式印刷电路板（PWB）。 该PWB包括（a）在与电子部件相对应的位置处形成的流体树脂嵌入部，使得嵌入部覆盖电子部件，（b）与电路基板的顶面平行放置的树脂流速加速器 并且包围所述嵌入部分，以及（c）至少在所述加速器和所述电路板之间配置树脂。 流体树脂嵌入部分填充与粘合树脂相同的树脂。 这种结构允许加速器在施加到PWB上的压力下压缩树脂，使得树脂趋于沿着电路板流动。 结果，流体树脂嵌入部分被树脂充分填充而不会留下任何空气，从而可获得可靠的PWB。
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公开(公告)号：US20100146779A1
公开(公告)日：2010-06-17
申请号：US12709575
申请日：2010-02-22
IPC分类号： H05K3/30
CPC分类号： H05K1/186 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H01L2924/3511 , H05K3/284 , H05K3/4652 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2224/0401
摘要： A component-embedded printed wiring board (PWB) is disclosed. This PWB includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any air, and the reliable PWB is thus obtainable.
摘要翻译： 公开了一种组件嵌入式印刷电路板（PWB）。 该PWB包括（a）在与电子部件相对应的位置处形成的流体树脂嵌入部，使得嵌入部覆盖电子部件，（b）与电路基板的顶面平行设置的树脂流速加速器 并且包围所述嵌入部分，以及（c）至少在所述加速器和所述电路板之间配置树脂。 流体树脂嵌入部分填充与粘合树脂相同的树脂。 这种结构允许加速器在施加到PWB上的压力下压缩树脂，使得树脂趋于沿着电路板流动。 结果，流体树脂嵌入部分被树脂充分填充而不会留下任何空气，从而可获得可靠的PWB。
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4.发明申请公开(公告)号：US20090281381A1
公开(公告)日：2009-11-12
申请号：US12435163
申请日：2009-05-04
申请人： Tomoya TAKENAKA , Masatoshi HOMAN , Yasuteru ASAKAWA , Jun'ichi KIMURA , Susumu FUKUSHIMA , Motoyoshi KITAGAWA
发明人： Tomoya TAKENAKA , Masatoshi HOMAN , Yasuteru ASAKAWA , Jun'ichi KIMURA , Susumu FUKUSHIMA , Motoyoshi KITAGAWA
CPC分类号： A61B1/041 , A61B1/00016 , A61B1/0607 , A61B1/0638
摘要： An antenna to be embedded in a capsule type medical device. The antenna includes an antenna conductor, and a sheet-like antenna substrate which at least partly electrically contacts with the antenna conductor. The antenna is formed by closely attaching the antenna conductor and the sheet-like antenna substrate.
摘要翻译： 嵌入胶囊型医疗装置中的天线。 天线包括天线导体和至少部分地与天线导体电接触的片状天线基板。 天线通过紧密地连接天线导体和片状天线基板而形成。
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公开(公告)号：US20070060094A1
公开(公告)日：2007-03-15
申请号：US11520367
申请日：2006-09-13
CPC分类号： H04B1/30
摘要： A level comparator supplied with oscillation signal of local oscillator for comparing the signal level of oscillation signal with a certain predetermined threshold value, and a driving section interposed between the output of level comparator and a control section are provided. When the level comparator recognized that the signal level exceeded the threshold value, it puts the driving section into operation for bringing the control section into action.
摘要翻译： 提供有本地振荡器的振荡信号的电平比较器，用于将振荡信号的信号电平与一定的预定阈值进行比较，以及插入电平比较器的输出和控制部分之间的驱动部分。 当电平比较器识别到信号电平超过阈值时，它使驱动部分工作，使控制部分动作。
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公开(公告)号：US20060261472A1
公开(公告)日：2006-11-23
申请号：US11435716
申请日：2006-05-18
IPC分类号： H01L23/34
CPC分类号： H05K1/144 , H01L23/49827 , H01L23/5384 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/117 , H01L25/50 , H01L2224/16225 , H01L2224/97 , H01L2225/06517 , H01L2225/06548 , H01L2225/06565 , H01L2225/06572 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01087 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/1627 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01L2924/3511 , H05K1/0237 , H05K1/185 , H05K3/0052 , H05K3/3436 , H05K3/403 , H05K3/42 , H05K2201/09181 , H05K2201/10371 , H05K2201/10666 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A multilayer module which includes parts-containing module whose circuit board has been mounted at one surface with electronic component and the electronic component is covered with resin layer. Connection terminals have been provided either at resin layer or at the other surface of circuit board, also through hole has been provided for connection between the two surfaces of module. Also included is module, which has been provided with connection terminals at a place corresponding to connection terminal, and through hole for connection between the connection terminals and electronic component. Disposed between conductor layer and conductor layer is insulation layer, which insulation layer having conductive bond for connection between connection terminals, respectively. In the above-described configuration, places of through hole and electronic component in module are not restricted by a location of through hole.
摘要翻译： 一种多层模块，其包括其电路板已经在一个表面上安装有电子部件并且电子部件被树脂层覆盖的部件容纳模块。 已经在树脂层或电路板的另一表面设置了连接端子，并且还提供了用于在模块的两个表面之间连接的通孔。 还包括在对应于连接端子的位置处设置有连接端子的模块和用于连接端子和电子部件之间的连接的通孔。 在导体层和导体层之间设置绝缘层，绝缘层分别具有用于连接端子之间连接的导电接合层。 在上述结构中，模块中的通孔和电子部件的位置不受通孔的位置的限制。
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7.发明申请公开(公告)号：US20060260122A1
公开(公告)日：2006-11-23
申请号：US11434763
申请日：2006-05-17
CPC分类号： H05K1/186 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H01L2924/3511 , H05K3/284 , H05K3/4652 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2224/0401
摘要： A component-embedded printed wiring board (PWB) is disclosed. This PWB includes (a) a fluid-resin embedding section formed at place corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with a pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any airs, and the reliable PWB is thus obtainable.
摘要翻译： 公开了一种组件嵌入式印刷电路板（PWB）。 该PWB包括（a）在与电子部件对应的位置处形成的流体树脂嵌入部，使得嵌入部覆盖电子部件，（b）与电路基板的顶面平行设置的树脂流速加速器， 围绕所述嵌入部分，以及（c）至少在所述加速器和所述电路板之间配置树脂。 流体树脂嵌入部分填充与粘合树脂相同的树脂。 这种结构允许加速器以施加到PWB的压力来压缩树脂，使得树脂趋于沿着电路板流动。 结果，流体树脂嵌入部分被树脂充分填充而不留下任何空气，从而可获得可靠的PWB。
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8.发明申请Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein 审中-公开层叠基板的制造方法以及用于其中的模块和层压基板的半导体装置的制造装置公开(公告)号：US20050233122A1
公开(公告)日：2005-10-20
申请号：US11107852
申请日：2005-04-18
申请人： Mikio Nishimura , Toshihiko Mori , Kazuhiko Honjou , Junichi Kimura , Toshihiro Nishii , Shinji Harada , Motoyoshi Kitagawa
发明人： Mikio Nishimura , Toshihiko Mori , Kazuhiko Honjou , Junichi Kimura , Toshihiro Nishii , Shinji Harada , Motoyoshi Kitagawa
CPC分类号： H05K1/186 , H01L21/56 , H01L23/3121 , H01L2224/16225 , H01L2224/73204 , H01L2924/01078 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H01L2924/3511 , H05K3/284 , H05K3/4652 , H05K2203/063 , Y10T428/24917
摘要： The invention presents a manufacturing method of laminated substrate capable of realizing small size of portable electronic appliances. Prepreg 141 is a thermosetting resin which holds a plate form in first temperature range, has a thermal fluidity in second temperature range, and is cured in third temperature range, and integrating process (118) includes softening (120) of heating prepreg (141) to second temperature range, and softening the resin impregnated in prepreg (141), forced flowing (122) of compressing prepreg (141) before prepreg (141) comes to third temperature range, and forcing the resin to flow into space and gap formed among semiconductor (105), resistor (106), and substrate (101), and hardening (123) of heating prepreg (141) to third temperature range. As a result, without using intermediate material, space and gap formed among semiconductor (105), resistor (106), and substrate (101) can be securely filled with resin.
摘要翻译： 本发明提供一种能够实现小型便携式电子设备的层压基板的制造方法。 预浸料141是在第一温度范围内保持板状的热固性树脂，在第二温度范围内具有热流动性，并且在第三温度范围内固化，积分过程（118）包括加热预浸料（141）的软化（120） 到第二温度范围，并且软化浸渍在预浸料坯（141）中的树脂，在预浸料坯（141）之前压制预浸料坯（141）的强制流动（122）达到第三温度范围，并迫使树脂流入空间和间隙 半导体（105），电阻器（106）和基板（101），以及加热预浸料（141）的硬化（123）至第三温度范围。 结果，在不使用中间材料的情况下，可以用树脂牢固地填充半导体（105），电阻器（106）和基板（101）之间形成的空间和间隙。
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公开(公告)号：US20050099228A1
公开(公告)日：2005-05-12
申请号：US10343966
申请日：2002-05-23
CPC分类号： H05K7/1417 , H01P1/15 , H03F1/30 , H03F2200/294 , H03F2200/372 , H03F2200/429 , H05K5/06 , H05K7/20445 , H05K7/205
摘要： A portable power amplifier includes portable encapsulating cases (62, 63), a printed board (61) incorporated in those encapsulating cases (62, 63), and a power amplifying device (27) mounted on this printed board (61). An antenna switch (12) and an antenna are provided near the power amplifying device (27), which is connected to those components in a pattern (65). This structure improves the heat dissipation efficiency of the portable power amplifier.
摘要翻译： 便携式功率放大器包括便携式封装壳体（62,63），结合在这些封装壳体（62,63）中的印刷电路板（61）和安装在该印刷电路板（61）上的功率放大装置。 天线开关（12）和天线设置在功率放大装置（27）附近，其连接到图案（65）中的那些部件。 该结构提高了便携式功率放大器的散热效率。
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公开(公告)号：US5408384A
公开(公告)日：1995-04-18
申请号：US235720
申请日：1994-04-29
CPC分类号： H05K5/0286 , G06K19/07 , G06K7/0047
摘要： In order to provide a small-sized card and a connector device therefor having no fear of damages and stains of terminals, the card according to the invention has a structure comprising a casing with an opening, and a double-faced substrate on which electronic parts are provided and a plurality of terminals are attached in the vicinity of one end of the substrate, in which the terminals are provided on both the upper and lower surfaces of the substrate, the lower surface of the substrate is disposed in contact with the inner surface of the casing, the terminals on the lower surface of the substrate are covered with a cover which is swung or slid to be opened/closed freely, so that when the card is inserted in a connector device, the cover is opened to expose the lower-surface terminals and to fit them closely in a connector of the connector device.
摘要翻译： 为了提供一种小型卡及其连接器装置，不用担心终端的损坏和污渍，根据本发明的卡具有包括具有开口的壳体和双面基板的结构，电子部件 并且在基板的一端附近安装多个端子，其中端子设置在基板的上表面和下表面上，基板的下表面设置成与内表面接触 壳体的下表面上的端子被覆盖着被摆动或滑动以自由打开/关闭的盖，使得当卡插入连接器装置时，盖打开以暴露下部 并将其紧密地安装在连接器装置的连接器中。
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