公开(公告)号：US20240266301A1

公开(公告)日：2024-08-08

申请号：US18165790

申请日：2023-02-07

Applicant: Juniper Networks, Inc.

Inventor： Gautam GANGULY ,  Valery KUGEL ,  Omar AHMED ,  Leif HUTCHINSON ,  Peng SU ,  Matthew TWAROG ,  Attila I. ARANYOSI ,  David K. OWEN ,  Chang-Hong WU ,  Aliaskar HASSANZADEH ,  Boris REYNOV ,  Muhammad SAGARWALA

IPC: H01L23/00 ,  H01L23/498 ,  H05K1/18

CPC classification number: H01L23/562 ,  H01L23/49833 ,  H05K1/181 ,  H01L23/49811 ,  H01L23/49816 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734

Abstract: An apparatus, includes a PCB, a semiconductor package that includes a substrate and a stiffener with an opening, and at least one connection component. The stiffener is disposed on a top surface of the PCB. The at least one connection component is configured to connect the PCB to the semiconductor package. The at least one connection component may include another PCB that is disposed on the substrate within the opening of the stiffener and on the PCB. The at least one connection component may include an array of connectors that are disposed on the substrate within the opening of the stiffener, and may include a socket disposed on the PCB. The at least one connection component may include a BGA that is disposed on the substrate within the opening of the stiffener and on the PCB and on a pedestal portion of a surface of the PCB.