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公开(公告)号:US20240379522A1
公开(公告)日:2024-11-14
申请号:US18314469
申请日:2023-05-09
Applicant: Juniper Networks, Inc.
Inventor: Leif HUTCHINSON , Daniel J. PREZIOSO , Boris REYNOV
IPC: H01L23/498 , H01L23/00 , H01L23/36
Abstract: A semiconductor package includes a first substrate having a top surface and a bottom surface, and a second substrate having a top surface and a bottom surface. The bottom surface of the first substrate is connected to the top surface of the second substrate via at least one bonding layer. The first substrate includes one or more electrically conductive components arranged on the bottom surface of the first substrate in a first pattern. The second substrate includes one or more slots arranged on the bottom surface of the second substrate in a second pattern. The one or more slots are each plated with an electrically conductive material. The arrangement of the one or more electrically conductive components in the first pattern is aligned with the arrangement of the one or more slots in the second pattern. The second substrate includes a stiffener disposed within the second substrate.
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2.
公开(公告)号:US20150304742A1
公开(公告)日:2015-10-22
申请号:US14733590
申请日:2015-06-08
Applicant: Juniper Networks, Inc.
Inventor: Shreeram SIDDHAYE , Boris REYNOV , Jack KOHN , Euan F. MOWAT
CPC classification number: H04Q11/0003 , G02B6/4246 , G02B6/4293 , H04B10/40 , H04B10/808 , H04L12/10
Abstract: A portable, self-powered, interface converter for converting between Ethernet over twisted pair cables and Ethernet over optical fiber is described. In one implementation, the device may include a first interface to a power-over-Ethernet connection and a second interface to provide a connection to receive fiber optic cabling. A power-over-Ethernet (PoE) circuit may derive power from the PoE connection and output a corresponding power signal. A transcoder may perform physical layer conversion between Ethernet communications over twisted pair cabling connected to the first interface and Ethernet communications over the fiber optic cabling. The transcoder may be powered by the power signal output by the PoE circuit.
Abstract translation: 描述了用于通过双绞线以太网和光纤以太网之间转换的便携式,自供电的接口转换器。 在一个实现中,设备可以包括到以太网供电连接的第一接口和用于提供连接以接收光纤布线的第二接口。 以太网供电(PoE)电路可以从PoE连接获得功率并输出相应的功率信号。 代码转换器可以通过连接到第一接口的双绞线电缆的以太网通信和通过光纤电缆的以太网通信来执行物理层转换。 代码转换器可以由PoE电路输出的功率信号供电。
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公开(公告)号:US20180192544A1
公开(公告)日:2018-07-05
申请号:US15932186
申请日:2018-02-16
Applicant: Juniper Networks, Inc.
Inventor: Boris REYNOV , Shreeram SIDDHAYE , Venkata S. Raju PENMETSA
CPC classification number: H05K7/20309 , H05K7/1427 , H05K7/20136 , H05K7/20318 , H05K7/20327 , H05K7/20672
Abstract: A system may include a removable board that is adapted for inserting into and removing from an enclosure, an electronic component that is attached to the removable board, and a cooling system that is attached to the removable board. The cooling system may include a first heat exchanger that is attached to the electronic component by a physical interface. The cooling system may include a coolant pipe that that is at least partially filled with a working fluid to receive heat, generated by the electronic component, via the first heat exchanger. The cooling system may include a second heat exchanger, attached to the coolant pipe and situated to be located outside of the enclosure when the removable board is inserted into the enclosure. The cooling system may be adapted to remain attached to the removable board when inserting and removing the removable board.
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4.
公开(公告)号:US20240266301A1
公开(公告)日:2024-08-08
申请号:US18165790
申请日:2023-02-07
Applicant: Juniper Networks, Inc.
Inventor: Gautam GANGULY , Valery KUGEL , Omar AHMED , Leif HUTCHINSON , Peng SU , Matthew TWAROG , Attila I. ARANYOSI , David K. OWEN , Chang-Hong WU , Aliaskar HASSANZADEH , Boris REYNOV , Muhammad SAGARWALA
IPC: H01L23/00 , H01L23/498 , H05K1/18
CPC classification number: H01L23/562 , H01L23/49833 , H05K1/181 , H01L23/49811 , H01L23/49816 , H05K2201/09063 , H05K2201/10189 , H05K2201/10704 , H05K2201/10719 , H05K2201/10734
Abstract: An apparatus, includes a PCB, a semiconductor package that includes a substrate and a stiffener with an opening, and at least one connection component. The stiffener is disposed on a top surface of the PCB. The at least one connection component is configured to connect the PCB to the semiconductor package. The at least one connection component may include another PCB that is disposed on the substrate within the opening of the stiffener and on the PCB. The at least one connection component may include an array of connectors that are disposed on the substrate within the opening of the stiffener, and may include a socket disposed on the PCB. The at least one connection component may include a BGA that is disposed on the substrate within the opening of the stiffener and on the PCB and on a pedestal portion of a surface of the PCB.
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公开(公告)号:US20150305193A1
公开(公告)日:2015-10-22
申请号:US14788652
申请日:2015-06-30
Applicant: JUNIPER NETWORKS, INC.
Inventor: Boris REYNOV , Jack Kohn , Euan F Mowat , Shreeram SIDDHAYE , Ben Nitzan , Mahesh Nagarajan
CPC classification number: H05K7/20127 , H05K7/18 , H05K7/20 , H05K7/20736 , H05K7/20745 , Y10T29/49
Abstract: A line card includes a metal frame that includes a front section, and a bottom section connected to the front section via an angled section, where the angled section results in an opening between the line card and a second line card, when the line card is installed above the second line card in a rack, and where the opening allows directed air to enter the rack from a front direction; a printed circuit board attached to the metal frame; and a group of front panel connectors attached to the front section of the metal frame.
Abstract translation: 线卡包括金属框架,其包括前部,以及底部,其经由角度部分连接到前部,其中成角度部分导致线卡和第二线卡之间的开口,当线卡是 安装在机架上的第二线卡上方,并且其中开口允许定向空气从前方进入机架; 安装在金属框架上的印刷电路板; 以及一组连接到金属框架前部的前面板连接器。
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