公开(公告)号：US20240248005A1

公开(公告)日：2024-07-25

申请号：US18624470

申请日：2024-04-02

Applicant: Juniper Networks, Inc

Inventor： Phu TRUONG ,  Attila I. ARANYOSI ,  Vu L. LE

IPC: G01M99/00 ,  G01K1/143 ,  G01K7/02

CPC classification number: G01M99/002 ,  G01K1/143 ,  G01K7/02

Abstract: A probe assembly for a test fixture for a heatsink, may include a thermocouple probe configured to measure a surface temperature of the heatsink. The probe assembly may include a base portion with an opening for receiving the thermocouple probe. The probe assembly may include a spring-loaded collet assembly connected to the thermocouple probe via the opening of the base portion and configured to cause the thermocouple probe to removably contact a bottom surface of a pedestal of the heatsink. The probe assembly may include a thermocouple cable connected to the thermocouple probe and configured to communicate the surface temperature of the heatsink.

公开(公告)号：US20240266301A1

公开(公告)日：2024-08-08

申请号：US18165790

申请日：2023-02-07

Applicant: Juniper Networks, Inc.

Inventor： Gautam GANGULY ,  Valery KUGEL ,  Omar AHMED ,  Leif HUTCHINSON ,  Peng SU ,  Matthew TWAROG ,  Attila I. ARANYOSI ,  David K. OWEN ,  Chang-Hong WU ,  Aliaskar HASSANZADEH ,  Boris REYNOV ,  Muhammad SAGARWALA

IPC: H01L23/00 ,  H01L23/498 ,  H05K1/18

CPC classification number: H01L23/562 ,  H01L23/49833 ,  H05K1/181 ,  H01L23/49811 ,  H01L23/49816 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734

Abstract: An apparatus, includes a PCB, a semiconductor package that includes a substrate and a stiffener with an opening, and at least one connection component. The stiffener is disposed on a top surface of the PCB. The at least one connection component is configured to connect the PCB to the semiconductor package. The at least one connection component may include another PCB that is disposed on the substrate within the opening of the stiffener and on the PCB. The at least one connection component may include an array of connectors that are disposed on the substrate within the opening of the stiffener, and may include a socket disposed on the PCB. The at least one connection component may include a BGA that is disposed on the substrate within the opening of the stiffener and on the PCB and on a pedestal portion of a surface of the PCB.

公开(公告)号：US20230138556A1

公开(公告)日：2023-05-04

申请号：US17515762

申请日：2021-11-01

Applicant: Juniper Networks, Inc.

Inventor： Phu TRUONG ,  Attila I. ARANYOSI ,  Vu L. LE

IPC: G01N25/18 ,  G01K1/143

Abstract: A test fixture, for a heatsink, may include a probe assembly with a thermocouple probe configured to removably contact a bottom surface of a pedestal of the heatsink, and measure a surface temperature of the heatsink. The test fixture may include an insulator housing configured to house the probe assembly and a heater block, and to insulate the probe assembly from the heater block. The heater block may be provided within the insulator housing and may be configured to provide heat to the heatsink via the bottom surface of the pedestal of the heatsink. The test fixture may include a mounting block connected to the insulator housing and configured to connect to the heatsink.