公开(公告)号：US20190098765A1

公开(公告)日：2019-03-28

申请号：US15719168

申请日：2017-09-28

Applicant: Juniper Networks, Inc.

Inventor： Matthew TWAROG ,  Hui He ,  Thomas W. Jetton

IPC: H05K3/00 ,  H05K1/11 ,  H05K1/02 ,  H05K3/46 ,  H05K3/40

Abstract: A printed circuit board (PCB) may include a plurality of horizontally disposed signal layers. The PCB may include a first vertically disposed differential via electrically connected to a first horizontally disposed signal layer, of the plurality of horizontally disposed signal layers, and a second horizontally disposed signal layer of the plurality of horizontally disposed signal layers. The PCB may include a second vertically disposed differential via electrically connected to the first signal horizontally disposed layer and the second horizontally disposed signal layer. The PCB may include a first set of clearances encompassing the first vertically disposed differential via and the second vertically disposed differential via, a second set of clearances encompassing the first vertically disposed stub, and a third set of clearances encompassing the second vertically disposed stub.

公开(公告)号：US20240266301A1

公开(公告)日：2024-08-08

申请号：US18165790

申请日：2023-02-07

Applicant: Juniper Networks, Inc.

Inventor： Gautam GANGULY ,  Valery KUGEL ,  Omar AHMED ,  Leif HUTCHINSON ,  Peng SU ,  Matthew TWAROG ,  Attila I. ARANYOSI ,  David K. OWEN ,  Chang-Hong WU ,  Aliaskar HASSANZADEH ,  Boris REYNOV ,  Muhammad SAGARWALA

IPC: H01L23/00 ,  H01L23/498 ,  H05K1/18

CPC classification number: H01L23/562 ,  H01L23/49833 ,  H05K1/181 ,  H01L23/49811 ,  H01L23/49816 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734

Abstract: An apparatus, includes a PCB, a semiconductor package that includes a substrate and a stiffener with an opening, and at least one connection component. The stiffener is disposed on a top surface of the PCB. The at least one connection component is configured to connect the PCB to the semiconductor package. The at least one connection component may include another PCB that is disposed on the substrate within the opening of the stiffener and on the PCB. The at least one connection component may include an array of connectors that are disposed on the substrate within the opening of the stiffener, and may include a socket disposed on the PCB. The at least one connection component may include a BGA that is disposed on the substrate within the opening of the stiffener and on the PCB and on a pedestal portion of a surface of the PCB.

公开(公告)号：US20200053880A1

公开(公告)日：2020-02-13

申请号：US16655621

申请日：2019-10-17

Applicant: Juniper Networks, Inc.

Inventor： Matthew TWAROG ,  Hui HE ,  Thomas W. JETTON

IPC: H05K3/00 ,  H05K1/11 ,  H05K3/46 ,  H05K3/40 ,  H05K1/02 ,  H05K3/22

Abstract: A printed circuit board (PCB) may include a plurality of horizontally disposed signal layers. The PCB may include a first vertically disposed differential via electrically connected to a first horizontally disposed signal layer, of the plurality of horizontally disposed signal layers, and a second horizontally disposed signal layer of the plurality of horizontally disposed signal layers. The PCB may include a second vertically disposed differential via electrically connected to the first signal horizontally disposed layer and the second horizontally disposed signal layer. The PCB may include a first set of clearances encompassing the first vertically disposed differential via and the second vertically disposed differential via, a second set of clearances encompassing the first vertically disposed stub, and a third set of clearances encompassing the second vertically disposed stub.