公开(公告)号：US20240379522A1

公开(公告)日：2024-11-14

申请号：US18314469

申请日：2023-05-09

Applicant: Juniper Networks, Inc.

Inventor： Leif HUTCHINSON ,  Daniel J. PREZIOSO ,  Boris REYNOV

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/36

Abstract: A semiconductor package includes a first substrate having a top surface and a bottom surface, and a second substrate having a top surface and a bottom surface. The bottom surface of the first substrate is connected to the top surface of the second substrate via at least one bonding layer. The first substrate includes one or more electrically conductive components arranged on the bottom surface of the first substrate in a first pattern. The second substrate includes one or more slots arranged on the bottom surface of the second substrate in a second pattern. The one or more slots are each plated with an electrically conductive material. The arrangement of the one or more electrically conductive components in the first pattern is aligned with the arrangement of the one or more slots in the second pattern. The second substrate includes a stiffener disposed within the second substrate.

公开(公告)号：US20240266301A1

公开(公告)日：2024-08-08

申请号：US18165790

申请日：2023-02-07

Applicant: Juniper Networks, Inc.

Inventor： Gautam GANGULY ,  Valery KUGEL ,  Omar AHMED ,  Leif HUTCHINSON ,  Peng SU ,  Matthew TWAROG ,  Attila I. ARANYOSI ,  David K. OWEN ,  Chang-Hong WU ,  Aliaskar HASSANZADEH ,  Boris REYNOV ,  Muhammad SAGARWALA

IPC: H01L23/00 ,  H01L23/498 ,  H05K1/18

CPC classification number: H01L23/562 ,  H01L23/49833 ,  H05K1/181 ,  H01L23/49811 ,  H01L23/49816 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734

Abstract: An apparatus, includes a PCB, a semiconductor package that includes a substrate and a stiffener with an opening, and at least one connection component. The stiffener is disposed on a top surface of the PCB. The at least one connection component is configured to connect the PCB to the semiconductor package. The at least one connection component may include another PCB that is disposed on the substrate within the opening of the stiffener and on the PCB. The at least one connection component may include an array of connectors that are disposed on the substrate within the opening of the stiffener, and may include a socket disposed on the PCB. The at least one connection component may include a BGA that is disposed on the substrate within the opening of the stiffener and on the PCB and on a pedestal portion of a surface of the PCB.