摘要:
A cover for an electrical socket includes multiple walls joined with one another and configured to overlay an electrical socket. A latch element is provided with at least one of the walls to securely retain the walls against the electrical socket. A rigid member is secured to the walls and retains the walls in a predefined relation with respect to one another. The rigid member includes a heat resistant plate rigidly mounted to the walls of the cover which include lower edges and upper edges aligned in a common plane. The upper and lower edges are configured to abut against and retain the electrical socket in a common planar relation with one another. Brackets extending from the walls slidably receive the rigid member.
摘要:
A socket connector including a socket base having a slot oriented at a first angle with respect to a bottom surface of the socket base. The socket connector also includes a contact having a base beam and a retention portion. The retention portion forms an initial angle with the base beam before the contact is assembled with the socket base that differs from the first angle. The socket base receives the contact with the retention portion held in the slot such that an angle between the base beam and the retention portion is changed from the initial angle.
摘要:
An electrical socket is provided that holds an array of contacts. Each contact includes first and second contact elements that are configured to be joined in an electrically common manner. The first and second contact elements have first and second contact beams, respectively, that are oriented to project toward one another and to overlap. The first and second contact elements each have base portions that are formed separate from one another and are configured to be joined to a common conductive path on the circuit board.
摘要:
An electrical contact is provided that includes a body configured to be held on a circuit board. The body of the contact is movable relative to the circuit board along at least a first axis of motion. The contact includes a contact portion joined with the body that is configured to engage an electrical component. The contact portion may include one or more contact beams. The contact further includes a termination lead joined to the body and having an outer end that is configured to be soldered to the circuit board. The termination lead extends from the body at an acute or right angle to the first axis of motion. The termination lead flexes about an arcuate path as the body of the contact shifts along the first axis of motion with respect to the circuit board.
摘要:
An electrical connector is provided that comprises a housing with a front wall that separates a mating end from a loading end. The housing has a module support shroud that extends from the front wall toward the loading end and that has a latch element provided thereon. The connector also includes a contact module having an array of contacts that are held in a dielectric carrier. The contact module includes a mating end, sides and a module end. The module end slides along the module support shroud as the contact is loaded into the housing, until the mating end is located proximate to the front wall when the contact module is fully loaded. A retention latch member is formed separate from, and held by, the contact module. The retention latch member extends beyond the module edge and engages the latch element on the module support shroud to retain securely the contact module in the housing.
摘要:
An electrical connector includes a housing having a mating end and a loading end. First and second contact wafers are loaded into the loading end of the housing. The first and second contact wafers each have a dielectric carrier holding a contact therein. The carriers have outer walls, wherein at least one of the outer walls on each of the carriers has a spacer engagement element provided thereon. A wafer spacer is configured to be positioned between the first and second contact wafers. The wafer spacer is positioned in one of different first and second orientations relative to the side walls of the first and second contact wafers. The wafer spacer has opposed first and second side walls that are separated by a spacer core thickness. The first side wall has a wafer engagement element provided thereon. When the wafer spacer is in the first orientation, the wafer spacer separates the first and second contact wafers by a first distance. When the wafer spacer is in the second orientation, the wafer spacer separates the first and second contact wafers by a second distance that is greater than the first distance.
摘要:
A heat sink assembly includes a circuit board, a first integrated circuit package and a second integrated circuit package mounted to the circuit board in a stacked relation to one another. A first heat sink is engaged to and is in thermal communication with the first integrated circuit package, and a second heat sink is engaged to and is in thermal communication with the second integrated circuit package, wherein each of the first and second heat sinks are positioned over the first and second integrated circuit packages on a single side of the circuit board. Optionally, the first heat sink may include an opening extending therethrough and exposing the second integrated circuit package. The second heat sink may extend through the opening and engage the second integrated circuit package.
摘要:
A connector for mounting to a panel is provided that includes a housing that has a front edge configured to be located proximate an opening in the panel. The connector also includes a tab that extends from the front edge of the housing where the tab is oriented to engage an outer surface of the panel. A spring member also extends from the front edge of the housing and is positioned to engage an inner surface of the panel. The spring member is flexible toward and away from the tab.
摘要:
A connector for mounting to a panel is provided that includes a housing that has a front edge configured to be located proximate an opening in the panel. The connector also includes a tab that extends from the front edge of the housing where the tab is oriented to engage an outer surface of the panel. A spring member also extends from the front edge of the housing and is positioned to engage an inner surface of the panel. The spring member is flexible toward and away from the tab.
摘要:
A land grid array module is provided that includes a land grid array interface. The interface includes a substrate having a mating face. A contact pad is provided on the mating face of the substrate. The contact pad has an exposed surface with a depression that is configured to restrain transverse movement of a mating contact tip when the mating contact tip is loaded against the contact pad. The substrate layer may include a via having a diameter such that the depression is formed in the contact pad when the contact pad is plated over the via. The depression may also be stamped in the exposed surface of the contact pad. Alternatively, the depression may be surrounded by a raised conductive perimeter that is configured to retain the mating contact tip.