Modular connector assembly with stamped retention latch members
    5.
    发明授权
    Modular connector assembly with stamped retention latch members 有权
    具有冲压保持闩锁构件的模块化连接器组件

    公开(公告)号:US07175479B1

    公开(公告)日:2007-02-13

    申请号:US11410028

    申请日:2006-04-25

    IPC分类号: H01R13/502

    摘要: An electrical connector is provided that comprises a housing with a front wall that separates a mating end from a loading end. The housing has a module support shroud that extends from the front wall toward the loading end and that has a latch element provided thereon. The connector also includes a contact module having an array of contacts that are held in a dielectric carrier. The contact module includes a mating end, sides and a module end. The module end slides along the module support shroud as the contact is loaded into the housing, until the mating end is located proximate to the front wall when the contact module is fully loaded. A retention latch member is formed separate from, and held by, the contact module. The retention latch member extends beyond the module edge and engages the latch element on the module support shroud to retain securely the contact module in the housing.

    摘要翻译: 提供一种电连接器,其包括具有将配合端与装载端分隔开的前壁的壳体。 壳体具有从前壁朝向装载端延伸的模块支撑护罩,并且具有设置在其上的闩锁元件。 连接器还包括具有保持在电介质载体中的触点阵列的触点模块。 接触模块包括配合端,侧面和模块端。 当接触器装载到壳体中时,模块端部沿着模块支撑护罩滑动,直到接触模块完全装入时,配合端部位于靠近前壁的位置。 保持闩锁构件与接触模块分开形成并由其固定。 保持闩锁构件延伸超过模块边缘并且与模块支撑罩上的闩锁元件接合,以将触头模块牢固地保持在壳体中。

    Modular connector assembly with adjustable distance between contact wafers
    6.
    发明授权
    Modular connector assembly with adjustable distance between contact wafers 有权
    模块化连接器组件,可在接触晶圆之间调节距离

    公开(公告)号:US07195519B1

    公开(公告)日:2007-03-27

    申请号:US11393352

    申请日:2006-03-30

    IPC分类号: H01R13/58

    摘要: An electrical connector includes a housing having a mating end and a loading end. First and second contact wafers are loaded into the loading end of the housing. The first and second contact wafers each have a dielectric carrier holding a contact therein. The carriers have outer walls, wherein at least one of the outer walls on each of the carriers has a spacer engagement element provided thereon. A wafer spacer is configured to be positioned between the first and second contact wafers. The wafer spacer is positioned in one of different first and second orientations relative to the side walls of the first and second contact wafers. The wafer spacer has opposed first and second side walls that are separated by a spacer core thickness. The first side wall has a wafer engagement element provided thereon. When the wafer spacer is in the first orientation, the wafer spacer separates the first and second contact wafers by a first distance. When the wafer spacer is in the second orientation, the wafer spacer separates the first and second contact wafers by a second distance that is greater than the first distance.

    摘要翻译: 电连接器包括具有配合端和装载端的壳体。 第一和第二接触晶片装载到壳体的装载端。 第一和第二接触晶片各自具有在其中保持接触的介质载体。 载体具有外壁,其中每个载体上的至少一个外壁具有设置在其上的间隔件接合元件。 晶片间隔件构造成位于第一和第二接触晶片之间。 晶片间隔物相对于第一和第二接触晶片的侧壁定位在不同的第一和第二取向之一中。 晶片间隔件具有相对的第一和第二侧壁,其被间隔件芯厚度隔开。 第一侧壁具有设置在其上的晶片接合元件。 当晶片间隔物处于第一取向时,晶片间隔件将第一和第二接触晶片分开第一距离。 当晶片间隔物处于第二取向时,晶片隔片将第一和第二接触晶片分开大于第一距离的第二距离。

    Modular heat sink assembly
    7.
    发明授权
    Modular heat sink assembly 失效
    模块化散热器组件

    公开(公告)号:US07298622B2

    公开(公告)日:2007-11-20

    申请号:US11153028

    申请日:2005-06-15

    IPC分类号: H05K7/20

    摘要: A heat sink assembly includes a circuit board, a first integrated circuit package and a second integrated circuit package mounted to the circuit board in a stacked relation to one another. A first heat sink is engaged to and is in thermal communication with the first integrated circuit package, and a second heat sink is engaged to and is in thermal communication with the second integrated circuit package, wherein each of the first and second heat sinks are positioned over the first and second integrated circuit packages on a single side of the circuit board. Optionally, the first heat sink may include an opening extending therethrough and exposing the second integrated circuit package. The second heat sink may extend through the opening and engage the second integrated circuit package.

    摘要翻译: 散热器组件包括电路板,第一集成电路封装以及以彼此堆叠的方式安装到电路板的第二集成电路封装。 第一散热器接合并与第一集成电路封装件热连通,并且第二散热器接合到第二集成电路封装并与第二集成电路封装件热连通,其中第一和第二散热器中的每一个被定位 在电路板的单侧上的第一和第二集成电路封装。 可选地,第一散热器可以包括延伸穿过其中并暴露第二集成电路封装的开口。 第二散热器可以延伸穿过开口并接合第二集成电路封装。

    Panel mount connector
    8.
    发明申请
    Panel mount connector 失效
    面板安装连接器

    公开(公告)号:US20090034217A1

    公开(公告)日:2009-02-05

    申请号:US11888936

    申请日:2007-08-03

    IPC分类号: H05K7/12 H01R24/00

    摘要: A connector for mounting to a panel is provided that includes a housing that has a front edge configured to be located proximate an opening in the panel. The connector also includes a tab that extends from the front edge of the housing where the tab is oriented to engage an outer surface of the panel. A spring member also extends from the front edge of the housing and is positioned to engage an inner surface of the panel. The spring member is flexible toward and away from the tab.

    摘要翻译: 提供了一种用于安装到面板的连接器,其包括壳体,所述壳体具有被配置为邻近面板中的开口定位的前边缘。 连接器还包括从壳体的前边缘延伸的突片,其中突片被定向成接合面板的外表面。 弹簧构件也从壳体的前边缘延伸并定位成接合面板的内表面。 弹簧构件朝向和远离突出部是柔性的。

    Panel mount connector
    9.
    发明授权
    Panel mount connector 失效
    面板安装连接器

    公开(公告)号:US08014165B2

    公开(公告)日:2011-09-06

    申请号:US11888936

    申请日:2007-08-03

    IPC分类号: H05K1/14

    摘要: A connector for mounting to a panel is provided that includes a housing that has a front edge configured to be located proximate an opening in the panel. The connector also includes a tab that extends from the front edge of the housing where the tab is oriented to engage an outer surface of the panel. A spring member also extends from the front edge of the housing and is positioned to engage an inner surface of the panel. The spring member is flexible toward and away from the tab.

    摘要翻译: 提供了一种用于安装到面板的连接器,其包括壳体,所述壳体具有被配置为邻近面板中的开口定位的前边缘。 连接器还包括从壳体的前边缘延伸的突片,其中突片被定向成接合面板的外表面。 弹簧构件也从壳体的前边缘延伸并定位成接合面板的内表面。 弹簧构件朝向和远离突出部是柔性的。

    Land grid array module with contact locating features
    10.
    发明申请
    Land grid array module with contact locating features 有权
    具有接触定位特征的Land Grid阵列模块

    公开(公告)号:US20080200042A1

    公开(公告)日:2008-08-21

    申请号:US11707294

    申请日:2007-02-16

    IPC分类号: H01R13/24

    CPC分类号: H01R13/2442

    摘要: A land grid array module is provided that includes a land grid array interface. The interface includes a substrate having a mating face. A contact pad is provided on the mating face of the substrate. The contact pad has an exposed surface with a depression that is configured to restrain transverse movement of a mating contact tip when the mating contact tip is loaded against the contact pad. The substrate layer may include a via having a diameter such that the depression is formed in the contact pad when the contact pad is plated over the via. The depression may also be stamped in the exposed surface of the contact pad. Alternatively, the depression may be surrounded by a raised conductive perimeter that is configured to retain the mating contact tip.

    摘要翻译: 提供了一种包括陆地网格阵列接口的地面阵列阵列模块。 界面包括具有配合面的基板。 接触垫设置在基板的配合面上。 接触垫具有带有凹陷的暴露表面,该凹陷被构造成当匹配接触尖端被装载到接触垫上时,限制配合接触尖端的横向移动。 衬底层可以包括具有直径的通孔,使得当接触垫电镀在通孔上时,凹陷形成在接触焊盘中。 凹陷也可以冲压在接触垫的暴露表面中。 或者,凹陷可以被构造成保持配合接触尖端的凸起的导电周边包围。