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    COMMUNICATION APPARATUS
    1.
    发明申请
    COMMUNICATION APPARATUS 审中-公开
    通讯设备

    公开(公告)号：US20140057554A1

    公开(公告)日：2014-02-27

    申请号：US14070179

    申请日：2013-11-01

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Koichi Mori ,  Takafumi Ohishi ,  Kazuhiro Inoue

    IPC: H04B13/00

    CPC classification number: H04B13/005

    Abstract: According to one embodiment, the signal electrode is disposed on the first principal surface side of the substrate and is connected to the other end of the second signal line. The housing covers and accommodates therein the substrate, the communication unit, the first signal line, the terminal, the second signal line, and the signal electrode. The conductive material is arranged on an outer side of the housing so as to be opposite to the signal electrode, and includes an outer peripheral portion extended outward beyond an outer periphery of the signal electrode. The communication apparatus carries out data communication via a living body.

    Abstract translation: 根据一个实施例，信号电极设置在衬底的第一主表面侧上并连接到第二信号线的另一端。 壳体覆盖并容纳基板，通信单元，第一信号线，端子，第二信号线和信号电极。 导电材料布置在壳体的外侧以与信号电极相对，并且包括向外延伸超过信号电极外周的外周部分。 通信装置通过生物体进行数据通信。

    LIVING BODY COMMUNICATION APPARATUS
    6.
    发明申请
    LIVING BODY COMMUNICATION APPARATUS 有权
    生活体育通讯设备

    公开(公告)号：US20150038075A1

    公开(公告)日：2015-02-05

    申请号：US14163870

    申请日：2014-01-24

    Applicant: Kabushiki Kaisha Toshiba

    Inventor： Kazuki Kataoka ,  Kazuhiro Inoue ,  Takafumi Ohishi

    IPC: H04B13/00

    CPC classification number: H04B13/005

    Abstract: According to an embodiment, a first communication equipment includes a first communication unit configured to transmit and receive a signal, and a first conductor electrically connected to the first communication unit. A second communication equipment includes a second conductor, a third conductor located in parallel with the second conductor and set to first reference potential, a fourth conductor separated from the second conductor and located substantially orthogonal to the second conductor, a fifth conductor located in parallel with the fourth conductor and set to the first reference potential, a first detection unit configured to detect a first differential output between signal outputs respectively observed by the second conductor and the fourth conductor, and a second communication unit configured to receive the first differential output and transmit and receives a signal.

    Abstract translation: 根据实施例，第一通信设备包括被配置为发送和接收信号的第一通信单元和电连接到第一通信单元的第一导体。 第二通信设备包括第二导体，与第二导体并联设置并设置为第一参考电位的第三导体，与第二导体分离并且基本上垂直于第二导体定位的第四导体，与第二导体平行设置的第五导体 所述第四导体并且被设置为所述第一参考电位;第一检测单元，被配置为检测由所述第二导体和所述第四导体观察到的信号输出之间的第一差分输出;以及第二通信单元，被配置为接收所述第一差分输出并发送 并接收信号。

    SEMICONDUCTOR DEVICE
    8.
    发明申请
    SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20220262779A1

    公开(公告)日：2022-08-18

    申请号：US17468609

    申请日：2021-09-07

    Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION

    Inventor： Kazuhiro Inoue ,  Yoshio Noguchi ,  Atsushi Takeshita ,  Toshihide Osanai

    IPC: H01L25/16

    Abstract: A semiconductor device includes a light-emitting element, a light-receiving element, an input-side terminal, a first switching element, a first lead and a resin package. The first lead includes a first mount bed and a first output-side terminal, the first switching element being mounted on the first mount bed. The resin package seals the light-emitting element, the light-receiving element, and the first switching element. The resin package includes first and second side surfaces opposite to each other. The input-side terminal protrudes from the first side surface. The first output-side terminal protrudes from the second side surface. The first switching element is sealed at a center between the first and second side surfaces. The first mount bed is arranged in a direction along the second side surface so that a side surface of the first mount bed is positioned between a center of the resin package and the first output-side terminal.

    SEMICONDUCTOR DEVICE
    9.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20190295933A1

    公开(公告)日：2019-09-26

    申请号：US16027442

    申请日：2018-07-05

    Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Electronic Devices & Storage Corporation

    Inventor： Kazuhiro Inoue

    IPC: H01L23/495 ,  H01L23/31

    Abstract: Provided is a semiconductor device according to an embodiment including a first electrode terminal containing copper, a second electrode terminal containing copper, a semiconductor chip provide the first electrode terminal and provided inside the first electrode terminal, a metal member provided on the semiconductor chip, protruding to an outside of the semiconductor chip in at least two directions, electrically connected to the second electrode terminal, and containing copper, and a mold resin surrounding the semiconductor chip.

    Communication device and biological signal monitoring device
    10.
    发明授权
    Communication device and biological signal monitoring device 有权

    公开(公告)号：US09912416B2

    公开(公告)日：2018-03-06

    申请号：US15391003

    申请日：2016-12-27

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Takafumi Ohishi ,  Kazuhiro Inoue

    IPC: H04B13/00 ,  H04B1/12 ,  H01Q1/27 ,  H04B1/04 ,  H04B5/00

    CPC classification number: H04B13/005 ,  H01Q1/273 ,  H04B1/0475 ,  H04B1/12 ,  H04B5/0012 ,  H04B13/00

    Abstract: A communication device includes a ground unit, a dielectric plate, a communication circuit, a conductor, and a capacitance element. The ground unit has a reference potential applied to the ground unit. The dielectric plate is provided on the ground unit. The communication circuit is provided on the dielectric plate and performs a transmission and a reception of a signal. The conductor is connected to the communication circuit. An end of the capacitance element is connected to the conductor. An another end of the capacitance element is connected to the ground unit. A capacitance of the capacitance element is smaller than a capacitance formed between the conductor and the ground unit. The capacitance of the capacitance element is bigger than a capacitance formed between the conductor and the ground unit being caused by a human body touching or approximating to the conductor.

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