公开(公告)号：US20180122772A1

公开(公告)日：2018-05-03

申请号：US15499233

申请日：2017-04-27

申请人： KEUNG BEUM KIM ,  HYUNJONG MOON ,  SEUNG-YONG CHA

发明人： KEUNG BEUM KIM ,  HYUNJONG MOON ,  SEUNG-YONG CHA

IPC分类号： H01L25/065 ,  H01L23/522 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00

CPC分类号： H01L23/5227 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/09 ,  H01L24/19 ,  H01L24/20 ,  H01L24/46 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/14131 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/96 ,  H01L2225/0652 ,  H01L2225/1017 ,  H01L2225/107 ,  H01L2924/15311 ,  H01L2924/19042 ,  H01L2924/19105 ,  H05K2201/10378 ,  H01L2924/00014

摘要： A semiconductor package includes a first package and a second package stacked on the first package. The first package includes a redistribution substrate, a first semiconductor chip on the redistribution substrate, a connection substrate provided on the redistribution substrate to surround the first semiconductor chip as viewed in plan, and an inductor structure provided within a first region of the connection substrate and electrically connected to the first semiconductor chip through the redistribution substrate. The second package includes at least one outer terminal electrically connected to the first package. The outer terminal is provided on a second region of the connection substrate, and when viewed in plan, the first region and the second region are spaced apart from each other.