公开(公告)号：US11552120B2

公开(公告)日：2023-01-10

申请号：US16928193

申请日：2020-07-14

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Fu-Chou Liu ,  Chien-Chen Lee ,  Li-Chun Hung ,  Ya-Han Chang

IPC: H01L27/146 ,  H01L21/22 ,  H01L31/02 ,  H01L31/0203

Abstract: A chip-scale sensor package structure includes a sensor chip, a first package body surrounding and connected to an outer lateral side of the sensor chip, a ring-shaped support disposed on a top side of the first package body, a light permeable member disposed on the ring-shaped support, and a redistribution layer (RDL) disposed on a bottom surface of the sensor chip and a bottom side of the first package body. The sensor chip includes a sensing region arranged on the top surface thereof, a plurality of internal contacts, and a plurality of conductive paths respectively connected to the internal contacts and electrically coupled to the sensing region. The sensing region is spaced apart from the ring-shaped support by a distance less than 300 μm. A bottom surface of the RDL has a plurality of external contacts electrically coupled to the internal contacts.

公开(公告)号：US11257964B2

公开(公告)日：2022-02-22

申请号：US16910399

申请日：2020-06-24

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Fu-Chou Liu ,  Chien-Chen Lee ,  Li-Chun Hung ,  Ya-Han Chang

IPC: H01L27/146 ,  H01L31/0224 ,  H01L23/538 ,  H01L31/02 ,  H01L25/04

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, an opaque support (e.g., a ring-shaped solder mask) disposed on the sensor chip, and a light permeable layer disposed on the opaque support. The sensor chip includes a sensing region. The opaque support surrounds the sensing region, and inner lateral sides of the opaque support form a light-scattering loop wall. The light permeable layer, the light-scattering loop wall of the opaque support, and the sensor chip jointly define an enclosed space therein. When light passes through the light permeable layer and impinges onto the light-scattering loop wall at an incident angle, the light-scattering loop wall scatters the light into multiple rays at angles different from the incident angle.

公开(公告)号：US12113082B2

公开(公告)日：2024-10-08

申请号：US17717223

申请日：2022-04-11

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Ya-Han Chang ,  Li-Chun Hung ,  Chien-Chen Lee

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14621 ,  H01L24/05 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L2224/05026 ,  H01L2224/48228

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a ring-shaped support disposed on the sensor chip, and a light-permeable layer disposed on the ring-shaped support. A top portion of the sensor chip defines a sensing region and a carrying region that surrounds the sensing region and that carries the ring-shaped support. The top portion of the sensor chip includes a passivation layer arranged in the sensing region and the carrying region, a color filter arranged in the sensing region and the carrying region, a pixel layer arranged in the sensing region and formed on the central segment, and a micro-lens layer that is formed on the pixel layer. A part of the color filter layer in the carrying region has a roughened surface and at least partially embedded in the ring-shaped support.

公开(公告)号：US12108517B2

公开(公告)日：2024-10-01

申请号：US17580577

申请日：2022-01-20

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chia-Shuai Chang ,  Chien-Chen Lee ,  Li-Chun Hung ,  Ya-Han Chang

IPC: H05K1/02 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0274 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H05K1/11 ,  H05K1/181 ,  H01L2224/32225 ,  H01L2224/48228 ,  H01L2224/73215 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: A sensor lens assembly having a non-soldering configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to the circuit board, a sensor chip and an extending wall both assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The extending wall surrounds the sensor chip and has an extending top surface that is substantially flush with a top surface of the sensor chip. The supporting adhesive layer is in a ringed shape and is disposed on the extending top surface of the extending wall and the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer, so that the light-permeable sheet, the supporting adhesive layer, and the top surface of the sensor chip jointly define an enclosed space.

公开(公告)号：US12119363B2

公开(公告)日：2024-10-15

申请号：US17749077

申请日：2022-05-19

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chien-Chen Lee ,  Li-Chun Hung ,  Ya-Han Chang

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/05573 ,  H01L2224/06135 ,  H01L2224/32225 ,  H01L2224/48106 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73265

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip, a ring-shaped supporting layer, and a light-permeable sheet. The sensor chip is disposed on and electrically coupled to the substrate. The ring-shaped supporting layer is disposed on the sensor chip and surrounds a sensing region of the sensor chip. The light-permeable sheet has a ring-shaped notch recessed in a peripheral edge of an inner surface of the light-permeable sheet, and a depth of the ring-shaped notch with respect to the inner surface is at least 10 μm. The light-permeable sheet is disposed on the ring-shaped supporting layer through the ring-shaped notch, and the inner surface is not in contact with the ring-shaped supporting layer, so that the inner surface of the light-permeable sheet, an inner side of the ring-shaped supporting layer, and the top surface of the sensor chip jointly define an enclosed space.

公开(公告)号：US11776975B2

公开(公告)日：2023-10-03

申请号：US17468824

申请日：2021-09-08

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chien-Chen Lee ,  Jui-Hung Hsu ,  Ya-Han Chang

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L27/14636

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically coupled to the substrate and the sensor chip, a light-permeable layer, and a colloid formed on the substrate to fix the light-permeable layer. The colloid covers the wires, a peripheral portion of the sensor chip, and lateral surfaces of the light-permeable layer. A top curved surface of the colloid is partially arranged beside the lateral surfaces. In a cross section of the sensor package structure, the top curved surface has a reference point spaced apart from one of the lateral surfaces adjacent thereto by 100 μm, a top edge of the top curved surface and the reference point define a connection line, and the connection line and the one of the lateral surfaces have an acute angle within a range from 25 degrees to 36 degrees.

公开(公告)号：US11744010B2

公开(公告)日：2023-08-29

申请号：US17573588

申请日：2022-01-11

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chia-Shuai Chang ,  Chien-Chen Lee ,  Ya-Han Chang

IPC: H05K1/02 ,  G02B7/02 ,  G02B7/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0274 ,  G02B7/006 ,  G02B7/02 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the surface of the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, a light-permeable sheet, and a top shielding layer. The circuit board has no slot recessed in the surface thereof. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip. The top shielding layer is formed on an outer surface of the light-permeable sheet and has an opening that is located above a sensing region of the sensor chip.

公开(公告)号：US10916511B1

公开(公告)日：2021-02-09

申请号：US16784299

申请日：2020-02-07

Applicant: KINGPAK Technology Inc.

Inventor： Fu-Chou Liu ,  Chien-Chen Lee ,  Ya-Han Chang

IPC: H01L23/00

Abstract: A method for reducing warpage occurred to a substrate strip after a molding process is provided. First, several dies are mounted on a top surface of a substrate strip. Then, a base having a top surface with a surface curvature is provided, and the top surface of the base is contacted against a bottom surface of the substrate strip to bend the substrate strip. Next, under the status that the top surface of the base is contacted against the bottom surface of the substrate strip, a molding compound is wrapped around each die. Finally, the molding compound is cooled to a room temperature. Accordingly, the molding process is performed on the substrate strip reversely bent in a direction opposite to a warpage direction. Therefore, the warpage originally caused by the molding process is offset by the reverse bending.