公开(公告)号：US20220084588A1

公开(公告)日：2022-03-17

申请号：US17345208

申请日：2021-06-11

Applicant: Kioxia Corporation

Inventor： Kazuki OKAWA ,  Hiroyuki HARA ,  Atsushi KAWASUMI

IPC: G11C13/00 ,  G11C5/06 ,  H03K19/173

Abstract: Provided is a semiconductor storage device including: a substrate having a substrate surface extending in a first direction and a second direction intersecting the first direction; a plurality of first region memory cells provided in a plurality of layers provided parallel to the substrate surface and in a third direction, the first region memory cells being provided above a rectangular shaped first region provided on the substrate surface, the first region having a first side parallel to the first direction and a second side parallel to the second direction when viewed from the third direction intersecting the first direction and the second direction; a plurality of first region wirings provided between the first region memory cells; a plurality of second region memory cells provided in the layers, the second region memory cells being provided above a rectangular shaped second region having a third side parallel to the first direction and a fourth side parallel to the second direction when viewed from the third direction; a plurality of second region wirings provided between the second region memory cells; and a control circuit capable of executing a reading operation, wherein, in the reading operation, the control circuit performs reading from one of the first region memory cells provided in one of the layers and another one of the second region memory cells provided in another one of the layers.

公开(公告)号：US20210083182A1

公开(公告)日：2021-03-18

申请号：US16803343

申请日：2020-02-27

Applicant: KIOXIA CORPORATION

Inventor： Hiroyuki HARA ,  Hiroyuki TAKENAKA ,  Akihiko CHIBA

IPC: H01L45/00 ,  G11C13/00 ,  H01L27/24

Abstract: A semiconductor memory device includes first and second wirings extending in a first direction and spaced apart from each other in the first direction, third wirings above the first and second wirings and extending in a second direction, fourth and fifth wirings above the third wirings, extending in the first direction, and spaced apart from each other in the second direction, a plurality of memory cells between each third wiring and each of first, second, fourth, and fifth wirings, voltage application circuits, connection conductors between the voltage application circuits and the wirings, and connection wirings that electrically connect the fourth and fifth wirings to the voltage application circuits. The voltage application circuits are arranged so that a non-selected voltage application circuit is under a space between the first and second wirings, and a selected voltage application circuit is under the first wiring.

公开(公告)号：US20210082476A1

公开(公告)日：2021-03-18

申请号：US16806053

申请日：2020-03-02

Applicant: Kioxia Corporation

Inventor： Hiroyuki HARA ,  Atsushi Kawasumi

IPC: G11C5/06 ,  G11C5/14 ,  H01L23/528 ,  H01L27/24 ,  H01L45/00 ,  G11C13/00

Abstract: A semiconductor memory device according to an embodiment includes: a substrate having a substrate plane extending in a first direction and a second direction intersecting with the first direction; a first wiring provided above the substrate, the first wiring being provided so that a longitudinal direction extends along the first direction; a second wiring provided above the substrate, the second wiring being separated from the first wiring in the first direction, the second wiring being passed by the same virtual line together with the first wiring, the second wiring being provided so that a longitudinal direction extends along the first direction; a third wiring provided between the first wiring and the second wiring, the third wiring being separated from the first wiring and the second wiring, the third wiring being passed by the same virtual line together with the first wiring and the second wiring, the third wiring being provided so that a longitudinal direction extends along the first direction; a fourth wiring provided above the first wiring, the fourth wiring overlapping with the first wiring when viewed from the above, the fourth wiring being provided so that a longitudinal direction extends along the first direction; a fifth wiring provided over the second wiring and the third wiring, the fifth wiring being separated from the fourth wiring in the first direction, the fifth wiring overlapping with the second wiring and the third wiring when viewed from the above, the fifth wiring being passed by the same virtual line together with the fourth wiring, the fifth wiring being provided so that a longitudinal direction extends along the first direction; a sixth wiring provided over the fourth wiring and the fifth wiring, the sixth wiring overlapping with the fourth wiring and the fifth wiring when viewed from the above, the sixth wiring being provided so that a longitudinal direction extends along the first direction; a plurality of seventh wirings provided between the first wiring and the fourth wiring, between the third wiring and the fifth wiring, and between the second wiring and the fifth wiring, the seventh wirings being provided so that a longitudinal direction extends along the second direction; a plurality of eighth wirings provided between the fourth wiring and the sixth wiring and between the fifth wiring and the sixth wiring, the eighth wirings being provided so that a longitudinal direction extends along the second direction; a plurality of first memory cells provided between the first wiring, the second wiring, and the third wiring and the seventh wirings; a plurality of second memory cells provided between the fourth wiring and the seventh wirings and between the fifth wiring and the seventh wirings, the second memory cells overlapping with the first memory cells when viewed from the above; a plurality of third memory cells provided between the fourth wiring and the eighth wirings and between the fifth wiring and the eighth wirings, the third memory cells overlapping with the second memory cells when viewed from the above; a plurality of fourth memory cells provided between the sixth wiring and the eighth wirings, the fourth memory cells overlapping with the third memory cells when viewed from the above; a first connection wiring provided above the substrate, the first connection wiring being provided at least partially under a portion where the first wiring and the third wiring are separated; a second connection wiring provided between the first wiring and the third wiring so that a longitudinal direction extends along a third direction intersecting with the first direction and the second direction, the second connection wiring connecting the sixth wiring and the first connection wiring; a third connection wiring configured to connect the first wiring and the first connection wiring; a fourth connection wiring configured to connect the third wiring and the first connection wiring; a fifth connection wiring provided above the substrate, the fifth connection wiring being provided at least partially under a portion where the second wiring and the third wiring are separated; and a sixth connection wiring provided between the second wiring and the third wiring so that a longitudinal direction extends along the third direction, the sixth connection wiring connecting the fifth wiring and the fifth connection wiring.