公开(公告)号：US20230260780A1

公开(公告)日：2023-08-17

申请号：US18296816

申请日：2023-04-06

Applicant: Kioxia Corporation

Inventor： Minako INUKAI ,  Hideaki SAKURAI ,  Kyo OTSUBO ,  Tetsuo TAKEMOTO

IPC: H01L21/02 ,  B08B3/04 ,  B08B3/08 ,  B08B3/12 ,  B08B7/00 ,  H01L21/67 ,  H01L21/66

CPC classification number: H01L21/02101 ,  B08B3/08 ,  B08B3/041 ,  B08B3/123 ,  B08B7/0014 ,  H01L21/67051 ,  H01L21/67248 ,  H01L22/12 ,  H01L21/02082

Abstract: According to one embodiment, a method including supplying a liquid onto a substrate, solidifying the liquid on the substrate to form a solidified body, and melting the solidified body of the liquid on the substrate is provided. When solidifying the liquid, an internal pressure of the liquid on the substrate is varied.

公开(公告)号：US20240058847A1

公开(公告)日：2024-02-22

申请号：US18496222

申请日：2023-10-27

Applicant: KIOXIA CORPORATION

Inventor： Minako INUKAI ,  Masatoshi TERAYAMA

IPC: B08B13/00 ,  B08B3/02

CPC classification number: B08B13/00 ,  B08B3/02 ,  H01L21/67253

Abstract: A substrate processing apparatus for cleaning and drying a substrate under processing, including supplying a cleaning liquid onto the substrate under processing to form a cleaning liquid layer, supplying a gas onto the substrate under processing to partially remove the cleaning liquid layer and thus generate a first dry region on the substrate under processing, expanding the first dry region to generate a second dry region by controlling the movement speed of the boundary between the cleaning liquid layer and the first dry region to be less than or equal to a predetermined speed, and further expanding the second dry region to generate a third dry region.

公开(公告)号：US20230090997A1

公开(公告)日：2023-03-23

申请号：US17695512

申请日：2022-03-15

Applicant: Kioxia Corporation

Inventor： Minako INUKAI ,  Masatoshi TERAYAMA

IPC: B08B13/00 ,  B08B3/02

Abstract: A substrate processing apparatus for cleaning and drying a substrate under processing, including supplying a cleaning liquid onto the substrate under processing to form a cleaning liquid layer, supplying a gas onto the substrate under processing to partially remove the cleaning liquid layer and thus generate a first dry region on the substrate under processing, expanding the first dry region to generate a second dry region by controlling the movement speed of the boundary between the cleaning liquid layer and the first dry region to be less than or equal to a predetermined speed, and further expanding the second dry region to generate a third dry region.