SEMICONDUCTOR MEMORY DEVICE
    1.
    发明申请

    公开(公告)号:US20250031367A1

    公开(公告)日:2025-01-23

    申请号:US18905560

    申请日:2024-10-03

    Abstract: According to one embodiment, a semiconductor memory device includes a first conductive layer, a first semiconductor body, a second semiconductor body, a first memory layer, and a second memory layer. The first conductive layer includes first to fourth extension regions, and a first connection region. The first extension region extends in a first direction. The second extension region extends in the first direction and is arranged with the first extension region in the first direction. The third extension region extends in the first direction and is arranged with the first extension region in a second direction crossing the first direction. The fourth extension region extends in the first direction, is arranged with the third extension region in the first direction, and is arranged with the second extension region in the second direction.

    SEMICONDUCTOR DEVICE
    2.
    发明公开

    公开(公告)号:US20230307362A1

    公开(公告)日:2023-09-28

    申请号:US17901770

    申请日:2022-09-01

    Inventor: Takuya INATSUKA

    CPC classification number: H01L23/5283 H01L23/5226 H01L27/11551 H01L27/11578

    Abstract: A semiconductor device includes a substrate including an element region that includes a first extending portion extending in a first direction and a plurality of first protruding portions protruding from the first extending portion in a second direction intersecting the first direction. The device further includes a first plug provided on the first extending portion and extending in the first direction and in a third direction intersecting the first direction and the second direction. The device further includes a plurality of gate electrodes respectively provided above the plurality of first protruding portions so as to respectively overlap with the plurality of first protruding portions in the third direction.

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