公开(公告)号：US11551985B2

公开(公告)日：2023-01-10

申请号：US17010926

申请日：2020-09-03

Applicant: Kioxia Corporation

Inventor： Yuki Sugo ,  Ayana Amano ,  Keiichiro Hattori ,  Takeshi Watanabe

IPC: H01L23/14 ,  H01L25/065 ,  H01L23/31 ,  H01L23/495

Abstract: A semiconductor device of an embodiment includes: a wiring board; a semiconductor chip mounted on the wiring board; and a resin-containing layer bonded on the wiring board so as to fix the semiconductor chip to the wiring board. The resin-containing layer contains a resin-containing material having a breaking strength of 15 MPa or more at 125° C.

公开(公告)号：US12002686B2

公开(公告)日：2024-06-04

申请号：US17004202

申请日：2020-08-27

Applicant: KIOXIA CORPORATION

Inventor： Satoshi Tsukiyama ,  Satoru Takaku ,  Yuki Sugo ,  Ayana Amano

IPC: H01L25/065 ,  H01L21/50 ,  H01L23/16 ,  H01L21/603 ,  H01L23/29 ,  H01L23/31 ,  H01L25/00

CPC classification number: H01L21/50 ,  H01L23/16 ,  H01L25/0657 ,  H01L21/603 ,  H01L23/295 ,  H01L23/3142 ,  H01L25/50

Abstract: A semiconductor device includes a substrate, a first adhesive layer, a first semiconductor chip, and a second adhesive layer. The first adhesive layer is provided above a first surface of the substrate and includes a plurality of types of resins having different molecular weights and a filler. The first semiconductor chip is provided above the first adhesive layer. The second adhesive layer is provided in at least a part of a first region between the substrate and the first adhesive layer, and the second adhesive layer includes at least one type of resins among the plurality of types of resins having a molecular weight smaller than a molecular weight of other types of resins among the plurality of types of resins, and a filler having a lower concentration than that of the first adhesive layer.