公开(公告)号：US10141155B2

公开(公告)日：2018-11-27

申请号：US15588006

申请日：2017-05-05

Applicant: KLA-Tencor Corporation

Inventor： Gildardo R. Delgado ,  Edgardo Garcia Berrios ,  Frances Hill ,  Rudy Garcia

IPC: H01J37/06 ,  H01J37/28

Abstract: An emitter with a protective cap layer on an exterior surface of the emitter is disclosed. The emitter can have a diameter of 100 nm or less. The protective cap layer includes ruthenium. Ruthenium is resistant to oxidation and carbon growth. The protective cap layer also can have relatively low sputter yields to withstand erosion by ions. The emitter may be part of a system with an electron beam source. An electric field can be applied to the emitter and an electron beam can be generated from the emitter. The protective cap layer may be applied to the emitter by sputter deposition, atomic layer deposition (ALD), or ion sputtering.

公开(公告)号：US20180174794A1

公开(公告)日：2018-06-21

申请号：US15588006

申请日：2017-05-05

Applicant: KLA-Tencor Corporation

Inventor： Gildardo R. Delgado ,  Edgardo Garcia Berrios ,  Frances Hill ,  Rudy Garcia

IPC: H01J37/06 ,  H01J37/28

CPC classification number: H01J37/06 ,  H01J37/28 ,  H01J2237/061

Abstract: An emitter with a protective cap layer on an exterior surface of the emitter is disclosed. The emitter can have a diameter of 100 nm or less. The protective cap layer includes ruthenium. Ruthenium is resistant to oxidation and carbon growth. The protective cap layer also can have relatively low sputter yields to withstand erosion by ions. The emitter may be part of a system with an electron beam source. An electric field can be applied to the emitter and an electron beam can be generated from the emitter. The protective cap layer may be applied to the emitter by sputter deposition, atomic layer deposition (ALD), or ion sputtering.

公开(公告)号：US09984846B2

公开(公告)日：2018-05-29

申请号：US15217158

申请日：2016-07-22

Applicant: KLA-Tencor Corporation

Inventor： William G. Schultz ,  Gildardo R. Delgado ,  Frances Hill ,  Edgardo Garcia Berrios ,  Rudy Garcia

IPC: H01J1/34 ,  H01J1/304 ,  H01J9/02 ,  H01J19/24

CPC classification number: H01J1/3044 ,  H01J1/34 ,  H01J9/025 ,  H01J19/24 ,  H01J19/82 ,  H01J2201/30411 ,  H01J2201/30449 ,  H01J2201/30492 ,  H01J2209/0223

Abstract: An emitter containing a metal boride material has an at least partly rounded tip with a radius of 1 μm or less. An electric field can be applied to the emitter and an electron beam is generated from the emitter. To form the emitter, material is removed from a single crystal rod to form an emitter containing a metal boride material having a rounded tip with a radius of 1 μm or less.

公开(公告)号：US20180005791A1

公开(公告)日：2018-01-04

申请号：US15217158

申请日：2016-07-22

Applicant: KLA-Tencor Corporation

Inventor： William G. Schultz ,  Gildardo R. Delgado ,  Frances Hill ,  Edgardo Garcia Berrios ,  Rudy Garcia

IPC: H01J1/304 ,  H01J19/24 ,  H01J1/34 ,  H01J9/02

CPC classification number: H01J1/3044 ,  H01J1/34 ,  H01J9/025 ,  H01J19/24 ,  H01J19/82 ,  H01J2201/30411 ,  H01J2201/30449 ,  H01J2201/30492 ,  H01J2209/0223

Abstract: An emitter containing a metal boride material has an at least partly rounded tip with a radius of 1 μm or less. An electric field can be applied to the emitter and an electron beam is generated from the emitter. To form the emitter, material is removed from a single crystal rod to form an emitter containing a metal boride material having a rounded tip with a radius of 1 μm or less.