公开(公告)号：US10340165B2

公开(公告)日：2019-07-02

申请号：US15451038

申请日：2017-03-06

Applicant: KLA-Tencor Corporation

Inventor： Jeremy Nabeth ,  Onur N. Demirer ,  Ramkumar Karur-Shanmugam ,  Choon (George) Hoong Hoo ,  Christian Sparka ,  Hoyoung Heo ,  Stuart Sherwin ,  Fatima Anis ,  Mark D. Smith ,  William Pierson

IPC: G01C1/06 ,  H01L21/67 ,  G01B11/27 ,  G06F17/50 ,  G01B11/00 ,  G03F7/20 ,  G03F9/00

Abstract: A semiconductor tool includes an illumination source to generate an illumination beam, one or more illumination optical elements to direct a portion of the illumination beam to a sample, a detector, one or more collection optical elements to direct radiation emanating from the sample to the detector, and a controller communicatively coupled to the detector. The controller is configured to measure alignment at a plurality of locations across the sample to generate alignment data, select an analysis area for alignment zone determination, divide the analysis area into two or more alignment zones having different alignment signatures; model the alignment data of at least a first alignment zone of the two or more alignment zones using a first alignment model, and model the alignment data of at least a second alignment zone of the two or more alignment zones using a second alignment model different than the first alignment model.

公开(公告)号：US20170287754A1

公开(公告)日：2017-10-05

申请号：US15451038

申请日：2017-03-06

Applicant: KLA-Tencor Corporation

Inventor： Jeremy Nabeth ,  Onur N. Demirer ,  Ramkumar Karur-Shanmugam ,  Choon George Hoong Hoo ,  Christian Sparka ,  Hoyoung Heo ,  Stuart Sherwin ,  Fatima Anis ,  Mark D. Smith ,  William Pierson

IPC: H01L21/67 ,  G06F17/50 ,  G01B11/27

CPC classification number: H01L21/67259 ,  G01B11/002 ,  G01B11/272 ,  G01B2210/56 ,  G03F7/70633 ,  G03F9/7046 ,  G06F17/5009

Abstract: A semiconductor tool includes an illumination source to generate an illumination beam, one or more illumination optical elements to direct a portion of the illumination beam to a sample, a detector, one or more collection optical elements to direct radiation emanating from the sample to the detector, and a controller communicatively coupled to the detector. The controller is configured to measure alignment at a plurality of locations across the sample to generate alignment data, select an analysis area for alignment zone determination, divide the analysis area into two or more alignment zones having different alignment signatures; model the alignment data of at least a first alignment zone of the two or more alignment zones using a first alignment model, and model the alignment data of at least a second alignment zone of the two or more alignment zones using a second alignment model different than the first alignment model.

公开(公告)号：US10024654B2

公开(公告)日：2018-07-17

申请号：US15091021

申请日：2016-04-05

Applicant: KLA-Tencor Corporation

Inventor： Mark D. Smith ,  Jose Solomon ,  Stuart Sherwin ,  Walter Mieher ,  Ady Levy

IPC: G01B9/02 ,  G01B11/02 ,  G01L1/24 ,  G01B11/16 ,  G01B11/24 ,  H01L21/66

Abstract: The determination of in-plane distortions of a substrate includes measuring one or more out-of-plane distortions of the substrate in an unchucked state, determining an effective film stress of a film on the substrate in the unchucked state based on the measured out-of-plane distortions of the substrate in the unchucked state, determining in-plane distortions of the substrate in a chucked state based on the effective film stress of the film on the substrate in the unchucked state and adjusting at least one of a process tool or an overlay tool based on at least one of the measured out-of-plane distortions or the determined in-plane distortions.

公开(公告)号：US20160290789A1

公开(公告)日：2016-10-06

申请号：US15091021

申请日：2016-04-05

Applicant: KLA-Tencor Corporation

Inventor： Mark D. Smith ,  Jose Solomon ,  Stuart Sherwin ,  Walter Mieher ,  Ady Levy

IPC: G01B11/16

CPC classification number: G01B11/161 ,  G01B9/02021 ,  G01B9/02027 ,  G01B11/2441 ,  G01B2210/56 ,  H01L22/12

Abstract: The determination of in-plane distortions of a substrate includes measuring one or more out-of-plane distortions of the substrate in an unchucked state, determining an effective film stress of a film on the substrate in the unchucked state based on the measured out-of-plane distortions of the substrate in the unchucked state, determining in-plane distortions of the substrate in a chucked state based on the effective film stress of the film on the substrate in the unchucked state and adjusting at least one of a process tool or an overlay tool based on at least one of the measured out-of-plane distortions or the determined in-plane distortions.

Abstract translation: 衬底的平面内失真的确定包括测量处于非夹角状态的衬底的一个或多个面外失真，基于所测量的外延位置来确定衬底上的薄膜在无夹持状态下的有效薄膜应力， 基于在无夹持状态下的基板的平面失真，基于在无夹持状态下的基板上的膜的有效膜应力来确定基板在夹持状态下的面内失真，并且调整处理工具或 基于测量的平面外失真或确定的平面内失真中的至少一个的覆盖工具。