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    Determining a configuration for an optical element positioned in a collection aperture during wafer inspection
    1.
    发明授权
    Determining a configuration for an optical element positioned in a collection aperture during wafer inspection 有权

    公开(公告)号：US10215713B2

    公开(公告)日：2019-02-26

    申请号：US15626123

    申请日：2017-06-18

    Applicant: KLA-Tencor Corporation

    Inventor： Pavel Kolchin ,  Mikhail Haurylau ,  Junwei Wei ,  Dan Kapp ,  Robert Danen ,  Grace Chen

    IPC: G01N21/00 ,  G01N21/95 ,  G01N21/956 ,  G01N21/47 ,  G01N21/88

    Abstract: Methods and systems for determining a configuration for an optical element positioned in a collection aperture during wafer inspection are provided. One system includes a detector configured to detect light from a wafer that passes through an optical element, which includes a set of collection apertures, when the optical element has different configurations thereby generating different images for the different configurations. The system also includes a computer subsystem configured for constructing additional image(s) from two or more of the different images, and the two or more different images used to generate any one of the additional image(s) do not include only different images generated for single collection apertures in the set. The computer subsystem is further configured for selecting one of the different or additional configurations for the optical element based on the different images and the additional image(s).

    SYSTEM AND METHOD TO DETERMINE DEPTH FOR OPTICAL WAFER INSPECTION
    3.
    发明申请
    SYSTEM AND METHOD TO DETERMINE DEPTH FOR OPTICAL WAFER INSPECTION 有权
    用于确定光学检测深度的系统和方法

    公开(公告)号：US20140268117A1

    公开(公告)日：2014-09-18

    申请号：US13840329

    申请日：2013-03-15

    Applicant: KLA-Tencor Corporation

    Inventor： Pavel Kolchin ,  Mikhail Haurylau ,  Robert Danen

    IPC: G01N21/95 ,  G02B5/28

    CPC classification number: G01N21/9505 ,  G01N21/8851 ,  G01N2021/8874 ,  G02B5/28 ,  G02B5/3083 ,  G06T7/0012 ,  G06T7/004 ,  G06T7/0051 ,  G06T2207/30148 ,  H04N5/2256

    Abstract: A computer-based method for inspecting a wafer, including: storing, in a memory element for at least one computer, computer readable instructions; detecting a first light beam rotating in a first spiral about a first central axis; and executing, using a processor for the at least one computer, the computer readable instructions to generate, using the detected first light beam, an image including at least one shape, determine an orientation of the at least one shape or a size of the at least one shape, and calculate a depth of a defect in the wafer according to the orientation or the size.

    Abstract translation: 一种用于检查晶片的基于计算机的方法，包括：将用于至少一个计算机的存储元件存储在计算机可读指令中; 检测围绕第一中心轴以第一螺旋旋转的第一光束; 以及使用所述至少一个计算机的处理器执行所述计算机可读指令，以使用所检测的第一光束来生成包括至少一种形状的图像，确定所述至少一种形状的取向或所述at 至少一个形状，并且根据取向或尺寸计算晶片中缺陷的深度。

    Determining a Configuration for an Optical Element Positioned in a Collection Aperture During Wafer Inspection
    7.
    发明申请
    Determining a Configuration for an Optical Element Positioned in a Collection Aperture During Wafer Inspection 有权
    确定晶片检测期间定位在收集孔中的光学元件的配置

    公开(公告)号：US20150377797A1

    公开(公告)日：2015-12-31

    申请号：US14749564

    申请日：2015-06-24

    Applicant: KLA-Tencor Corporation

    Inventor： Pavel Kolchin ,  Mikhail Haurylau ,  Junwei Wei ,  Dan Kapp ,  Robert Danen ,  Grace Chen

    IPC: G01N21/95 ,  G01N21/88

    CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956 ,  G01N21/95623 ,  G01N2021/8887 ,  G01N2201/0668

    Abstract: Methods and systems for determining a configuration for an optical element positioned in a collection aperture during wafer inspection are provided. One system includes a detector configured to detect light from a wafer that passes through an optical element, which includes a set of collection apertures, when the optical element has different configurations thereby generating different images for the different configurations. The system also includes a computer subsystem configured for constructing additional image(s) from two or more of the different images, and the two or more different images used to generate any one of the additional image(s) do not include only different images generated for single collection apertures in the set. The computer subsystem is further configured for selecting one of the different or additional configurations for the optical element based on the different images and the additional image(s).

    Abstract translation: 提供了用于在晶片检查期间确定位于收集孔中的光学元件的配置的方法和系统。 一个系统包括检测器，其被配置为当光学元件具有不同的配置从而为不同的配置生成不同的图像时，检测来自晶片的光，其通过包括一组收集孔的光学元件。 该系统还包括配置用于从两个或多个不同图像构建附加图像的计算机子系统，并且用于生成附加图像中的任何一个的两个或多个不同图像不仅包括生成的不同图像 用于集合中的单个收集孔。 计算机子系统还被配置为基于不同的图像和附加图像来选择用于光学元件的不同或附加配置之一。

    DESIGN AIDED IMAGE RECONSTRUCTION
    8.
    发明申请
    DESIGN AIDED IMAGE RECONSTRUCTION 审中-公开

    公开(公告)号：US20190295237A1

    公开(公告)日：2019-09-26

    申请号：US16361079

    申请日：2019-03-21

    Applicant: KLA-Tencor Corporation

    Inventor： Soren Konecky ,  Robert Danen

    IPC: G06T7/00 ,  G01N21/95 ,  G01N21/956 ,  G01N23/2251 ,  G06T7/12 ,  G06T7/174 ,  G06K9/62 ,  G06T3/40

    Abstract: Methods and systems for determining boundaries of patterned features formed on a specimen from an unresolved image of the specimen are provided. One system includes computer subsystem(s) configured for comparing a difference image in which patterned feature(s) are unresolved to different simulated images. The different simulated images are generated by simulating difference images generated for the patterned feature(s) formed on the specimen with different perturbations, respectively. The computer subsystem(s) are configured for, based on the comparing, assigning an amplitude to each of the different perturbations. The computer subsystem(s) are further configured for determining one or more boundaries of the patterned feature(s) formed on the specimen by applying the different perturbations to one or more designed boundaries of the patterned feature(s) with the assigned amplitudes.

    System and method to determine depth for optical wafer inspection
    10.
    发明授权
    System and method to determine depth for optical wafer inspection 有权
    确定光学晶圆检查深度的系统和方法

    公开(公告)号：US09389349B2

    公开(公告)日：2016-07-12

    申请号：US13840329

    申请日：2013-03-15

    Applicant: KLA-Tencor Corporation

    Inventor： Pavel Kolchin ,  Mikhail Haurylau ,  Robert Danen

    IPC: G01N21/00 ,  G02B5/28 ,  G01N21/95 ,  G02B5/30

    CPC classification number: G01N21/9505 ,  G01N21/8851 ,  G01N2021/8874 ,  G02B5/28 ,  G02B5/3083 ,  G06T7/0012 ,  G06T7/004 ,  G06T7/0051 ,  G06T2207/30148 ,  H04N5/2256

    Abstract: A computer-based method for inspecting a wafer, including: storing, in a memory element for at least one computer, computer readable instructions; detecting a first light beam rotating in a first spiral about a first central axis; and executing, using a processor for the at least one computer, the computer readable instructions to generate, using the detected first light beam, an image including at least one shape, determine an orientation of the at least one shape or a size of the at least one shape, and calculate a depth of a defect in the wafer according to the orientation or the size.

    Abstract translation: 一种用于检查晶片的基于计算机的方法，包括：将用于至少一个计算机的存储元件存储在计算机可读指令中; 检测围绕第一中心轴以第一螺旋旋转的第一光束; 以及使用所述至少一个计算机的处理器执行所述计算机可读指令，以使用所检测的第一光束来生成包括至少一种形状的图像，确定所述至少一种形状的取向或所述at 至少一个形状，并且根据取向或尺寸计算晶片中缺陷的深度。

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