Optical metrology with reduced sensitivity to grating anomalies
    1.
    发明授权
    Optical metrology with reduced sensitivity to grating anomalies 有权
    光学测量与光栅异常的灵敏度降低

    公开(公告)号:US09470639B1

    公开(公告)日:2016-10-18

    申请号:US15014987

    申请日:2016-02-03

    Abstract: Methods and systems for performing broadband spectroscopic metrology with reduced sensitivity to grating anomalies are presented herein. A reduction in sensitivity to grating anomalies is achieved by selecting a subset of available system parameter values for measurement analysis. The reduction in sensitivity to grating anomalies enables an optimization of any combination of precision, sensitivity, accuracy, system matching, and computational effort. These benefits are particularly evident in optical metrology systems having large ranges of available azimuth angle, angle of incidence, illumination wavelength, and illumination polarization. Predictions of grating anomalies are determined based on a measurement model that accurately represents the interaction between the measurement system and the periodic metrology target under measurement. A subset of available system parameter values is selected to reduce the impact of grating anomalies on measurement results. The selected subset of available system parameters is implemented on a configurable spectroscopic metrology system performing measurements.

    Abstract translation: 本文介绍了对光栅异常灵敏度降低的宽带光谱测量方法和系统。 通过选择用于测量分析的可用系统参数值的子集来实现对光栅异常的灵敏度的降低。 对光栅异常的灵敏度的降低使得能够优化精度,灵敏度,精度,系统匹配和计算工作的任何组合。 在具有大范围的可用方位角,入射角,照明波长和照明偏振的光学测量系统中,这些益处特别明显。 基于精确表示测量系统和测量周期测量目标之间的相互作用的测量模型,确定光栅异常预测。 选择可用系统参数值的一个子集来减少光栅异常对测量结果的影响。 所选择的可用系统参数的子集在执行测量的可配置光谱计量系统上实现。

    Method and System for Determining In-Plane Distortions in a Substrate
    3.
    发明申请
    Method and System for Determining In-Plane Distortions in a Substrate 有权
    用于确定基板中的平面失真的方法和系统

    公开(公告)号:US20160290789A1

    公开(公告)日:2016-10-06

    申请号:US15091021

    申请日:2016-04-05

    Abstract: The determination of in-plane distortions of a substrate includes measuring one or more out-of-plane distortions of the substrate in an unchucked state, determining an effective film stress of a film on the substrate in the unchucked state based on the measured out-of-plane distortions of the substrate in the unchucked state, determining in-plane distortions of the substrate in a chucked state based on the effective film stress of the film on the substrate in the unchucked state and adjusting at least one of a process tool or an overlay tool based on at least one of the measured out-of-plane distortions or the determined in-plane distortions.

    Abstract translation: 衬底的平面内失真的确定包括测量处于非夹角状态的衬底的一个或多个面外失真,基于所测量的外延位置来确定衬底上的薄膜在无夹持状态下的有效薄膜应力, 基于在无夹持状态下的基板的平面失真,基于在无夹持状态下的基板上的膜的有效膜应力来确定基板在夹持状态下的面内失真,并且调整处理工具或 基于测量的平面外失真或确定的平面内失真中的至少一个的覆盖工具。

Patent Agency Ranking