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公开(公告)号：US10736606B2
公开(公告)日：2020-08-11
申请号：US15774611
申请日：2016-11-10
发明人： Pawel Michalski , Franciscus Johannes Gerardus Hakkens , Edward Theodorus Maria Berben , Kevin Grayson Wickline , Lucas Johannes Anna Maria Beckers , Peter Dirksen
摘要： An acoustic window layer for an ultrasound array, which layer has an inner surface arranged to face the array and an outer surface arranged to face a patient, and comprising an outer layer comprising a thermoplastic polymer selected from a polyolefin family (TPO) and an elastomer selected from the polyolefin family (POE) blended therein, wherein the outer layer located at the outer surface of the acoustic window layer. In a preferred embodiment the blend comprises a copolymer of ethylene-octene and polymethylpentene. The thermoplastic polyolefin provides the blend with mechanical, chemical stability and low acoustic wave attenuation; whilst the polyolefin elastomer provides a possibility to tune the acoustic impedance of the blend and to further improve its acoustic wave propagation properties.
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公开(公告)号：US09828236B2
公开(公告)日：2017-11-28
申请号：US14370110
申请日：2013-01-23
发明人： Peter Dirksen , Ruediger Mauczok , Koray Karakaya , Johan Klootwijk , Bout Marcelis , Marcel Mulder
CPC分类号： B81B3/0086 , B06B1/0292 , B81B3/0027 , B81B2201/0271 , B81C1/00523 , H04R19/005 , H04R31/00 , H04R31/003
摘要： The present invention relates to a method of manufacturing a capacitive micro- machined transducer (100), in particular a CMUT, the method comprising depositing a first electrode layer (10) on a substrate (1), depositing a first dielectric film (20) on the first electrode layer (10), depositing a sacrificial layer (30) on the first dielectric film (20), the sacrificial layer (30) being removable for forming a cavity (35) of the transducer, depositing a second dielectric film (40) on the sacrificial layer (30), depositing a second electrode layer (50) on the second dielectric film (40), and patterning at least one of the deposited layers and films (10, 20, 30, 40, 50), wherein the depositing steps are performed by Atomic Layer Deposition. The present invention further relates to a capacitive micro-machined transducer (100), in particular a CMUT, manufactured by such method.
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3.发明申请公开(公告)号：US20230012105A1
公开(公告)日：2023-01-12
申请号：US17948371
申请日：2022-09-20
发明人： Sergei Shulepov , Peter Dirksen , Hans-Peter Loebl , Franciscus Paulus Maria Budzelaar , Petrus Henricus Maria Timmermans , Nico Maris Adriaan de Wild
摘要： Disclosed are systems and methods of operation for capacitive radio frequency micro-electromechanical switches, such as CMUT cells for use in an ultrasound system. An RFMEMS may include substrate, a first electrode connected to the substrate, a membrane and a second electrode connected to the membrane.
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公开(公告)号：US10898924B2
公开(公告)日：2021-01-26
申请号：US15325492
申请日：2015-07-13
发明人： Wojtek Sudol , Peter Dirksen , Vincent Adrianus Henneken , Ronald Dekker , Marcus Cornelis Louwerse
摘要： A large aperture CMUT transducer array is formed of a plurality of adjacently located tiles of CMUT cells. The adjacent edges of the tiles are formed by an anisotropic etch process, preferably a deep reactive ion etching process which is capable of cutting through the die and its substrate while maintaining vertical edges in close proximity to the CMUT cells at the edge of the tile. This enables the CMUT cells of continuous rows or columns to exhibit a constant pitch over multiple CMUT cell tiles. The tiles also contain interconnect electrodes along an edge for making electrical connections to the tiles with flex circuit.
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5.发明授权公开(公告)号：US09231496B2
公开(公告)日：2016-01-05
申请号：US14369341
申请日：2013-01-18
发明人： Peter Dirksen , Ruediger Mauczok , Koray Karakaya , Johan Hendrik Klootwijk , Bout Marcelis , Marcel Mulder
CPC分类号： H02N1/006 , B06B1/0292 , B81B3/00 , B81B2203/0127 , B81C1/00158 , B81C1/00373 , H02N1/08
摘要： The present invention relates to a method of manufacturing a capacitive micro-machined transducer (100), in particular a CMUT, the method comprising depositing a first electrode layer (10) on a substrate (1), depositing a first dielectric film (20) on the first electrode layer (10), depositing a sacrificial layer (30) on the first dielectric film (20), the sacrificial layer (30) being removable for forming a cavity (35) of the transducer, depositing a second dielectric film (40) on the sacrificial layer (30), and depositing a second electrode layer (50) on the second dielectric film (40), wherein the first dielectric film (20) and/or the second dielectric film (40) comprises a first layer comprising an oxide, a second layer comprising a high-k material, and a third layer comprising an oxide, and wherein the depositing steps are performed by Atomic Layer Deposition. The present invention further relates to a capacitive micro-machined transducer (100), in particular a CMUT, manufactured by such method.
摘要翻译： 本发明涉及一种制造电容微加工的换能器（100），特别是CMUT的方法，该方法包括在衬底（1）上沉积第一电极层（10），沉积第一电介质膜（20） 在所述第一电极层（10）上，在所述第一介电膜（20）上沉积牺牲层（30），所述牺牲层（30）可去除以形成所述换能器的空腔（35），沉积第二电介质膜 40），并且在所述第二电介质膜（40）上沉积第二电极层（50），其中所述第一电介质膜（20）和/或所述第二电介质膜（40）包括第一层 包括氧化物，包含高k材料的第二层和包含氧化物的第三层，并且其中所述沉积步骤通过原子层沉积进行。 本发明还涉及通过这种方法制造的电容式微加工的换能器（100），特别是CMUT。
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6.发明申请公开(公告)号：US20140375168A1
公开(公告)日：2014-12-25
申请号：US14369341
申请日：2013-01-18
发明人： Peter Dirksen , Ruediger Mauczok , Koray Karakaya , Johan Hendrik KlooTwijk , Bout Marcelis , Marcel Mulder
CPC分类号： H02N1/006 , B06B1/0292 , B81B3/00 , B81B2203/0127 , B81C1/00158 , B81C1/00373 , H02N1/08
摘要： The present invention relates to a method of manufacturing a capacitive micro-machined transducer (100), in particular a CMUT, the method comprising depositing a first electrode layer (10) on a substrate (1), depositing a first dielectric film (20) on the first electrode layer (10), depositing a sacrificial layer (30) on the first dielectric film (20), the sacrificial layer (30) being removable for forming a cavity (35) of the transducer, depositing a second dielectric film (40) on the sacrificial layer (30), and depositing a second electrode layer (50) on the second dielectric film (40), wherein the first dielectric film (20) and/or the second dielectric film (40) comprises a first layer comprising an oxide, a second layer comprising a high-k material, and a third layer comprising an oxide, and wherein the depositing steps are performed by Atomic Layer Deposition. The present invention further relates to a capacitive micro-machined transducer (100), in particular a CMUT, manufactured by such method.
摘要翻译： 本发明涉及一种制造电容微加工的换能器（100），特别是CMUT的方法，该方法包括在衬底（1）上沉积第一电极层（10），沉积第一电介质膜（20） 在所述第一电极层（10）上，在所述第一介电膜（20）上沉积牺牲层（30），所述牺牲层（30）可去除以形成所述换能器的空腔（35），沉积第二电介质膜 40），并且在所述第二电介质膜（40）上沉积第二电极层（50），其中所述第一电介质膜（20）和/或所述第二电介质膜（40）包括第一层 包括氧化物，包含高k材料的第二层和包含氧化物的第三层，并且其中所述沉积步骤通过原子层沉积进行。 本发明还涉及通过这种方法制造的电容式微加工的换能器（100），特别是CMUT。
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公开(公告)号：US10923099B2
公开(公告)日：2021-02-16
申请号：US15309493
申请日：2015-04-30
发明人： Lucas Johannes Anna Maria Beckers , Peter Dirksen , Nico Maris Adriaan de Wild , Franciscus Johannes Gerardus Hakkens
摘要： An acoustical lens (20) for an ultrasound probe (14) is disclosed. The acoustical lens comprises an inner surface (26) for facing an emission surface (46) of an ultrasound transducer (40) and for receiving ultrasound waves from the ultrasound transducer. The acoustical lens further comprises an outer surface (24) for emitting the ultrasound waves received at the inner surface, wherein the inner surface is formed as a convexly curved surface and wherein at least one recess (34) is associated to an edge of the inner surface for capturing mold material.
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公开(公告)号：US10293375B2
公开(公告)日：2019-05-21
申请号：US15021962
申请日：2014-09-15
摘要： Disclosed is a method of manufacturing a capacitive micro-machined ultrasonic transducer (CMUT) device comprising a first electrode (112) on a substrate (110) and a second electrode (122) embedded in an electrically insulating membrane, the first electrode and the membrane being separated by a cavity (130) formed by the removal of a sacrificial material (116) in between the first electrode and the membrane, the method comprising forming a membrane portion (22) on the second electrode and a further membrane portion (24) extending from the membrane portion towards the substrate alongside the sacrificial material, wherein the respective thicknesses the membrane portion and the further membrane portion exceed the thickness of the sacrificial material prior to forming said cavity. A CMUT device manufactured in accordance with this method and an apparatus comprising such a CMUT device are also disclosed.
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公开(公告)号：US20180159445A1
公开(公告)日：2018-06-07
申请号：US15889255
申请日：2018-02-06
发明人： Peter Dirksen
CPC分类号： H02N1/006 , B06B1/0292
摘要： The present invention relates to a wafer (100) being subdivided and separable into a plurality of dies. Each die (110) comprises an array of capacitive micro-machined transducer cells (1). Each cell comprises a substrate (10) comprising a first electrode (11), a membrane (13) comprising a second electrode (14), and a cavity (12) between the substrate (10) and the membrane (13). Each cell (1) of at least a part of the dies (110) comprises a compensating plate (15) on the membrane (13), each compensating plate (15) having a configuration for influencing a bow (h) of the membrane (13). The configurations of the compensating plates (13) vary across the wafer (100). The present invention further relates to a method of manufacturing such a wafer and a method of manufacturing such a die.
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公开(公告)号：US11386883B2
公开(公告)日：2022-07-12
申请号：US16062656
申请日：2016-12-16
发明人： Peter Dirksen , Sergei Shulepov , Franciscus Johannes Gerardus Hakkens , Petrus Henricus Maria Timmermans , Lucas Johannes Anna Maria Beckers
摘要： An acoustic lens suitable for a CMUT array (74) is provided. The acoustic lens comprising: a first layer (47) comprising a thermoset elastomer having a polymeric material selected from hydrocarbons, wherein the first layer has an inner surface (72) arranged to face the array and an outer convex shaped surface (40) arranged to oppose the inner surface; and a second layer (42) coupled to the outer surface of the first layer and comprising thermoplastic polymer polymethylpentene and an elastomer selected from the polyolefin family (POE) blended therein, wherein the outer layer located at the outer surface of the acoustic window layer, wherein the first layer has a first acoustic wave velocity (v1) and the second layer has a second acoustic wave velocity (v2), said second velocity is larger than the first acoustic wave velocity.
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