公开(公告)号：US20140030532A1

公开(公告)日：2014-01-30

申请号：US13663728

申请日：2012-10-30

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji Young BYUN ,  Sang Hoon KIM ,  Ju Yeon HWANG ,  Heon Phil HA

IPC: H01B19/04 ,  C23C16/503 ,  B32B15/00 ,  C23C16/48 ,  B05D5/10 ,  B05D1/36 ,  C23C16/44 ,  C23C16/50

CPC classification number: C23C18/44 ,  C23C18/1608 ,  C23C18/165 ,  C23C18/32 ,  C23C18/34 ,  C23C18/36 ,  C23C18/38 ,  Y10T428/31678

Abstract: Provided is a technique for electroless deposition (ELD) for forming metal conductive layer on an insulating substrate made of glass, polymer, etc. According to an aspect, an adhesive layer and a catalyst layer are formed on a substrate using a dry deposition method, such as are plasma deposition (APD) or sputtering, etc., and electroless deposition is performed thereon, thereby forming a metal thin, film. Therefore, it is possible to significantly simplify a complicated pretreatment process required for electroless depositions and increase adhesive strength of a deposited metal thin film.

Abstract translation: 提供了一种用于在由玻璃，聚合物等制成的绝缘基板上形成金属导电层的无电沉积（ELD）技术。根据一方面，使用干法沉积法在基板上形成粘合剂层和催化剂层， 例如等离子体沉积（APD）或溅射等，并在其上进行无电沉积，从而形成金属薄膜。 因此，可以显着地简化无电沉积所需的复杂的预处理工艺并增加沉积的金属薄膜的粘合强度。