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1.发明申请METHOD OF FORMING METAL THIN FILM USING ELECTROLESS DEPOSITION AND THIN FILM DEVICE FABRICATED USING THE METHOD 审中-公开使用电沉积法形成金属薄膜的方法和使用该方法制造的薄膜器件公开(公告)号：US20140030532A1
公开(公告)日：2014-01-30
申请号：US13663728
申请日：2012-10-30
Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventor： Ji Young BYUN , Sang Hoon KIM , Ju Yeon HWANG , Heon Phil HA
CPC classification number: C23C18/44 , C23C18/1608 , C23C18/165 , C23C18/32 , C23C18/34 , C23C18/36 , C23C18/38 , Y10T428/31678
Abstract: Provided is a technique for electroless deposition (ELD) for forming metal conductive layer on an insulating substrate made of glass, polymer, etc. According to an aspect, an adhesive layer and a catalyst layer are formed on a substrate using a dry deposition method, such as are plasma deposition (APD) or sputtering, etc., and electroless deposition is performed thereon, thereby forming a metal thin, film. Therefore, it is possible to significantly simplify a complicated pretreatment process required for electroless depositions and increase adhesive strength of a deposited metal thin film.
Abstract translation: 提供了一种用于在由玻璃，聚合物等制成的绝缘基板上形成金属导电层的无电沉积（ELD）技术。根据一方面，使用干法沉积法在基板上形成粘合剂层和催化剂层， 例如等离子体沉积（APD）或溅射等，并在其上进行无电沉积，从而形成金属薄膜。 因此，可以显着地简化无电沉积所需的复杂的预处理工艺并增加沉积的金属薄膜的粘合强度。
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公开(公告)号：US20240091759A1
公开(公告)日：2024-03-21
申请号：US18468625
申请日：2023-09-15
Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventor： Jong Min KIM , Sang Hoon KIM , Chang Kyu HWANG , Seung Yong LEE , So Hye CHO , Jae Won CHOI
CPC classification number: B01J37/349 , B01J21/18 , B01J37/0217
Abstract: Disclosed herein is a method of depositing a transition metal single-atom catalyst including preparing a carbon carrier, and depositing a transition metal single-atom catalyst on the carbon carrier, in which the carbon carrier is surface-treated by an oxidation process, and wherein the deposition is carried out by an arc plasma process.
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公开(公告)号：US20230141455A1
公开(公告)日：2023-05-11
申请号：US17730877
申请日：2022-04-27
Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventor： Sang Hoon KIM , Gun-hee MOON , Jongsik KIM
CPC classification number: B01J23/745 , B01J23/72 , B01J6/001 , B01J37/031 , B01J37/08 , B01J37/04 , B01J37/345
Abstract: The present disclosure relates to a catalyst that removes an organic compound by using a metal oxide catalyst and a preparation method thereof and a method for degradation of an organic compound using the same. Particularly, the present disclosure relates to a copper-iron oxide (Cu—Fe2O3) catalyst composition that is prepared by following steps of: adding a mixed solution of an iron (Fe) precursor and a copper (Cu) precursor to a precipitator solution (S1); obtaining precipitates by heating a solution prepared in the step S1 (S2); obtaining a metal oxalate by filtering the precipitates obtained in the step S2 (S3); drying the metal oxalate obtained in the step S3 (S4); and obtaining a copper-iron oxide catalyst by calcinating the metal oxalate subjected to the step S4 (S5) and a method for removal of an organic compound using the same.
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公开(公告)号：US20190224662A1
公开(公告)日：2019-07-25
申请号：US16255662
申请日：2019-01-23
Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventor： Ji Young BYUN , Sang Hoon KIM , Jong Sik KIM
Abstract: Provided are a method of manufacturing a honeycomb metal structure by using aluminum (Al) powder and a metal catalyst module including the honeycomb metal structure. The method includes preparing a honeycomb structure including at least one substrate including iron (Fe), coating at least a part of the substrate with a viscid material whose viscosity is increased by moisture, attaching metal powder onto the viscid material, adhering the metal powder to the substrate by supplying the moisture to the viscid material, and generating an uneven structure made of the metal powder bonded to the substrate, by performing heat treatment of the substrate onto which the metal powder is adhered.
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