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1.
公开(公告)号:US20190189884A1
公开(公告)日:2019-06-20
申请号:US15996706
申请日:2018-06-04
Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventor: Jin-Sang KIM , Chong-Min KOO , Seung-Hyub BAEK , Seong-Keun KIM , Chong-Yun KANG , Soon-Man HONG , Seung-Sang HWANG , Ji-Won CHOI , Seok-Jin YOON , Kwang-Chon KIM , Kyung-Youl BAEK , Sang-Ho CHO
IPC: H01L35/24 , H01L35/16 , H01L35/18 , C04B35/547 , C04B35/628
CPC classification number: H01L35/24 , C04B35/547 , C04B35/628 , C04B2235/3843 , H01L35/16 , H01L35/18
Abstract: A thermoelectric composite material includes MXene inserted at a boundary of a crystal grain consisting of a thermoelectric material. Accordingly, the thermoelectric composite material may have a reduced thermal conductivity and an increased electrical conductivity. Furthermore, a mechanical property of the thermoelectric composite material may be improved. Thus, the thermoelectric composite material may improve a thermoelectric ability of a thermoelectric module.
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公开(公告)号:US20180247941A1
公开(公告)日:2018-08-30
申请号:US15648770
申请日:2017-07-13
Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventor: Seong Keun KIM , Jung Joon PYEON , Cheol Jin CHO , Sangtae KIM , Doo Seok JEONG , Seung-Hyub BAEK , Chong-Yun KANG , Ji-Won CHOI , Jin-Sang KIM
IPC: H01L27/108 , H01L49/02 , H01L21/285 , H01L21/02
CPC classification number: H01L27/10808 , H01L21/02186 , H01L21/0228 , H01L21/28556 , H01L28/75
Abstract: A capacitor for a semiconductor memory element includes a lower electrode, a dielectric layer disposed on the lower electrode and including titanium oxide, and an upper electrode disposed on the dielectric layer. The lower electrode includes a first metal and a second metal, the first metal including at least one selected from the group consisting of platinum (Pt), osmium (Os), rhodium (Rh) and palladium (Pd), the second metal including at least one selected from the group consisting of ruthenium (Ru) and iridium (Ir).
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