MULTI-LAYERED POLYIMIDE FILM, METAL-CLAD LAMINATE, AND METHOD FOR PRODUCING MULTI-LAYERED POLYIMIDE FILM

    公开(公告)号:US20230250317A1

    公开(公告)日:2023-08-10

    申请号:US18133393

    申请日:2023-04-11

    CPC classification number: C09J7/38 C09J7/25 H05K1/036 H05K1/0393 H05K2201/0154

    Abstract: A multi-layered polyimide film includes a non-thermoplastic polyimide layer, and an adhesive layer that is disposed on at least one surface of the non-thermoplastic polyimide layer and contains polyimide. A dielectric loss tangent of the non-thermoplastic polyimide layer at a frequency of 10 GHz, a temperature of 23° C. and a relative humidity of 50% is 0.0030 or less. The adhesive layer has no melting peak or has a melting heat of 1.0 J/g or less at a melting peak in a temperature range of 100° C. or higher and 420° C. or lower. The polyimide contained in the adhesive layer has one or more tetracarboxylic dianhydride residues selected from a pyromellitic dianhydride residue and a 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue, and one or more diamine residues selected from a 1,3-bis(4-aminophenoxy)benzene residue and a 4,4′-diamino-2,2′-dimethylbiphenyl residue.

    NON-THERMOPLASTIC POLYIMIDE FILM, MULTI-LAYERED POLYIMIDE FILM AND METAL-CLAD LAMINATE

    公开(公告)号:US20230265252A1

    公开(公告)日:2023-08-24

    申请号:US18137757

    申请日:2023-04-21

    CPC classification number: C08J5/18 C08G73/10 C08J2379/08

    Abstract: A non-thermoplastic polyimide film contains non-thermoplastic polyimide. The non-thermoplastic polyimide has a 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue, a 4,4′-oxydiphthalic anhydride residue, a p-phenylenediamine residue and a 1,3-bis(4-aminophenoxy)benzene residue. Where the content ratio of the 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue is A1 mol %, the content ratio of the 4,4′-oxydiphthalic anhydride residue is A2 mol %, the content ratio of the p-phenylenediamine residue is B1 mol %, and the content ratio of the 1,3-bis(4-aminophenoxy)benzene residue is B2 mol %, the relationships of A1+A2≥80, B1+B2≥80 and (A1+B1)/(A2+B2)≤3.50 are satisfied.

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