公开(公告)号：US12234323B2

公开(公告)日：2025-02-25

申请号：US17622424

申请日：2020-06-22

Applicant: Kaneka Corporation

Inventor： Takashi Ando ,  Kohei Ogawa ,  Masahiro Miyamoto

IPC: C08G73/10 ,  C08G73/16 ,  C08J5/18 ,  C08K5/521

Abstract: The present invention relates to a transparent polyimide film containing a polyimide and a phosphate ester. The content of the phosphate ester based on 100 parts by mass of the polyimide is 3 parts by mass or more, preferably 5 to 100 parts by mass. It is preferable to use a phosphate ester that has a high birefringence reduction effect and with which a decrease in the tensile modulus of the film is small. In production of the polyimide film, it is preferable to employ a method in which: a solvent-soluble polyimide resin and a phosphate ester are dissolved in an organic solvent exhibiting solubility with respect to the polyimide resin to prepare a polyimide solution; the polyimide solution is applied onto a substrate; and the organic solvent is removed.

公开(公告)号：US11572437B2

公开(公告)日：2023-02-07

申请号：US16619242

申请日：2018-06-01

Applicant: KANEKA CORPORATION

Inventor： Takashi Ando ,  Masahiro Miyamoto

IPC: C08G63/193 ,  C08K3/04 ,  C08K3/013 ,  C08J5/18 ,  C08K3/08 ,  C08K3/22 ,  C08K3/38 ,  C08K7/06 ,  C08L67/02

Abstract: A thermoplastic resin (A) including, in its main chain structure, a unit (i) having a biphenyl group, a unit (ii) having a substituent biphenyl group, a unit (iii) having a specific number of atoms in its main chain, and a unit (iv) having a specific number of atoms in its main chain provides a thermoplastic resin which has a low liquid crystal phase transition temperature and a low isotropic phase transition temperature, is highly thermally conductive, and can be processed by molding at a low melting temperature.

公开(公告)号：US20220411584A1

公开(公告)日：2022-12-29

申请号：US17622424

申请日：2020-06-22

Applicant: Kaneka Corporation

Inventor： Takashi Ando ,  Kohei Ogawa ,  Masahiro Miyamoto

IPC: C08G73/10 ,  C08K5/521 ,  C08J5/18

Abstract: The present invention relates to a transparent polyimide film containing a polyimide and a phosphate ester. The content of the phosphate ester based on 100 parts by mass of the polyimide is 3 parts by mass or more, preferably 5 to 100 parts by mass. It is preferable to use a phosphate ester that has a high birefringence reduction effect and with which a decrease in the tensile modulus of the film is small. In production of the polyimide film, it is preferable to employ a method in which: a solvent-soluble polyimide resin and a phosphate ester are dissolved in an organic solvent exhibiting solubility with respect to the polyimide resin to prepare a polyimide solution; the polyimide solution is applied onto a substrate; and the organic solvent is removed.

公开(公告)号：US20220282089A1

公开(公告)日：2022-09-08

申请号：US17751985

申请日：2022-05-24

Applicant: KANEKA CORPORATION

Inventor： Takashi Ando ,  Kohei Ogawa ,  Masahiro Miyamoto

IPC: C08L79/08 ,  C08L69/00 ,  C08L67/03

Abstract: A resin composition contains a polyimide resin and an ester-based resin. The ester-based resin is polycarbonate or polyarylate. The polyimide contains a structural unit represented by general formula (1). In general formula (1), X is a divalent organic group shown in group (I), and Y is a divalent group that contains one or more selected from the group consisting of a fluorine group, a trifluoromethyl group, a sulfonic group, a fluorene structure and an alicyclic structure. Each of R1 and R2 is a fluorine atom, an alkyl group having 1 to 20 carbon atoms, or a fluoroalkyl group having 1 to 20 carbon atoms, m is an integer of 1 to 4, and n is an integer of 0 to 4.

公开(公告)号：US20180298186A1

公开(公告)日：2018-10-18

申请号：US16016228

申请日：2018-06-22

Applicant: Kaneka Corporation

Inventor： Shusuke Yoshihara ,  Takashi Ando

IPC: C08L63/00 ,  C09K5/14 ,  C08L71/12 ,  C09J9/00 ,  C09J171/12 ,  H05K1/03 ,  H05K1/02

Abstract: A resin composition includes: a curable compound (α); a curing agent (β); a liquid crystal polymer (γ) that forms a liquid crystal phase at 190° C. or lower; and a filler (δ). A liquid crystal polymer composition includes: (I) a compound having two or more epoxy groups in the molecule; (II) a curing agent; (III) a liquid crystal polymer that forms a liquid crystal phase at 190° C. or lower; (IV) a thermal conductive filler; and (V) a solvent. A curable resin composition includes: (A) a thermoplastic resin; (B) a curable resin; (C) a curing agent; (D) an elastomer; and (E) an inorganic filler.