Implementing eFuse circuit with enhanced eFuse blow operation
    1.
    发明授权
    Implementing eFuse circuit with enhanced eFuse blow operation 失效
    实现eFuse电路,增强eFuse吹扫操作

    公开(公告)号:US08492207B2

    公开(公告)日:2013-07-23

    申请号:US13091259

    申请日:2011-04-21

    IPC分类号: H01L21/762

    摘要: A method and an eFuse circuit for implementing with enhanced eFuse blow operation without requiring a separate high current and high voltage supply to blow the eFuse, and a design structure on which the subject circuit resides are provided. The eFuse circuit includes an eFuse connected to a field effect transistor (FET) operatively controlled during a sense mode and a blow mode for sensing and blowing the eFuse. The eFuse circuit is placed over an independently voltage controlled silicon region. During a sense mode, the independently voltage controlled silicon region is grounded providing an increased threshold voltage of the FET. During a blow mode, the independently voltage controlled silicon region is charged to a voltage supply potential. The threshold voltage of the FET is reduced by the charged independently voltage controlled silicon region for providing enhanced FET blow function.

    摘要翻译: 一种用于在不需要单独的高电流和高电压来吹送eFuse的情况下实现增强的eFuse吹扫操作的方法和eFuse电路,并且提供了主题电路所在的设计结构。 eFuse电路包括连接到在感测模式期间可操作地控制的场效应晶体管(FET)的eFuse和用于感测和吹送eFuse的吹扫模式。 eFuse电路放置在独立的电压控制的硅​​区域上。 在感测模式期间,独立的受电压控制的硅​​区域被接地,从而提供FET增加的阈值电压。 在吹扫模式期间,独立的受控硅区域被充电到电压供应电位。 通过充电的独立电压控制的硅​​区域来降低FET的阈值电压,以提供增强的FET吹扫功能。

    INDEPENDENTLY VOLTAGE CONTROLLED VOLUME OF SILICON ON A SILICON ON INSULATOR CHIP
    3.
    发明申请
    INDEPENDENTLY VOLTAGE CONTROLLED VOLUME OF SILICON ON A SILICON ON INSULATOR CHIP 有权
    绝缘子芯片上硅的独立电压控制体积

    公开(公告)号:US20120267752A1

    公开(公告)日:2012-10-25

    申请号:US13091275

    申请日:2011-04-21

    IPC分类号: H01L29/06 H01L21/762

    摘要: A semiconductor chip has an independently voltage controlled silicon region that is a circuit element useful for controlling capacitor values of eDRAM trench capacitors and threshold voltages of field effect transistors overlying the independently voltage controlled silicon region. A bottom, or floor, of the independently voltage controlled silicon region is a deep implant of opposite doping to a doping of a substrate of the independently voltage controlled silicon region. A top, or ceiling, of the independently voltage controlled silicon region is a buried oxide implant in the substrate. Sides of the independently voltage controlled silicon region are deep trench isolation. Voltage of the independently voltage controlled silicon region is applied through a contact structure formed through the buried oxide.

    摘要翻译: 半导体芯片具有独立的电压控制硅区域,其是用于控制eDRAM沟槽电容器的电容值和覆盖独立电压控制的硅​​区域的场效应晶体管的阈值电压的电路元件。 独立电压控制的硅​​区域的底部或底部是与独立电压控制的硅​​区域的衬底的掺杂相反掺杂的深度注入。 独立电压控制的硅​​区域的顶部或天花板是衬底中的埋入氧化物植入物。 独立电压控制的硅​​区域的侧面是深沟槽隔离。 独立电压控制的硅​​区域的电压通过埋入氧化物形成的接触结构施加。

    IMPLEMENTING eFUSE CIRCUIT WITH ENHANCED eFUSE BLOW OPERATION
    7.
    发明申请
    IMPLEMENTING eFUSE CIRCUIT WITH ENHANCED eFUSE BLOW OPERATION 失效
    执行eFUSE电路与增强efuse吹扫操作

    公开(公告)号:US20120268195A1

    公开(公告)日:2012-10-25

    申请号:US13091259

    申请日:2011-04-21

    IPC分类号: H01H37/76 H01L21/76

    摘要: A method and an eFuse circuit for implementing with enhanced eFuse blow operation without requiring a separate high current and high voltage supply to blow the eFuse, and a design structure on which the subject circuit resides are provided. The eFuse circuit includes an eFuse connected to a field effect transistor (FET) operatively controlled during a sense mode and a blow mode for sensing and blowing the eFuse. The eFuse circuit is placed over an independently voltage controlled silicon region. During a sense mode, the independently voltage controlled silicon region is grounded providing an increased threshold voltage of the FET. During a blow mode, the independently voltage controlled silicon region is charged to a voltage supply potential. The threshold voltage of the FET is reduced by the charged independently voltage controlled silicon region for providing enhanced FET blow function.

    摘要翻译: 一种用于在不需要单独的高电流和高电压来吹送eFuse的情况下实现增强的eFuse吹扫操作的方法和eFuse电路,并且提供了主题电路所在的设计结构。 eFuse电路包括连接到在感测模式期间可操作地控制的场效应晶体管(FET)的eFuse和用于感测和吹送eFuse的吹扫模式。 eFuse电路放置在独立的电压控制的硅​​区域上。 在感测模式期间,独立的受电压控制的硅​​区域被接地,从而提供FET增加的阈值电压。 在吹扫模式期间,独立的受控硅区域被充电到电压供应电位。 通过充电的独立电压控制的硅​​区域来降低FET的阈值电压,以提供增强的FET吹扫功能。

    Independently voltage controlled volume of silicon on a silicon on insulator chip
    9.
    发明授权
    Independently voltage controlled volume of silicon on a silicon on insulator chip 有权
    独立的电压控制体积的硅绝缘体上的硅片

    公开(公告)号:US08816470B2

    公开(公告)日:2014-08-26

    申请号:US13091275

    申请日:2011-04-21

    IPC分类号: H01L29/06 H01L21/762

    摘要: A semiconductor chip has an independently voltage controlled silicon region that is a circuit element useful for controlling capacitor values of eDRAM trench capacitors and threshold voltages of field effect transistors overlying the independently voltage controlled silicon region. A bottom, or floor, of the independently voltage controlled silicon region is a deep implant of opposite doping to a doping of a substrate of the independently voltage controlled silicon region. A top, or ceiling, of the independently voltage controlled silicon region is a buried oxide implant in the substrate. Sides of the independently voltage controlled silicon region are deep trench isolation. Voltage of the independently voltage controlled silicon region is applied through a contact structure formed through the buried oxide.

    摘要翻译: 半导体芯片具有独立的电压控制硅区域,其是用于控制eDRAM沟槽电容器的电容值和覆盖独立电压控制的硅​​区域的场效应晶体管的阈值电压的电路元件。 独立电压控制的硅​​区域的底部或底部是与独立电压控制的硅​​区域的衬底的掺杂相反掺杂的深度注入。 独立电压控制的硅​​区域的顶部或天花板是衬底中的埋入氧化物植入物。 独立电压控制的硅​​区域的侧面是深沟槽隔离。 独立电压控制的硅​​区域的电压通过埋入氧化物形成的接触结构施加。