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公开(公告)号:US20090120680A1
公开(公告)日:2009-05-14
申请号:US12093436
申请日:2008-05-12
CPC分类号: H05K3/3478 , H01L21/4853 , H01L24/11 , H01L24/742 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/16225 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H05K3/3452 , H05K2201/0191 , H05K2203/041 , H05K2203/043 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要: A method of manufacturing a printed wiring board having at least one solder bump includes forming a solder resist layer on a conductor layer. The solder resist layer has at least one opening that exposes a connection pad of the conductor layer, and the at least one opening in the solder resist layer has a depth D, from the solder resist layer to the exposed connection pad, of from 3 μm to 18 μm. The method also includes loading a solder ball into each of the at least one opening in the solder resist layer, and forming a bump on the exposed connection pad by heating the solder ball to a reflow temperature.
摘要翻译: 制造具有至少一个焊料凸块的印刷电路板的方法包括在导体层上形成阻焊层。 阻焊层具有暴露导体层的连接焊盘的至少一个开口,并且阻焊层中的至少一个开口具有从3μm的阻焊层到暴露的连接焊盘的深度D 到18岁 该方法还包括将焊球加载到阻焊层中的至少一个开口中的每一个中,以及通过将焊球加热到回流温度在暴露的连接焊盘上形成凸块。