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39 条记录 (耗时 0.022 秒)

    Spectrometer module
    1.
    发明授权
    Spectrometer module 有权
    光谱仪模块

    公开(公告)号：US09285270B2

    公开(公告)日：2016-03-15

    申请号：US13637410

    申请日：2011-03-16

    申请人： Katsumi Shibayama ,  Takafumi Yokino

    发明人： Katsumi Shibayama ,  Takafumi Yokino

    IPC分类号： G01J3/28 ,  G01J3/02 ,  G01J3/18 ,  G01J3/36

    CPC分类号： G01J3/021 ,  G01J3/02 ,  G01J3/0202 ,  G01J3/0256 ,  G01J3/0262 ,  G01J3/0291 ,  G01J3/18 ,  G01J3/36

    摘要： A spectroscopic module 1 is provided with a spectroscopic unit 8 and a photodetector 9 in addition to a spectroscopic unit 7 and a photodetector 4 and thus can enhance its detection sensitivity for light in a wide wavelength range or different wavelength regions of light. A light-transmitting hole 4b is disposed between light detecting portions 4a, 9a, while a reflection unit 6 is provided so as to oppose a region R in a light-absorbing substrate 2, whereby the size can be kept from becoming larger. Ambient light La is absorbed by the region R in the substrate 2. Any part of the light La transmitted through the region R in the substrate 2 is reflected to the region R by the unit 6 formed so as to oppose the region R, whereby stray light can be inhibited from being caused by the incidence of the light La.

    摘要翻译： 分光模块1除了分光单元7和光电检测器4之外还设置有分光单元8和光电检测器9，因此可以提高其在宽波长范围或不同波长区域中的光的检测灵敏度。 在光检测部分4a，9a之间设置透光孔4b，同时设置反射单元6以与光吸收基板2中的区域R相对，从而可以防止尺寸变大。 环境光La被衬底2中的区域R吸收。通过衬底2中的区域R透射的光La的任何部分被形成为与区域R相对的单元6反射到区域R，由此杂散 可以防止光被光La的发生引起。

    Spectroscopy module
    3.
    发明授权
    Spectroscopy module 有权
    光谱模块

    公开(公告)号：US08045160B2

    公开(公告)日：2011-10-25

    申请号：US13086065

    申请日：2011-04-13

    申请人： Katsumi Shibayama ,  Takafumi Yokino ,  Tomofumi Suzuki ,  Helmut Teichmann ,  Dietmar Hiller ,  Ulrich Starker

    发明人： Katsumi Shibayama ,  Takafumi Yokino ,  Tomofumi Suzuki ,  Helmut Teichmann ,  Dietmar Hiller ,  Ulrich Starker

    IPC分类号： G01J3/02 ,  G01J3/18

    CPC分类号： G01J3/18 ,  G01J3/02 ,  G01J3/0205 ,  G01J3/0208 ,  G01J3/0237 ,  G01J3/0259 ,  G01J3/0291

    摘要： Alignment marks 12a, 12b, 12c, and 12d are formed on the flat plane 11a of the peripheral edge portion 11 formed integrally with the diffracting layer 8, and when the lens portion 7 is mounted onto the substrate 2, these alignment marks 12a, 12b, 12c and 12d are positioned to the substrate 2, thereby making exact alignment of the diffracting layer 8 with respect to the light detecting portion 4a of the light detecting element 4, for example, not by depending on a difference in curvature radius of the lens portion 7. In particular, the alignment marks 12a, 12b, 12c and 12d are formed on the flat plane 11a, thereby image recognition is given to exactly detect positions of the alignment marks 12a, 12b, 12c and 12d, thus making it possible to make exact alignment.

    摘要翻译： 对准标记12a，12b，12c和12d形成在与衍射层8一体形成的周缘部分11的平面11a上，并且当透镜部分7安装到基板2上时，这些对准标记12a，12b ，12c和12d位于基板2上，从而使衍射层8相对于光检测元件4的光检测部分4a精确对准，例如不依赖于透镜的曲率半径的差异 特别地，对准标记12a，12b，12c和12d形成在平面11a上，由此，图像识别被精确地检测对准标记12a，12b，12c和12d的位置，从而可以 准确对齐。

    Spectroscopic module
    4.
    发明授权
    Spectroscopic module 失效
    光谱模块

    公开(公告)号：US08045155B2

    公开(公告)日：2011-10-25

    申请号：US12377343

    申请日：2008-06-05

    申请人： Tomofumi Suzuki ,  Katsumi Shibayama ,  Takafumi Yokino ,  Masashi Ito ,  Helmut Teichmann ,  Dietmar Hiller ,  Ulrich Starker

    发明人： Tomofumi Suzuki ,  Katsumi Shibayama ,  Takafumi Yokino ,  Masashi Ito ,  Helmut Teichmann ,  Dietmar Hiller ,  Ulrich Starker

    IPC分类号： G01J3/26

    CPC分类号： G01J3/02 ,  G01J3/0208 ,  G01J3/0243 ,  G01J3/0259 ,  G01J3/04

    摘要： The spectroscopy module is provided with a body portion for transmitting light, a spectroscopic portion for dispersing light made incident from the front plane of the body portion into the body portion to reflect the light on the front plane, a light detecting element having a light detecting portion for detecting the light dispersed and reflected by the spectroscopic portion and electrically connected to a wiring formed on the front plane of the body portion by face-down bonding, and an underfill material filled in the body portion side of the light detecting element to transmit the light. The light detecting element is provided with a light-passing hole through which the light advancing into the spectroscopic portion passes, and a reservoir portion is formed on a rear plane of the body portion side in the light detecting element so as to enclose a light outgoing opening of the light-passing hole.

    摘要翻译： 光谱模块设置有用于透射光的主体部分，用于将从主体部分的前平面入射的光分散到主体部分中以将光反射到前平面上的光谱部分，具有光检测的光检测元件 用于检测由分光部分分散和反射的光并通过面朝下接合与形成在主体部分的前平面上的布线电连接的光;以及填充在光检测元件的主体部分侧的底部填充材料， 光。 光检测元件设置有通向分光部分的光通过的通光孔，并且在光检测元件中的主体部分侧的后平面上形成储存部分，以便包围光出射 打开通光孔。

    Optical Waveguide Chip And Method Of Manufacturing The Same
    5.
    发明申请
    Optical Waveguide Chip And Method Of Manufacturing The Same 有权
    光波导芯片及其制造方法

    公开(公告)号：US20080212919A1

    公开(公告)日：2008-09-04

    申请号：US11587143

    申请日：2005-04-21

    申请人： Takafumi Yokino ,  Katsumi Shibayama

    发明人： Takafumi Yokino ,  Katsumi Shibayama

    IPC分类号： G02B6/12 ,  B26D1/00

    CPC分类号： G02B6/30 ,  G02B6/13 ,  G02B2006/12147 ,  Y10T83/04

    摘要： The present invention relates to an optical waveguide chip, etc., having a structure for effectively avoiding or suppressing peeling of an optical waveguide layer in a process of cutting a wafer. The optical waveguide chip comprises a substrate having a main surface, and an optical waveguide layer formed on the main surface of the substrate. The optical waveguide layer comprises a cladding portion and a core portion that is disposed inside the cladding portion and that has a higher refractive index than the cladding portion, and at least one of side surfaces of the optical waveguide layer is positioned at a predetermined distance toward a center of the main surface from an edge of the main surface. This arrangement includes an arrangement having a thin film portion at a peripheral region that includes the edge of the main surface. In the case that the optical waveguide layer has the thin film portion at its periphery, the optical waveguide layer has a side surface that coincide with the side surface of the substrate including the edge of the main surface and a side surface that is separated by a predetermined distance from edge of the main surface. By this arrangement, when cutting a wafer into chip units, even if chipping occurs at an edge of the main surface of the substrate to be cut, peeling of the optical waveguide layer, formed on the substrate, is suppressed effectively.

    摘要翻译： 本发明涉及在切割晶片的过程中具有有效地避免或抑制光波导层的剥离的结构的光波导芯片等。 光波导芯片包括具有主表面的基板和形成在基板的主表面上的光波导层。 光波导层包括包层部分和芯部分，该芯部分设置在包层部分内部并且具有比包层部分更高的折射率，并且光波导层的至少一个侧表面位于预定距离处 主表面的中心从主表面的边缘。 这种布置包括在包括主表面的边缘的周边区域具有薄膜部分的布置。 在光波导层的周边具有薄膜部的情况下，光波导层具有与包括主面的边缘的基板的侧面重合的侧面和由 距离主表面的预定距离。 通过这种布置，即使在将晶片切割成芯片单元时，即使在要切割的基板的主表面的边缘处发生切屑，也有效地抑制了形成在基板上的光波导层的剥离。

    Spectroscopy module and manufacturing method therefor
    7.
    发明授权
    Spectroscopy module and manufacturing method therefor 有权
    光谱模块及其制造方法

    公开(公告)号：US09075193B2

    公开(公告)日：2015-07-07

    申请号：US13390527

    申请日：2010-08-11

    申请人： Katsumi Shibayama ,  Takafumi Yokino

    发明人： Katsumi Shibayama ,  Takafumi Yokino

    IPC分类号： G01J3/28 ,  G02B5/18 ,  G01J3/02 ,  G01J3/18

    CPC分类号： G01J3/18 ,  G01J3/02 ,  G01J3/0202 ,  G01J3/0208 ,  G01J3/021 ,  G01J3/0256 ,  G01J3/0259 ,  G01J3/2803 ,  G02B5/1814 ,  G02B5/1852 ,  G02B5/1861

    摘要： In a spectroscopic module 1, a flange 7 is formed integrally with a diffraction layer 6 along a periphery thereof so as to become thicker than the diffraction layer 6. As a consequence, at the time of releasing a master mold used for forming the diffraction layer 6 and flange 7, the diffraction layer 6 formed along a convex curved surface 3a of a main unit 3 can be prevented from peeling off from the curved surface 3a together with the master mold. A diffraction grating pattern 9 is formed so as to be eccentric with respect to the center of the diffraction layer 6 toward a predetermined side. Therefore, releasing the mold earlier from the opposite side of the diffraction layer 6 than the predetermined side thereof can prevent the diffraction layer 6 from peeling off and the diffraction grating pattern 9 from being damaged.

    摘要翻译： 在分光模块1中，凸缘7沿着其周边与衍射层6一体地形成为比衍射层6厚。因此，在释放用于形成衍射层的母模时， 如图6和法兰7所示，可以防止沿着主单元3的凸曲面3a形成的衍射层6与母模一起从弯曲表面3a剥离。 衍射光栅图案9形成为相对于衍射层6的中心偏向预定侧。 因此，从衍射层6的与其规定侧相反的一侧较早地剥离模具可以防止衍射层6剥离，衍射光栅图案9受损。

    Spectroscopic module
    8.
    发明授权
    Spectroscopic module 有权
    光谱模块

    公开(公告)号：US08045157B2

    公开(公告)日：2011-10-25

    申请号：US12377336

    申请日：2008-06-05

    申请人： Katsumi Shibayama ,  Helmut Teichmann ,  Takafumi Yokino ,  Tomofumi Suzuki ,  Dietmar Hiller ,  Ulrich Starker

    发明人： Katsumi Shibayama ,  Helmut Teichmann ,  Takafumi Yokino ,  Tomofumi Suzuki ,  Dietmar Hiller ,  Ulrich Starker

    IPC分类号： G01J3/28

    CPC分类号： G01J3/02 ,  G01J3/0202 ,  G01J3/0208 ,  G01J3/0256 ,  G01J3/0259 ,  G01J3/0262 ,  G01J3/18 ,  G01J3/2803

    摘要： Since a spectroscopic module (1) has a plate-shaped body section (2), the spectroscopic module can be reduced in size by reducing the thickness of the body section (2). Moreover, since the body section (2) is plate-shaped, the spectroscopic module (1) can be manufactured, for example, by using a wafer process. More specifically, by providing lens sections (3), diffraction layers (4), reflection layers (6) and light detecting elements (7) in a matrix form on a glass wafer which becomes many body sections (2) and dicing the glass wafer, many spectroscopic modules (1) can be manufactured. This enables easy mass production of spectroscopic modules (1).

    摘要翻译： 由于分光模块（1）具有板状主体部（2），所以可以通过减小主体部（2）的厚度来减小分光模块的尺寸。 此外，由于主体部（2）是板状的，所以可以例如通过使用晶片工艺来制造分光模块（1）。 更具体地说，通过在成为许多主体部分（2）的玻璃晶片上提供矩阵形式的透镜部分（3），衍射层（4），反射层（6）和光检测元件（7），并将玻璃晶片 ，可以制造许多光谱模块（1）。 这使得能够容易地批量生产光谱模块（1）。

    METHOD FOR MANUFACTURING SPECTRAL MODULE AND SPECTRAL MODULE
    9.
    发明申请
    METHOD FOR MANUFACTURING SPECTRAL MODULE AND SPECTRAL MODULE 审中-公开
    制造光谱模块和光谱模块的方法

    公开(公告)号：US20110157585A1

    公开(公告)日：2011-06-30

    申请号：US12992428

    申请日：2009-05-07

    申请人： Katsumi Shibayama ,  Takafumi Yokino ,  Takashi Kasahara ,  Masashi Ito ,  Anne Yoshida

    发明人： Katsumi Shibayama ,  Takafumi Yokino ,  Takashi Kasahara ,  Masashi Ito ,  Anne Yoshida

    IPC分类号： G01J3/28 ,  B32B37/02

    CPC分类号： G01J3/02 ,  G01J3/0208 ,  G01J3/0243 ,  G01J3/0256 ,  G01J3/0259 ,  G01J3/0286 ,  G01J3/0297 ,  G01J2003/1213 ,  G02B5/1814 ,  G02B7/025 ,  Y10T156/10

    摘要： In a method for manufacturing a spectral module 1, a photodetecting unit 10 constructed by bonding a photodetector 5 and a light transmitting plate 56 together is attached to a front face 2a of a substrate 2 by an optical resin agent 63. Here, a light transmitting hole 50 of the photodetector 5 is covered with a light transmitting plate 56, whereby the optical resin agent 63 is prevented from intruding into the light transmitting hole 50. When preparing the photodetecting unit 10, a semiconductor substrate 91 provided with a photodetecting section 5a and the light transmitting plate 56 are bonded together, and then the semiconductor substrate 91 is formed with the light transmitting hole 50, whereby matters which may cause refraction, scattering, and the like to occur can reliably be prevented from intruding into the light transmitting hole 50.

    摘要翻译： 在光谱模块1的制造方法中，通过将光电检测器5和透光板56结合在一起而构成的光检测单元10通过光学树脂剂63附着在基板2的前面2a上。这里，透光 光检测器5的孔50被透光板56覆盖，从而防止光学树脂剂63侵入透光孔50.制备光电检测单元10时，设置有受光部5a和 透光板56接合在一起，然后半导体基板91形成有透光孔50，从而可以可靠地防止可能引起折射，散射等的物质侵入透光孔50 。