Method for producing a PCD compact
    5.
    发明授权
    Method for producing a PCD compact 有权
    生产PCD压块的方法

    公开(公告)号:US08485284B2

    公开(公告)日:2013-07-16

    申请号:US12995370

    申请日:2009-06-03

    IPC分类号: E21B10/46 E21B10/567

    摘要: A method of producing a composite diamond compact comprising a polycrystalline diamond (PCD) compact bonded to a cemented carbide substrate is provided. The method includes the steps of: providing a PCD table, preferably a PCD table with diamond-to-diamond bonding and a porous microstructure in which the pores are empty of second phase material bringing together the PCD table and a cemented carbide substrate in the presence of a bonding agent to form an unbonded assembly; subjecting the unbonded assembly to an initial compaction at a pressure of at least 4.5 GPa and a temperature below the melting point of the bonding agent for a period of at least 150 seconds; and thereafter subjecting the unbonded assembly to a temperature above the melting point of the bonding agent and a pressure of at least 4.5 GPa for a time sufficient for the bonding agent to become molten and bond the PCD table to the substrate to form a composite diamond compact.

    摘要翻译: 提供了一种制造复合金刚石复合体的方法,其包括结合到硬质合金基底的多晶金刚石(PCD)紧固件。 该方法包括以下步骤:提供PCD表,优选具有金刚石 - 金刚石结合的PCD表和多孔微结构,其中孔隙为空的第二相材料,在存在的情况下将PCD台和硬质合金基底聚集在一起 的粘合剂以形成未结合的组件; 使未结合的组件在至少4.5GPa的压力和低于粘合剂的熔点的温度下进行至少150秒的初始压实; 然后使未结合的组件经受高于粘合剂熔点的温度和至少4.5GPa的压力,持续一段时间足以使粘合剂熔融并将PCD工作台结合到衬底上以形成复合金刚石致密体 。

    Method for Producing a PCD Compact
    6.
    发明申请
    Method for Producing a PCD Compact 有权
    生产PCD紧凑型的方法

    公开(公告)号:US20110072730A1

    公开(公告)日:2011-03-31

    申请号:US12995370

    申请日:2009-06-03

    IPC分类号: B24D11/00

    摘要: A method of producing a composite diamond compact comprising a polycrystalline diamond (PCD) compact bonded to a cemented carbide substrate is provided. The method includes the steps of: providing a PCD table, preferably a PCD table with diamond-to-diamond bonding and a porous microstructure in which the pores are empty of second phase material bringing together the PCD table and a cemented carbide substrate in the presence of a bonding agent to form an unbonded assembly; subjecting the unbonded assembly to an initial compaction at a pressure of at least 4.5 GPa and a temperature below the melting point of the bonding agent for a period of at least 150 seconds; and thereafter subjecting the unbonded assembly to a temperature above the melting point of the bonding agent and a pressure of at least 4.5 GPa for a time sufficient for the bonding agent to become molten and bond the PCD table to the substrate to form a composite diamond compact.

    摘要翻译: 提供了一种制造复合金刚石复合体的方法,其包括结合到硬质合金基底的多晶金刚石(PCD)紧固件。 该方法包括以下步骤:提供PCD表,优选具有金刚石 - 金刚石结合的PCD表和多孔微结构,其中孔隙为空的第二相材料,在存在的情况下将PCD台和硬质合金基底聚集在一起 的粘合剂以形成未结合的组件; 使未结合的组件在至少4.5GPa的压力和低于粘合剂的熔点的温度下进行至少150秒的初始压实; 然后使未结合的组件经受高于粘合剂熔点的温度和至少4.5GPa的压力,持续一段时间足以使粘合剂熔融并将PCD工作台结合到衬底上以形成复合金刚石致密体 。