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公开(公告)号：US07485686B2
公开(公告)日：2009-02-03
申请号：US10901230
申请日：2004-07-29
CPC分类号： C08F10/00 , C08F4/65908 , C08F4/65912 , C08F4/65925 , C08F110/02 , C08F110/06 , C08F210/06 , Y10S526/943 , C08F4/65922 , C08F4/65927 , C08F2500/12 , C08F210/16
摘要： A large-scale and efficient industrialization of olefin polymerization by metallocene catalysts is realized by, in olefin polymerization by metallocene-based catalysts, increasing catalytic activity and polymerization efficiency to sufficiently bring out the performances of the metallocene catalysts and maintain a stable polymerization reaction. The amount of a halogen-containing compound is controlled so that the gram-atomic amount ratio to a transition metal of a halogen atom in a halogen-containing compound in solvents and materials other than a halogen atom in a catalyst component is 0.8 or less, in manufacturing plants of commercial level in an olefin polymerization by a metallocene catalyst.
摘要翻译： 通过茂金属催化剂进行烯烃聚合的大规模高效率工业化是通过在茂金属类催化剂的烯烃聚合中提高催化活性和聚合效率，充分发挥茂金属催化剂的性能并保持稳定的聚合反应而实现的。 控制含卤素化合物的量，使得在含卤素化合物中的卤原子的过渡金属与催化剂组分中除卤素原子之外的溶剂和材料中的克原子量比为0.8以下， 在通过茂金属催化剂的烯烃聚合中的商业级制造厂。
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公开(公告)号：US20050032993A1
公开(公告)日：2005-02-10
申请号：US10901230
申请日：2004-07-29
IPC分类号： C08F4/60 , C08F4/659 , C08F4/6592 , C08F10/00 , C08F110/02 , C08F110/06 , C08F210/06 , C08F4/44
CPC分类号： C08F10/00 , C08F4/65908 , C08F4/65912 , C08F4/65925 , C08F110/02 , C08F110/06 , C08F210/06 , Y10S526/943 , C08F4/65922 , C08F4/65927 , C08F2500/12 , C08F210/16
摘要： A large-scale and efficient industrialization of olefin polymerization by metallocene catalysts is realized by, in olefin polymerization by metallocene-based catalysts, increasing catalytic activity and polymerization efficiency to sufficiently bring out the performances of the metallocene catalysts and maintain a stable polymerization reaction. The amount of a halogen-containing compound is controlled so that the gram-atomic amount ratio to a transition metal of a halogen atom in a halogen-containing compound in solvents and materials other than a halogen atom in a catalyst component is 0.8 or less, in manufacturing plants of commercial level in an olefin polymerization by a metallocene catalyst.
摘要翻译： 通过茂金属催化剂进行烯烃聚合的大规模高效率工业化是通过在茂金属类催化剂的烯烃聚合中提高催化活性和聚合效率，充分发挥茂金属催化剂的性能并保持稳定的聚合反应而实现的。 控制含卤素化合物的量，使得在含卤素化合物中的卤原子的过渡金属与催化剂组分中除卤素原子之外的溶剂和材料中的克原子量比为0.8以下， 在通过茂金属催化剂的烯烃聚合中的商业级制造厂。
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公开(公告)号：US6016599A
公开(公告)日：2000-01-25
申请号：US875348
申请日：1997-11-25
申请人： Takeshi Morita , Yasuhiro Kashiwagi
发明人： Takeshi Morita , Yasuhiro Kashiwagi
CPC分类号： H05K13/08 , H05K13/0015 , Y10T29/49131 , Y10T29/53087 , Y10T29/53178 , Y10T29/53261
摘要： An electronic components mounting machine comprising an actuator(7), whereby electronic components are mounted on a substrate, a camera(5) whereby coordinates of recognition marks formed on the substrate at four places at least, are detected, a controller(6) whereby actuator(7) is controlled, a mounting data table(9) wherein information on mounting coordinates and mounting angles of electronic components to be mounted is stored, and a correction data table(10) wherein information on correction values to be applied to the mounting coordinates and mounting angles in reference to the substrate, on which the electronic components are mounted, is stored, and characterized in that the correction data table(10) stores information on correction values for each respective cell, which is formed by dividing the substrate into a plurality of small sections according to a specified rule in reference to the coordinates of recognition marks detected by the camera(5), thus enabling to mount each respective electronic component in accordance with the information on the mounting coordinates and mounting angles stored in the mounting data table(9) after the information is corrected according to the information on correction values stored in the correction data table(10) for each respective cell, where a corresponding electronic component is mounted.
摘要翻译： PCT No.PCT / JP96 / 03412 Sec。 371日期：1997年11月25日 102（e）1997年11月25日日期PCT 1996年11月21日PCT PCT。 公开号WO97 / 20456 日期：1997年5月6日电子元件安装机包括致动器（7），其中电子部件安装在基板上，照相机（5）至少检测在四个位置形成在基板上的识别标记的坐标，控制器 （6），其中控制致动器（7），其中存储有关要安装的电子部件的安装坐标和安装角度的信息的安装数据表（9），以及校正数据表（10），其中关于校正值的信息为 应用于相对于其上安装有电子部件的基板的安装坐标和安装角度，并且其特征在于，校正数据表（10）存储关于每个相应单元的校正值的信息，每个单元由 根据照相机（5）检测到的识别标记的坐标，根据规定将基板分割为多个小部分，从而能够 根据存储在校正数据表（10）中的关于校正数据表（10）中的每个相应的校正值的信息，根据关于存储在安装数据表（9）中的安装坐标和安装角度的信息，安装每个相应的电子部件 其中安装相应的电子部件。
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公开(公告)号：US5329692A
公开(公告)日：1994-07-19
申请号：US796177
申请日：1991-11-22
申请人： Yasuhiro Kashiwagi
发明人： Yasuhiro Kashiwagi
CPC分类号： H05K13/0452 , Y10T29/53178 , Y10T29/53191 , Y10T29/53261
摘要： In an of electronic components mounting apparatus pick-and-place heads are rotated for indexing along a rotary head to pick up electronic components of an electronic components feeding device and the components are mounted on a circuit board, which is positioned on an X-Y table. A moving base is moved in lateral direction, and the components placed on feeders are supplied to the pick-and-place heads. The moving base is divided into a feeding area and retreat areas, and accommodating areas for accommodating tables are provided near the retreat areas to move the tables reciprocatively between the retreat areas and the feeding areas. The tables hindering this movement are accommodated in the accommodating areas. Therefore, only a desired table is positioned in the feeding area. By moving this table at high speed, the electronic components can be supplied to the pick-and-place heads. When there is no more electronic component on a feeder, the feeder can be exchanged in the accommodating area.
摘要翻译： 在电子部件安装装置中，拾取头旋转以沿着旋转头进行分度以拾取电子部件供给装置的电子部件，并且部件安装在位于X-Y台上的电路板上。 移动基座沿横向移动，并且放置在馈线上的部件被提供给拾放头。 移动基座分为进食区域和后退区域，并且在退避区域附近设置用于容纳台的容纳区域，以在退避区域和供给区域之间往复移动台面。 阻碍这种运动的桌子容纳在容纳区域中。 因此，只有所需的工作台位于进料区域。 通过高速移动桌子，电子元件可以提供给拾取头。 当馈线上没有更多的电子元件时，可以在收纳区域中更换馈线。
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公开(公告)号：US06935019B2
公开(公告)日：2005-08-30
申请号：US10455549
申请日：2003-06-06
CPC分类号： H05K13/0409 , Y10T29/49117 , Y10T29/4913 , Y10T29/49131 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191
摘要： For implementing a method of mounting electronic components, and an apparatus therefor, which has a much reduced tact time, the nozzles 3a, 3b, 3c, 3d, 3e and 3f are kept in holes 5 provided in a straight line row in nozzle stocker 4 in the order of use sequence. When the type of electronic components to be mounted on a circuit board changes, transfer head 1 has to go to a place above the nozzle stocker 4 to replace the nozzle. In the invented mounting method, and mounting apparatus, the transfer head 1 is required to move only to a place above the next nozzle 3b after returning the used nozzle 3a to a hole 5. Thus the stroke L of transfer head 1 needed for the nozzle exchange is significantly reduced, and the nozzle may be replaced within a short time.
摘要翻译： 为了实现一种安装电子部件的方法及其装置，其节省时间大大减少，喷嘴3a，3b，3c，3d，3e和3f保持在设置在直线上的孔5中 喷嘴贮存器4中的排列按使用顺序排列。 当要安装在电路板上的电子部件的类型发生变化时，转印头1必须到达喷嘴储存器4上方的位置以更换喷嘴。 在本发明的安装方法和安装装置中，在将使用过的喷嘴3a返回到孔5之后，转印头1仅需要移动到下一个喷嘴3b上方的位置。 因此，喷嘴交换所需的传送头1的冲程L显着减少，并且可以在短时间内更换喷嘴。
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公开(公告)号：US06729017B1
公开(公告)日：2004-05-04
申请号：US09606834
申请日：2000-06-29
申请人： Yasuhiro Kashiwagi , Kazuhide Nagao
发明人： Yasuhiro Kashiwagi , Kazuhide Nagao
IPC分类号： B23P1900
CPC分类号： H05K13/08 , H05K13/0452 , Y10T29/4913 , Y10T29/53178
摘要： A component mounter has two or more feeder carriages and two or more mounting heads corresponding to the feeder carriages. The mounting heads pick up components from each feeder carriage. A transfer device is able to pass components requiring transfer between the mounting heads. The transfer of components enables the mounter to be used efficiently by transferring components to a different mounting head when the operation of one of the mounting heads stops.
摘要翻译： 组件安装器具有两个或更多个进料器托架和对应于进料器托架的两个或更多个安装头。 安装头从每个进料器托架拾取部件。 传送装置能够通过需要在安装头之间传递的部件。 当其中一个安装头的操作停止时，组件的传送使得能够有效地使用安装器，将组件传送到不同的安装头。
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公开(公告)号：US06204349B1
公开(公告)日：2001-03-20
申请号：US08668234
申请日：1996-06-21
申请人： Yoshinao Shinohara , Yasuhisa Mizuno , Eiji Tanaka , Yasuhiro Kashiwagi , Miki Suzaki , Koshi Yokoyama
发明人： Yoshinao Shinohara , Yasuhisa Mizuno , Eiji Tanaka , Yasuhiro Kashiwagi , Miki Suzaki , Koshi Yokoyama
IPC分类号： C08F11002
CPC分类号： C08F10/02 , C08F110/02 , C08F210/16 , C08F4/6555 , C08F2500/12 , C08F2500/07 , C08F2500/13 , C08F210/08
摘要： A pipe made of a polyethylene resin which is a linear polyethylene having the following physical properties (1) to (4): (1) a melt flow rate of 0.02 to 0.2 g/10 min, (2) a flow ratio of 50 or more, (3) a density of 0.945 to 0.960 g/cm3, and (4) a relaxation parameter H, represented by the following equation (I), of 2.00×10−8 dyn/cm2 or less: H = - E ( 10 3 ) Log E ( 10 3 ) - Log E ( 10 0 ) Log 10 3 - Log 10 0 ( I ) wherein E(&tgr;) represents a relaxation modulus at time &tgr;.
摘要翻译： （1）〜（4）：（1）熔体流动速率为0.02〜0.2g / 10分钟，（2）流动比为50或 （3）密度为0.945〜0.960g / cm3，（4）由下式（I）表示的弛豫参数H：2.00×10 -8 dyn / cm 2以下：其中E（＆Tgr） 表示时间tgr的松弛模量。
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公开(公告)号：US06342916B1
公开(公告)日：2002-01-29
申请号：US09252938
申请日：1999-02-19
申请人： Yasuhiro Kashiwagi , Kazuhide Nagao , Jun Yamauchi
发明人： Yasuhiro Kashiwagi , Kazuhide Nagao , Jun Yamauchi
IPC分类号： H04N718
CPC分类号： H05K13/041 , H05K13/0452 , H05K13/0812
摘要： Trays within a tray feeder provided with electronic components requiring a higher accuracy of mounting position such as QFPs, etc. are collectively placed at one side of a recognition device equipped with a line sensor. A transfer head picks up an electronic component in the tray and discerns a position of the electronic component by moving over the line sensor in one and the same fixed direction at all the time. This scanning direction is the same as a direction of calibration of a nozzle of the transfer head. Accordingly, a detecting error in the position of electronic component caused by the scanning direction is eliminated and the electronic component can be mounted with a high positional accuracy on a substrate.
摘要翻译： 具有需要更高精度的安装位置的诸如QFP等的电子部件的托盘供给器中的托盘被集中放置在配备有线传感器的识别装置的一侧。 传送头拾取托盘中的电子部件，并通过一直沿同一固定方向移动线传感器，辨别电子部件的位置。 该扫描方向与转印头的喷嘴的校准方向相同。 因此，消除了由扫描方向引起的电子部件的位置的检测误差，并且可以在基板上以高位置精度安装电子部件。
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公开(公告)号：US5579572A
公开(公告)日：1996-12-03
申请号：US375781
申请日：1995-01-20
CPC分类号： H05K13/0452 , Y10S29/044 , Y10T29/49137 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： A mounting apparatus mounts electronic parts on a substrate. The mounting apparatus includes an electronic part feeder having a moving table which moves along a moving path. The moving table moves a part cassette accommodating electronic parts to a pick up station. A transferring and mounting unit having a transferring and mounting head is also provided to move between the pick up station and the mounting station to retrieve the electronic part from a part pick up port of the part cassette at the pick up station. The transferring and mounting head has a nozzle for picking up an electronic part. The transferring and mounting head rotates the nozzle along a circular path. The moving path and the circular path intersect at two points at the pick up station. The pick up port of the part cassette is positioned at one of the intersecting points.
摘要翻译： 安装装置将电子部件安装在基板上。 安装装置包括具有沿着移动路径移动的移动台的电子部件供给器。 移动台将容纳电子部件的零件盒移动到拾取站。 还提供具有传送和安装头的传送和安装单元，以在拾取站和安装站之间移动，以从拾取站的部件盒的部件拾取端口检索电子部件。 传送和安装头具有用于拾取电子部件的喷嘴。 传送和安装头沿着圆形路径旋转喷嘴。 移动路径和圆形路径在拾取站两点相交。 部件盒的拾取端口位于交点之一处。
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公开(公告)号：US5271146A
公开(公告)日：1993-12-21
申请号：US946070
申请日：1992-09-18
申请人： Yasuhiro Kashiwagi
发明人： Yasuhiro Kashiwagi
CPC分类号： H05K13/023 , B23P19/001 , Y10S83/942 , Y10T29/49121 , Y10T29/515
摘要： An apparatus for supplying an electronic component to a mounting head of an electronic component mounting machine in such a manner that a lead guard interconnecting the front ends of leads of the electronic component is separated from a body of the electronic component before the electronic component is picked up by the mounting head. The apparatus includes a lower mold movable between a receiving position in which an electronic component having a lead guard is received on a die on the lower mold, a punching position in which the lead guard is separated from the body of the electronic component by a punch cooperating with the die and a picking-up position in which the electronic component devoid of the lead guard is picked up from the die. The electronic component supplied from a chute to a component rest is delivered by a transfer unit to the die while at rest in the receiving position. The transfer unit may include a vacuum nozzle for releasably holding the electronic component. The lower mold is moved preferably by a motor-driven ball screw.
摘要翻译： 一种用于将电子部件供应到电子部件安装机的安装头的装置，使得在电子部件拾取之前将电子部件的引线的前端与电子部件的主体相互分离的方式 由安装头。 该装置包括可在接收位置之间移动的下模具，其中具有导线罩的电子部件容纳在下模具上的模具上;冲压位置，其中导向罩通过冲头与电子部件的主体分离 与模具配合，并且从模具中拾取没有引线防护件的电子部件的拾取位置。 从滑槽供给到零部件的电子部件在转移单元在接收位置处于静止状态的同时被传送到模具。 传送单元可以包括用于可释放地保持电子部件的真空喷嘴。 下模优选地由电动滚珠丝杠移动。
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