摘要:
A substrate processing apparatus comprises an indexer block, an edge-cleaning processing block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning/drying processing block and an interface block. An exposure device is arranged adjacent to the interface block of the substrate processing apparatus. In the exposure device, exposure processing is applied to a substrate by a liquid immersion method. In the edge-cleaning processing group in the edge-cleaning processing block, an edge of the substrate before exposure processing is cleaned.
摘要:
A substrate processing apparatus comprises an indexer block, an edge-cleaning processing block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning/drying processing block and an interface block. An exposure device is arranged adjacent to the interface block of the substrate processing apparatus. In the exposure device, exposure processing is applied to a substrate by a liquid immersion method. In the edge-cleaning processing group in the edge-cleaning processing block, an edge of the substrate before exposure processing is cleaned.
摘要:
A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to an interface block. The interface block comprises a drying processing group including two drying processing units and an interface transport mechanism. After a substrate is subjected to exposure processing by the exposure device, the substrate is transported to the drying processing units in the drying processing group by the interface transport mechanism, where the substrate is subjected to cleaning and drying processings.
摘要:
The transporting process from cleaning and drying processing of a substrate in a cleaning/drying processing unit in a cleaning/drying processing group to post-exposure bake (PEB) of the substrate in a thermal processing group for post-exposure bake in a cleaning/drying processing block is described below. First, after the substrate after exposure processing is subjected to the cleaning and drying processing in the cleaning/drying processing group, a sixth central robot takes out the substrate from the cleaning/drying processing group and carries that substrate into the thermal processing group for post-exposure bake in the cleaning/drying processing block.
摘要:
The transporting process from cleaning and drying processing of a substrate in a cleaning/drying processing unit in a cleaning/drying processing group to post-exposure bake (PEB) of the substrate in a thermal processing group for post-exposure bake in a cleaning/drying processing block is described below. First, after the substrate after exposure processing is subjected to the cleaning and drying processing in the cleaning/drying processing group, a sixth central robot takes out the substrate from the cleaning/drying processing group and carries that substrate into the thermal processing group for post-exposure bake in the cleaning/drying processing block.
摘要:
A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to an interface block. The interface block comprises a drying processing group including two drying processing units and an interface transport mechanism. After a substrate is subjected to exposure processing by the exposure device, the substrate is transported to the drying processing units in the drying processing group by the interface transport mechanism, where the substrate is subjected to cleaning and drying processings.
摘要:
Immediately before or immediately after an alignment process for adjusting an exposure position of a pattern image in an exposure unit compatible with immersion exposure, a dummy substrate for use in the alignment process is transported from the exposure unit to a substrate processing apparatus. In the substrate processing apparatus, a cleaning processing unit cleans and dries the received dummy substrate. The cleaned dummy substrate is transported from the substrate processing apparatus back to the exposure unit. The use of the clean dummy substrate for the execution of the alignment process in the exposure unit reduces contamination of mechanisms within the exposure unit, such as a substrate stage. When the dummy substrate is water-repellent, the cleaning in the substrate processing apparatus restores the water repellency of the dummy substrate.
摘要:
A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to an interface block. The interface block comprises a drying processing group including two drying processing units and an interface transport mechanism. After a substrate is subjected to exposure processing by the exposure device, the substrate is transported to the drying processing units in the drying processing group by the interface transport mechanism, where the substrate is subjected to cleaning and drying processings.
摘要:
A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning/drying processing block, and an interface block. An exposure device is arranged adjacent to the interface block in the substrate processing apparatus. The exposure device subjects a substrate to exposure processing by means of an immersion method. In the edge cleaning unit in the cleaning/drying processing block, a brush abuts against an end of the rotating substrate, so that the edge of the substrate before the exposure processing is cleaned. At this time, the position where the substrate is cleaned is corrected.
摘要:
A substrate processing apparatus comprises an interface block. An exposure device is arranged adjacent to the interface block. The interface block includes first and second cleaning/drying processing units. A substrate W is subjected to cleaning and drying processing before exposure processing in the first cleaning/drying processing unit, while being subjected to cleaning and drying processing after the exposure processing in the second cleaning/drying processing unit.