利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

40 条记录 (耗时 0.028 秒)

    SUBSTRATE PROCESSING APPARATUS
    2.
    发明申请
    SUBSTRATE PROCESSING APPARATUS 有权
    基板加工设备

    公开(公告)号：US20100239986A1

    公开(公告)日：2010-09-23

    申请号：US12813251

    申请日：2010-06-10

    申请人： Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Shuichi Yasuda

    发明人： Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Shuichi Yasuda

    IPC分类号： G03F7/16 ,  B05D3/02

    CPC分类号： G03F7/70991 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67178

    摘要： The transporting process from cleaning and drying processing of a substrate in a cleaning/drying processing unit in a cleaning/drying processing group to post-exposure bake (PEB) of the substrate in a thermal processing group for post-exposure bake in a cleaning/drying processing block is described below. First, after the substrate after exposure processing is subjected to the cleaning and drying processing in the cleaning/drying processing group, a sixth central robot takes out the substrate from the cleaning/drying processing group and carries that substrate into the thermal processing group for post-exposure bake in the cleaning/drying processing block.

    摘要翻译： 在清洁/干燥处理组中的清洁/干燥处理单元中的基板的清洁和干燥处理到在热处理组中的曝光后烘烤（PEB）的后处理组中的曝光后烘烤处理的传送过程， 干燥处理块如下所述。 首先，在清洗/干燥处理组中对曝光处理后的基板进行清洗干燥处理后，第六中央机器人从清洗/干燥处理组中取出基板，将该基板搬送到热处理组中 - 在清洁/干燥处理块中进行曝光烘烤。

    Substrate processing method
    3.
    发明授权
    Substrate processing method 有权
    基板加工方法

    公开(公告)号：US08540824B2

    公开(公告)日：2013-09-24

    申请号：US12813251

    申请日：2010-06-10

    申请人： Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Shuichi Yasuda

    发明人： Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Shuichi Yasuda

    IPC分类号： B08B3/00 ,  H01L21/31 ,  G03F7/00 ,  G03F1/00

    CPC分类号： G03F7/70991 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67178

    摘要： The transporting process from cleaning and drying processing of a substrate in a cleaning/drying processing unit in a cleaning/drying processing group to post-exposure bake (PEB) of the substrate in a thermal processing group for post-exposure bake in a cleaning/drying processing block is described below. First, after the substrate after exposure processing is subjected to the cleaning and drying processing in the cleaning/drying processing group, a sixth central robot takes out the substrate from the cleaning/drying processing group and carries that substrate into the thermal processing group for post-exposure bake in the cleaning/drying processing block.

    摘要翻译： 在清洁/干燥处理组中的清洁/干燥处理单元中的基板的清洁和干燥处理到在热处理组中的曝光后烘烤（PEB）的后处理组中的曝光后烘烤处理的传送过程， 干燥处理块如下所述。 首先，在清洗/干燥处理组中对曝光处理后的基板进行清洗干燥处理后，第六中央机器人从清洗/干燥处理组中取出基板，将该基板搬送到热处理组中 - 在清洁/干燥处理块中进行曝光烘烤。

    METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING APPARATUS
    5.
    发明申请
    METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING APPARATUS 审中-公开
    基板加工方法，基板加工系统及基板加工设备

    公开(公告)号：US20070147832A1

    公开(公告)日：2007-06-28

    申请号：US11615513

    申请日：2006-12-22

    申请人： Kazuhito Shigemori ,  Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Shuichi Yasuda

    发明人： Kazuhito Shigemori ,  Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Shuichi Yasuda

    IPC分类号： G03D5/00

    CPC分类号： H01L21/67178 ,  H01L21/67173 ,  H01L21/67225 ,  H01L21/67276 ,  H01L21/67742 ,  H01L21/67748

    摘要： Immediately before or immediately after an alignment process for adjusting an exposure position of a pattern image in an exposure unit compatible with immersion exposure, a dummy substrate for use in the alignment process is transported from the exposure unit to a substrate processing apparatus. In the substrate processing apparatus, a cleaning processing unit cleans and dries the received dummy substrate. The cleaned dummy substrate is transported from the substrate processing apparatus back to the exposure unit. The use of the clean dummy substrate for the execution of the alignment process in the exposure unit reduces contamination of mechanisms within the exposure unit, such as a substrate stage. When the dummy substrate is water-repellent, the cleaning in the substrate processing apparatus restores the water repellency of the dummy substrate.

    摘要翻译： 在用于调整与浸没曝光相容的曝光单元中的图案图像的曝光位置的对准处理之前或之后，将用于对准处理的伪基板从曝光单元传送到基板处理装置。 在基板处理装置中，清洗处理部对所接收的虚设基板进行清洗干燥。 清洁的虚设基板从基板处理装置输送回曝光单元。 用于执行曝光单元中的对准处理的干净的虚设基板的使用减少了曝光单元内诸如基板台之间的机构的污染。 当虚设基板为憎水性时，基板处理装置的清洗恢复虚设基板的防水性。

    SUBSTRATE PROCESSING APPARATUS
    8.
    发明申请
    SUBSTRATE PROCESSING APPARATUS 有权
    基板加工设备

    公开(公告)号：US20100285225A1

    公开(公告)日：2010-11-11

    申请号：US12842485

    申请日：2010-07-23

    申请人： Koji Kaneyama ,  Kazuhito Shigemori ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Shuichi Yasuda

    发明人： Koji Kaneyama ,  Kazuhito Shigemori ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Shuichi Yasuda

    IPC分类号： B05D3/04

    CPC分类号： H01L21/67051 ,  H01L21/67225

    摘要： A substrate processing apparatus comprises an interface block. An exposure device is arranged adjacent to the interface block. The interface block includes first and second cleaning/drying processing units. A substrate W is subjected to cleaning and drying processing before exposure processing in the first cleaning/drying processing unit, while being subjected to cleaning and drying processing after the exposure processing in the second cleaning/drying processing unit.

    摘要翻译： 基板处理装置包括接口块。 曝光装置设置在接口块附近。 界面块包括第一和第二清洁/干燥处理单元。 在第二清洗/干燥处理单元中进行曝光处理之后进行清洗和干燥处理之后，在第一清洗/干燥处理单元中对基板W进行曝光处理之前的清洗和干燥处理。

    SUBSTRATE PROCESSING APPARATUS
    10.
    发明申请
    SUBSTRATE PROCESSING APPARATUS 审中-公开
    基板加工设备

    公开(公告)号：US20100136257A1

    公开(公告)日：2010-06-03

    申请号：US12698862

    申请日：2010-02-02

    申请人： Shuichi Yasuda ,  Masashi Kanaoka ,  Koji Kaneyama ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Toru Asano ,  Yukio Toriyama ,  Takashi Taguchi ,  Tsuyoshi Mitsuhashi ,  Tsuyoshi Okumura

    发明人： Shuichi Yasuda ,  Masashi Kanaoka ,  Koji Kaneyama ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Toru Asano ,  Yukio Toriyama ,  Takashi Taguchi ,  Tsuyoshi Mitsuhashi ,  Tsuyoshi Okumura

    IPC分类号： B05D3/06

    CPC分类号： G03F7/30 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67178 ,  H01L21/67225

    摘要： A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes forming a photosensitive film on the substrate by said first processing unit before exposure processing by said exposure device and applying washing processing to the substrate by supplying a washing liquid to the substrate in said second processing unit after the formation of said photosensitive film and before the exposure processing. The method also includes applying drying processing to the substrate in said second processing unit after the washing processing by said second processing unit and before the exposure processing and applying development processing to the substrate by said third processing unit after the exposure processing. Applying the drying processing to the substrate includes the step of supplying an inert gas onto the substrate, to which the washing liquid is supplied.

    摘要翻译： 一种在与曝光装置相邻并且包括第一，第二和第三处理单元的基板处理装置中处理基板的方法，包括在所述曝光装置的曝光处理之前由所述第一处理单元在所述基板上形成感光膜，以及 在形成所述感光膜之后并且在所述曝光处理之前，通过在所述第二处理单元中向所述基板供应洗涤液体来向所述基板施加洗涤处理。 该方法还包括在所述第二处理单元的洗涤处理之后并且在曝光处理之前对所述第二处理单元中的基板进行干燥处理，并且在曝光处理之后，通过所述第三处理单元对基板进行显影处理。 将干燥处理应用于基板包括向供给洗涤液的基板供给惰性气体的工序。